公开(公告)号：US20190103652A1

公开(公告)日：2019-04-04

申请号：US15879456

申请日：2018-01-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Nan-Chin Chuang ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chao-Wen Shih ,  Shou-Zen Chang

IPC: H01Q1/22 ,  H01L23/31 ,  H01L23/66 ,  H01L23/00 ,  H01L23/552 ,  H01Q21/00 ,  H01Q21/24

Abstract: A package structure including an insulating encapsulation, at least one semiconductor die, at least one first antenna and at least one second antenna is provided. The insulating encapsulation includes a first portion, a second portion and a third portion, wherein the second portion is located between the first portion and the third portion. The at least one semiconductor die is encapsulated in the first portion of the insulating encapsulation, and the second portion and the third portion are stacked on the at least one semiconductor die. The at least one first antenna is electrically connected to the at least one semiconductor die and encapsulated in the third portion of the insulating encapsulation. The at least one second antenna is electrically connected to the at least one semiconductor die and encapsulated in the second portion of the insulating encapsulation.

公开(公告)号：US09661794B1

公开(公告)日：2017-05-23

申请号：US15208627

申请日：2016-07-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shou-Zen Chang ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Kai-Chiang Wu ,  Wei-Ting Lin

IPC: H05K13/02 ,  H01L23/538 ,  H01L23/00 ,  H05K3/34 ,  H05K13/04 ,  H01L21/683

CPC classification number: H05K13/028 ,  H01L21/6835 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/14 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/02379 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/73267 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19102 ,  H05K3/3442 ,  H05K3/3489 ,  H05K3/3494 ,  H05K13/0465

Abstract: A method of manufacturing a package structure includes at least the following steps. A wafer is provided. A flux layer is applied onto at least part of the wafer. A stencil is provided over the wafer. The stencil includes a plurality of apertures exposing the flux layer. A dispenser is provided over the stencil. A plurality of SMDs are fed over the stencil with the dispenser. The dispenser is moved to drive the SMDs into the apertures of the stencil. The stencil is removed and the flux layer is reflowed.

公开(公告)号：US11245176B2

公开(公告)日：2022-02-08

申请号：US16740464

申请日：2020-01-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Min-Chien Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chao-Wen Shih ,  Shou-Zen Chang

IPC: H01L23/498 ,  H01Q1/22 ,  H01L23/66 ,  H01L21/56 ,  H01L23/31 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q19/06 ,  H01Q25/00 ,  H01L21/683 ,  H01Q21/06 ,  H01Q21/29

Abstract: In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.

公开(公告)号：US11043731B2

公开(公告)日：2021-06-22

申请号：US16671182

申请日：2019-11-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Nan-Chin Chuang ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chao-Wen Shih ,  Shou-Zen Chang

IPC: H01Q1/22 ,  H01Q21/00 ,  H01Q19/30 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01Q21/24 ,  H01L23/31 ,  H01Q1/52 ,  H01Q15/14 ,  H01Q21/28

Abstract: A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.

公开(公告)号：US11004809B2

公开(公告)日：2021-05-11

申请号：US16426365

申请日：2019-05-30

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Yung-Ping Chiang ,  Yi-Che Chiang ,  Nien-Fang Wu ,  Min-Chien Hsiao ,  Chao-Wen Shih ,  Shou-Zen Chang ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H01L25/065 ,  H01L21/683 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q21/00 ,  H01L21/56 ,  H01L23/538 ,  H01Q1/22 ,  H01Q21/22

Abstract: Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive element and a first protective layer surrounding the semiconductor die. The chip package also includes a second protective layer over the semiconductor die and the first protective layer. The chip package further includes an antenna element over the second protective layer. The antenna element is electrically connected to the conductive element of the semiconductor die.

公开(公告)号：US20200153083A1

公开(公告)日：2020-05-14

申请号：US16740464

申请日：2020-01-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Min-Chien Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chao-Wen Shih ,  Shou-Zen Chang

IPC: H01Q1/22 ,  H01Q25/00 ,  H01Q19/06 ,  H01Q9/04 ,  H01Q1/24 ,  H01L23/31 ,  H01L21/56 ,  H01L23/66 ,  H01L23/498 ,  H01L21/683

Abstract: In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.

公开(公告)号：US20200067173A1

公开(公告)日：2020-02-27

申请号：US16671182

申请日：2019-11-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Nan-Chin Chuang ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chao-Wen Shih ,  Shou-Zen Chang

IPC: H01Q1/22 ,  H01L23/31 ,  H01Q21/24 ,  H01Q21/00 ,  H01L23/552 ,  H01L23/00 ,  H01L23/66 ,  H01Q1/52 ,  H01Q19/30

Abstract: A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.

公开(公告)号：US10483617B2

公开(公告)日：2019-11-19

申请号：US15879456

申请日：2018-01-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Nan-Chin Chuang ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chao-Wen Shih ,  Shou-Zen Chang

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  H01L23/552 ,  H01Q21/00 ,  H01Q21/24 ,  H01Q1/52 ,  H01Q19/30 ,  H01Q15/14 ,  H01Q21/28

Abstract: A package structure including an insulating encapsulation, at least one semiconductor die, at least one first antenna and at least one second antenna is provided. The insulating encapsulation includes a first portion, a second portion and a third portion, wherein the second portion is located between the first portion and the third portion. The at least one semiconductor die is encapsulated in the first portion of the insulating encapsulation, and the second portion and the third portion are stacked on the at least one semiconductor die. The at least one first antenna is electrically connected to the at least one semiconductor die and encapsulated in the third portion of the insulating encapsulation. The at least one second antenna is electrically connected to the at least one semiconductor die and encapsulated in the second portion of the insulating encapsulation.

公开(公告)号：US20190252762A1

公开(公告)日：2019-08-15

申请号：US16396769

申请日：2019-04-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Min-Chien Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chao-Wen Shih ,  Shou-Zen Chang

IPC: H01Q1/22 ,  H01L23/31 ,  H01L21/56 ,  H01L23/66 ,  H01Q25/00 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q19/06 ,  H01L23/498

Abstract: In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.

公开(公告)号：US10163854B2

公开(公告)日：2018-12-25

申请号：US15803673

申请日：2017-11-03

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chuei-Tang Wang ,  Kai-Chiang Wu ,  Chieh-Yen Chen ,  Yen-Ping Wang ,  Shou-Zen Chang

IPC: H01L25/065 ,  H01L25/00 ,  H01L21/56 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L25/03 ,  H01L23/31

Abstract: A package structure includes a package, at least one second molding material, and at least one electronic component. The package includes at least one first semiconductor device therein, a first molding material, at least one dielectric layer and at least one redistribution line. The first molding material is at least in contact with at least one sidewall of the first semiconductor device. The dielectric layer is over the first semiconductor device and the first molding material. The redistribution line is present at least partially in the dielectric layer and is electrically connected to the first semiconductor device. The second molding material is present on the package. The electronic component is present on the package and is external to the second molding material.