公开(公告)号：US11239092B2

公开(公告)日：2022-02-01

申请号：US16858820

申请日：2020-04-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Chen Wei ,  Chun-Chieh Chan ,  Chun-Jui Chu ,  Jen-Chieh Lai ,  Shih-Ho Lin

IPC: H01L21/321 ,  H01L21/02 ,  H01L21/302 ,  H01L21/768 ,  H01L21/3213 ,  H01L21/67 ,  H01L21/28

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first layer over a substrate. The first layer is made of a semiconductor material. The method includes forming a stop layer over the first layer. The method includes forming a second layer over the stop layer. The second layer is in direct contact with the stop layer. The method includes removing the second layer. The method includes performing an etching process to remove the stop layer and an upper portion of the first layer. The method includes performing a first planarization process over the first layer.

公开(公告)号：US11292101B2

公开(公告)日：2022-04-05

申请号：US15904774

申请日：2018-02-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Chen Wei ,  Jheng-Si Su ,  Shih-Ho Lin ,  Jen-Chieh Lai ,  Chun-Chieh Chan

IPC: B24B49/18 ,  B24B49/16 ,  B24B49/10 ,  B24B37/005 ,  B24B37/32 ,  B24B53/017 ,  B24B37/20 ,  B24B37/04 ,  H01L21/321 ,  B24B53/00

Abstract: A chemical mechanical polishing apparatus is provided. The chemical mechanical polishing apparatus includes a polishing pad, a pad conditioner, a measurement tool, and a controller. The polishing pad is provided in a processing chamber for polishing a wafer placed on the polishing surface of the polishing pad. The pad conditioner is configured to condition the polishing surface. The measurement tool is provided in the processing chamber and configured to measure the downward force of the pad conditioner. The controller is coupled to the pad conditioner and the measurement tool, and is configured to adjust the downward force of the pad conditioner in response to an input from the measurement tool.

公开(公告)号：US10170343B1

公开(公告)日：2019-01-01

申请号：US15638463

申请日：2017-06-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Chen Wei ,  Chun-Jui Chu ,  Chun-Chieh Chan ,  Jen-Chieh Lai ,  Shih-Ho Lin

IPC: H01L21/67 ,  B08B1/04 ,  B24B37/08 ,  B24B37/04 ,  H01L21/321 ,  H01L21/306

Abstract: Apparatuses and methods for performing a post-CMP cleaning are provided. The apparatus includes a chamber configured to receive a wafer in need of having CMP residue removed. The apparatus also includes a spray unit configured to apply a first cleaning solution to at least one surface of the wafer. The apparatus further includes a brush cleaner configured to scrub the at least one surface of the wafer. In addition, the apparatus includes at least one inner tank disposed in the chamber for storing a second cleaning solution that is used to clean the brush cleaner.