公开(公告)号：US09007782B1

公开(公告)日：2015-04-14

申请号：US14566470

申请日：2014-12-10

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Tatsuro Sawatari ,  Yuichi Sugiyama ,  Hiroshi Nakamura ,  Masaki Naganuma ,  Tetsuo Saji

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/185 ,  H05K1/0213 ,  H05K1/0271 ,  H05K1/0298 ,  H05K2201/09063 ,  H05K2203/1178

Abstract: In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.

Abstract translation: 在分别与具有穿过其的存储部分的芯层最靠近的第一导电层和第三导电层中，形成四个第一穿透孔和四个第一穿透孔，以与存储部分的开口边缘的一部分重叠 其分别投影到第一导电层和第三导电层上。

公开(公告)号：US08964407B2

公开(公告)日：2015-02-24

申请号：US14101054

申请日：2013-12-09

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Tatsuro Sawatari ,  Yuichi Sugiyama

IPC: H05K7/02 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/183 ,  H05K1/185 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/10522

Abstract: A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other.

Abstract translation: 具有内置电子部件的基板包括：芯层，其包括芯材料和形成在芯材中并且包含绝缘材料的空腔; 绝缘层，其包括接地布线和信号布线，并且形成在所述芯层上; 以及多个电子部件，其各自包括第一端子和第二端子，并且存储在所述空腔中，所述多个电子部件各自具有一个端部和另一个端部，所述第一端子形成在所述一个端部处， 连接到接地布线，第二端子形成在另一端部并连接到信号布线，多个电子部件具有第一端子彼此面对并且第二端子面对的布置中的至少一种 其他。

公开(公告)号：US09101075B2

公开(公告)日：2015-08-04

申请号：US14101026

申请日：2013-12-09

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Masaki Naganuma ,  Kazuaki Ida ,  Tatsuro Sawatari ,  Hiroshi Nakamura

IPC: H05K1/18

CPC classification number: H05K1/186 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2924/12042 ,  H01L2924/15151 ,  H05K1/185 ,  H05K3/4608 ,  H05K2201/09063 ,  H05K2201/09427 ,  H05K2201/09854 ,  H01L2924/00

Abstract: There is provided a substrate with built-in component, including a metal core layer having a cavity for storing a component; a wiring layer that is laminated on the core layer and has a plurality of vias for an interlayer connection, the vias being formed at regions opposing to the cavity; and an electronic component including a plurality of terminals electrically connected to the plurality of vias, and a component body that is stored in the cavity and has a support surface for supporting the plurality of terminals, the plurality of terminals being disposed eccentrically from a center of the support surface to a first direction, and the component body being disposed eccentrically from a center of the cavity to a second direction opposite to the first direction.

Abstract translation: 提供了具有内置部件的基板，包括具有用于存储部件的空腔的金属芯层; 层叠在所述芯层上并具有多个用于层间连接的通孔的布线层，所述通孔形成在与所述空腔相对的区域处; 以及电子部件，包括电连接到所述多个通孔的多个端子，以及存储在所述空腔中并具有用于支撑所述多个端子的支撑表面的部件主体，所述多个端子偏离所述多个端子的中心 所述支撑表面朝向第一方向，并且所述部件主体从所述腔的中心偏心地设置到与所述第一方向相反的第二方向。

公开(公告)号：US08811021B2

公开(公告)日：2014-08-19

申请号：US14073019

申请日：2013-11-06

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Yuichi Sugiyama ,  Tatsuro Sawatari ,  Masashi Miyazaki

IPC: H01L23/552

CPC classification number: H05K9/00 ,  H01L21/561 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/19105 ,  Y10T29/49146 ,  H01L2224/81

Abstract: There is provided an electronic circuit module that prevents a bonding force between ground wiring and a shield from decreasing and maintains successfully a desirable shield effect. The electronic circuit module includes a core layer also functioning as the ground wiring, each face OS of each first protrusion of the core layer facing to an end face of a shield is adjacent to faces OS of an outer cover made of an insulating synthetic resin facing to the end face of the shield, and the end face of the shield is bonded to both of the each face OS of each first protrusion facing to the end face of the shield and the faces OS of the outer cover facing to the end face of the shield.

Abstract translation: 提供了一种电子电路模块，其防止接地布线和屏蔽层之间的结合力降低并且成功地保持期望的屏蔽效果。 电子电路模块还包括也用作接地布线的芯层，芯层的面向屏蔽端面的每个第一突起的每个面OS与面向绝缘合成树脂的外盖的面相邻 到屏蔽的端面，并且屏蔽的端面被接合到面向屏蔽端面的每个第一突起的每个面OS的两个面上，并且外盖的面向OS的端面 护盾。