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公开(公告)号：US20170059996A1
公开(公告)日：2017-03-02
申请号：US15251072
申请日：2016-08-30
Applicant: Tokyo Electron Limited
Inventor： Jiro Higashijima , Nobuhiro Ogata
IPC: G03F7/42
CPC classification number: G03F7/423
Abstract: A processing fluid can be discharged according to a discharge type for a process involved, without a discharge defect. A substrate processing apparatus includes a nozzle and a pipeline. The nozzle is configured to discharge the processing fluid toward a substrate, and the processing fluid is supplied to the nozzle through the pipeline. The pipeline has a three-layer structure having a first layer, a second layer and a third layer in this sequence from an inner side thereof. Further, a leading end portion of the first layer and a leading end portion of the third layer are bonded to the nozzle, and the leading end portion of the first layer is located at a position which is not protruded more than a leading end portion of the second layer with respect to a discharging direction of the processing fluid.
Abstract translation: 可以根据所涉及的处理的排放类型排出处理流体，而没有排出缺陷。 基板处理装置包括喷嘴和管道。 喷嘴被配置为将处理流体朝向基板排出，并且处理流体通过管道供应到喷嘴。 管线具有从其内侧开始依次具有第一层，第二层和第三层的三层结构。 此外，第一层的前端部和第三层的前端部分接合到喷嘴，并且第一层的前端部位于不比第一层的前端部突出的位置 相对于处理流体的排出方向的第二层。
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公开(公告)号：US09508569B2
公开(公告)日：2016-11-29
申请号：US14882864
申请日：2015-10-14
Applicant: Tokyo Electron Limited
Inventor： Shigehisa Inoue , Jiro Higashijima , Masami Akimoto
CPC classification number: H01L21/67051 , B05B13/0228 , B05B15/50 , B05B15/55 , B05B15/70 , B08B3/02 , B08B3/04 , B08B3/12
Abstract: Disclosed is a substrate liquid processing apparatus including a substrate holding unit configured to hold a substrate; a processing liquid nozzle configured to supply a processing liquid to the substrate held by the substrate holding unit; a nozzle arm configured to hold the processing liquid nozzle; and an arm cleaning tank configured to immerse the entire surface of the nozzle arm in a cleaning liquid so as to clean the nozzle arm.
Abstract translation: 公开了一种基板液体处理装置，其包括：被配置为保持基板的基板保持单元; 处理液喷嘴，被配置为向由所述基板保持单元保持的所述基板供给处理液; 喷嘴臂，其构造成保持所述处理液喷嘴; 以及配置成将喷嘴臂的整个表面浸入清洁液体中以清洁喷嘴臂的臂清洁罐。
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公开(公告)号：US10475671B2
公开(公告)日：2019-11-12
申请号：US15390902
申请日：2016-12-27
Applicant: Tokyo Electron Limited
Inventor： Jiro Higashijima , Nobuhiro Ogata , Yusuke Hashimoto
Abstract: Disclosed is a substrate processing apparatus including: a holding unit configured to hold a substrate; a processing liquid supply unit configured to supply a first processing liquid and a second processing liquid to the substrate; a first cup configured to recover the first processing liquid; a second cup disposed adjacent to the first cup and configured to recover the second processing liquid; a recovery portion defined by a peripheral wall portion that is erected on a bottom portion of the first cup; and a cleaning liquid supply unit configured to supply a cleaning liquid to the recovery portion. The peripheral wall portion is cleaned by causing the cleaning liquid supplied by the cleaning liquid supply unit to overflow from the peripheral wall portion to the second cup side.
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公开(公告)号：US10297473B2
公开(公告)日：2019-05-21
申请号：US15681672
申请日：2017-08-21
Applicant: Tokyo Electron Limited
Inventor： Terufumi Wakiyama , Norihiro Ito , Jiro Higashijima
Abstract: A liquid processing apparatus performs a liquid processing on a rotating substrate by supplying a processing liquid. Surrounding members surround a region including an upper space of a cup body surrounding the rotating substrate and provided with an opening above the substrate. An air flow forming portion forms a descending air flow from an upper side of the cup body. A bottom surface portion blocks between the cup body and the surrounding member along a circumferential direction. An exhaust port is provided above the bottom surface portion and outside the cup body to exhaust an atmosphere in a region surrounded by the surrounding members and the bottom surface portion.
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公开(公告)号：US20170345689A1
公开(公告)日：2017-11-30
申请号：US15681672
申请日：2017-08-21
Applicant: Tokyo Electron Limited
Inventor： Terufumi Wakiyama , Norihiro Ito , Jiro Higashijima
CPC classification number: H01L21/67051 , B08B17/00 , H01L21/67017 , H01L21/6719
Abstract: A liquid processing apparatus performs a liquid processing on a rotating substrate by supplying a processing liquid. Surrounding members surround a region including an upper space of a cup body surrounding the rotating substrate and provided with an opening above the substrate. An air flow forming portion forms a descending air flow from an upper side of the cup body. A bottom surface portion blocks between the cup body and the surrounding member along a circumferential direction. An exhaust port is provided above the bottom surface portion and outside the cup body to exhaust an atmosphere in a region surrounded by the surrounding members and the bottom surface portion.
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Patent Agency Ranking
公开(公告)号：US09818626B2
公开(公告)日：2017-11-14
申请号：US14056014
申请日：2013-10-17
Applicant: Tokyo Electron Limited
Inventor： Jiro Higashijima , Yoshifumi Amano , Eiichiro Okamoto , Yuki Ito
IPC: H01L21/67
CPC classification number: H01L21/67051
Abstract: When a substrate W is processed, a ring-shaped protective wall is located above the substrate held by the substrate holding unit and extends in a circumferential direction of the substrate. A radial position of an external periphery of a lower end of the protective wall is the same as a radial position of an internal periphery of a peripheral portion of an upper surface of the substrate held by a substrate holding unit, or is located at a radial outside. A first gap is formed between the protective wall and an upper surface of the substrate, a second gap is formed between the protective wall and a wall that defines the upper opening of the cup, and when the interior space of the cup is exhausted, a gas present above the substrate is introduced through the first gap and the second gap into the interior space of the cup.
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公开(公告)号：US09773687B2
公开(公告)日：2017-09-26
申请号：US14483252
申请日：2014-09-11
Applicant: Tokyo Electron Limited
Inventor： Terufumi Wakiyama , Norihiro Ito , Jiro Higashijima
CPC classification number: H01L21/67051 , B08B17/00 , H01L21/67017 , H01L21/6719
Abstract: A liquid processing apparatus performs a liquid processing on a rotating substrate by supplying a processing liquid. Surrounding members surround a region including an upper space of a cup body surrounding the rotating substrate and provided with an opening above the substrate. An air flow forming portion forms a descending air flow from an upper side of the cup body. A bottom surface portion blocks between the cup body and the surrounding member along a circumferential direction. An exhaust port is provided above the bottom surface portion and outside the cup body to exhaust an atmosphere in a region surrounded by the surrounding members and the bottom surface portion.
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公开(公告)号：US20140116480A1
公开(公告)日：2014-05-01
申请号：US14056164
申请日：2013-10-17
Applicant: Tokyo Electron Limited
Inventor： Jiro Higashijima , Yoshifumi Amano , Eiichiro Okamoto , Yuki Ito
IPC: H01L21/67
CPC classification number: H01L21/67051
Abstract: When a substrate W is processed, a cover member covers a peripheral portion of the upper surface of the substrate held by the substrate holding unit, and a central portion of the substrate located at an inner position than the peripheral portion in a radial direction is exposed without being covered by the cover member. A gap is formed between the lower surface of the cover member and the peripheral portion of the upper surface of the substrate held by the substrate holding unit. When the interior space of the cup is exhausted, a gas present above the interior space of the cup is introduced from a space enclosed by the internal peripheral surface of the cover member through the gap into the interior space of the cup.
Abstract translation: 当处理基板W时，盖部件覆盖由基板保持单元保持的基板的上表面的周边部分，并且位于比径向方向的周边部分的内部位置的基板的中心部分暴露 而不被盖构件覆盖。 在盖构件的下表面和由衬底保持单元保持的衬底的上表面的周边部分之间形成间隙。 当杯的内部空间被耗尽时，存在于杯的内部空间之上的气体从由盖构件的内周面包围的空间通过间隙引入杯的内部空间。
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公开(公告)号：US11715650B2
公开(公告)日：2023-08-01
申请号：US16984386
申请日：2020-08-04
Applicant: Tokyo Electron Limited
Inventor： Yusuke Hashimoto , Jiro Higashijima
IPC: H01L21/67
CPC classification number: H01L21/6708
Abstract: A substrate processing apparatus includes a nozzle unit. The nozzle unit includes a line and a nozzle tip provided on a tip end of the line. The line includes a first layer, a second layer and a third layer. The nozzle tip is formed of a corrosion resistant resin having conductivity. The third layer is configured to cover the first layer and the second layer from outside and cover a part of the nozzle tip from outside.
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公开(公告)号：US11430673B2
公开(公告)日：2022-08-30
申请号：US17230120
申请日：2021-04-14
Applicant: Tokyo Electron Limited
Inventor： Yusuke Hashimoto , Jiro Higashijima
Abstract: A substrate processing apparatus includes at least one nozzle unit configured to eject a processing liquid to a substrate. The at least one nozzle unit includes a conductive part for voltage application configured to be brought into contact with the processing liquid, and a voltage detection part or a current detection part configured to be brought into contact with the processing liquid. A non-conductive part is interposed between the conductive part for voltage application and the voltage detection part or between the conductive part for voltage application and the current detection part. A voltage application part is connected to the conductive part for voltage application, and a voltage detector is installed in the voltage detection part or a current detector is installed in the current detection part.
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