Method for producing deep trench structures
    18.
    发明授权
    Method for producing deep trench structures 失效
    深沟槽结构的生产方法

    公开(公告)号:US07851326B2

    公开(公告)日:2010-12-14

    申请号:US11812386

    申请日:2007-06-18

    IPC分类号: H01L21/76

    CPC分类号: H01L21/76224

    摘要: A method for producing deep trench structures in an STI structure of a semiconductor substrate is provided, with the following successive process steps: subsequent to a full-area filling of STI recesses introduced into a semiconductor substrate with a first filler material, a first surface of a semiconductor structure is subjected to a CMP process to level the applied filler material and produce the STI structure; the leveled STI structure thus produced is structured; using the structured, leveled STI structure as a hard mask, at least one deep trench is etched in the area of this STI structure to create the deep trench structures.

    摘要翻译: 提供一种用于在半导体衬底的STI结构中制造深沟槽结构的方法,具有以下连续的工艺步骤:在用第一填充材料引入到半导体衬底中的STI凹部的全面填充之后, 对半导体结构进行CMP处理以对施加的填充材料进行平整并产生STI结构; 这样生产的水平STI结构是结构化的; 使用结构化的水平STI结构作为硬掩模,在该STI结构的区域中蚀刻至少一个深沟槽以产生深沟槽结构。

    METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT, USE OF A TRENCH STRUCTURE, AND SEMICONDUCTOR ARRANGEMENT
    20.
    发明申请
    METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT, USE OF A TRENCH STRUCTURE, AND SEMICONDUCTOR ARRANGEMENT 审中-公开
    制造半导体布置的方法,使用拉伸结构和半导体布置

    公开(公告)号:US20090057911A1

    公开(公告)日:2009-03-05

    申请号:US12203124

    申请日:2008-09-02

    IPC分类号: H01L21/768 H01L23/522

    摘要: A method for manufacturing a semiconductor arrangement, use of a trench structure, and a semiconductor arrangement is provided that includes a single-crystal semiconductor layer, a conductive substrate region and a buried insulator layer, which isolates the single-crystal semiconductor layer from the conductive substrate region, whereby the conductive substrate region is contacted. A trench structure is formed to separate the single-crystal semiconductor layer into a first semiconductor region outside the trench structure and a second semiconductor region within the trench structure, an opening is formed in the single-crystal semiconductor layer within the second semiconductor region, the buried insulator layer is removed within the opening, and a conductor, which contacts the conductive substrate region and adjoins the second semiconductor region, is introduced into the opening.

    摘要翻译: 提供一种制造半导体装置的方法,使用沟槽结构和半导体装置,其包括单晶半导体层,导电衬底区域和掩埋绝缘体层,其将单晶半导体层与导电 衬底区域,由此使导电衬底区域接触。 形成沟槽结构以将单晶半导体层分离成沟槽结构之外的第一半导体区域和沟槽结构内的第二半导体区域,在第二半导体区域内的单晶半导体层中形成开口, 在开口内去除埋入的绝缘体层,并且将与导电衬底区域接触并与第二半导体区域相邻接的导体引入到开口中。