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公开(公告)号：US20210312965A1
公开(公告)日：2021-10-07
申请号：US17352658
申请日：2021-06-21
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Bo-Jhih Shen , Kuang-I Liu , Joung-Wei Liou , Jinn-Kwei Liang , Yi-Wei Chiu , Chin-Hsing Lin , Li-Te Hsu , Han-Ting Tsai , Cheng-Yi Wu , Shih-Ho Lin
Abstract: A semiconductor device and a method of forming the same are provided. The method includes forming a bottom electrode layer over a substrate. A magnetic tunnel junction (MTJ) layers are formed over the bottom electrode layer. A top electrode layer is formed over the MTJ layers. The top electrode layer is patterned. After patterning the top electrode layer, one or more process cycles are performed on the MTJ layers and the bottom electrode layer. A patterned top electrode layer, patterned MTJ layers and a patterned bottom electrode layer form MTJ structures. Each of the one or more process cycles includes performing an etching process on the MTJ layers and the bottom electrode layer for a first duration and performing a magnetic treatment on the MTJ layers and the bottom electrode layer for a second duration.
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公开(公告)号：US10170343B1
公开(公告)日：2019-01-01
申请号：US15638463
申请日：2017-06-30
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yu-Chen Wei , Chun-Jui Chu , Chun-Chieh Chan , Jen-Chieh Lai , Shih-Ho Lin
IPC: H01L21/67 , B08B1/04 , B24B37/08 , B24B37/04 , H01L21/321 , H01L21/306
Abstract: Apparatuses and methods for performing a post-CMP cleaning are provided. The apparatus includes a chamber configured to receive a wafer in need of having CMP residue removed. The apparatus also includes a spray unit configured to apply a first cleaning solution to at least one surface of the wafer. The apparatus further includes a brush cleaner configured to scrub the at least one surface of the wafer. In addition, the apparatus includes at least one inner tank disposed in the chamber for storing a second cleaning solution that is used to clean the brush cleaner.
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