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公开(公告)号：US12148632B2
公开(公告)日：2024-11-19
申请号：US17810385
申请日：2022-07-01
Applicant: Tokyo Electron Limited
Inventor： Yusuke Hashimoto , Daisuke Goto , Kanta Mori , Jiro Higashijima , Nobuhiro Ogata
Abstract: A substrate processing apparatus includes a holder configured to hold a substrate; a driving unit configured to rotate the holder; an inner cup body provided in the holder to surround the substrate held by the holder; a mist guard, surrounding the holder and the inner cup body, configured to be moved up and down; a cleaning liquid supply configured to supply a cleaning liquid; and a controller. The controller is configured to perform: supplying a processing liquid to the substrate from a processing liquid supply, in a state that the substrate is held by the holder and the mist guard is raised; and dispersing, after the supplying of the processing liquid, the cleaning liquid supplied from the cleaning liquid supply to an entire inner peripheral surface of the mist guard, in a state that the substrate is carried out from the holder and the mist guard is raised.
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公开(公告)号：US11955352B2
公开(公告)日：2024-04-09
申请号：US17141670
申请日：2021-01-05
Applicant: Tokyo Electron Limited
Inventor： Hiroki Sakurai , Daisuke Goto , Takashi Nakazawa , Yusuke Takamatsu , Yusuke Hashimoto
IPC: H01L21/67 , H01L21/687
CPC classification number: H01L21/67051 , H01L21/6708 , H01L21/68764
Abstract: A substrate processing apparatus includes: a temperature raising part for raising a temperature of a first sulfuric acid; a mixing part for mixing the first sulfuric acid where the temperature is raised by the temperature raising part with a moisture-containing liquid to generate a mixed solution; and a discharging part for discharging the mixed solution onto a substrate inside a substrate processing part. The mixing part includes: a joining portion where a sulfuric acid supply line through which the first sulfuric acid where the temperature is raised by the temperature raising part flows and a liquid supply line through which the first sulfuric acid where the temperature is raised by the temperature raising part and the moisture-containing liquid flows are joined; and a reaction suppression mechanism for suppressing a reaction between the first sulfuric acid and the moisture-containing liquid in the joining portion.
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公开(公告)号：US20210043467A1
公开(公告)日：2021-02-11
申请号：US16984386
申请日：2020-08-04
Applicant: Tokyo Electron Limited
Inventor： Yusuke Hashimoto , Jiro Higashijima
IPC: H01L21/67
Abstract: A substrate processing apparatus includes a nozzle unit. The nozzle unit includes a line and a nozzle tip provided on a tip end of the line. The line includes a first layer, a second layer and a third layer. The nozzle tip is formed of a corrosion resistant resin having conductivity. The third layer is configured to cover the first layer and the second layer from outside and cover a part of the nozzle tip from outside.
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公开(公告)号：US20170200624A1
公开(公告)日：2017-07-13
申请号：US15390902
申请日：2016-12-27
Applicant: Tokyo Electron Limited
Inventor： Jiro Higashijima , Nobuhiro Ogata , Yusuke Hashimoto
CPC classification number: H01L21/67051 , B08B3/10 , B08B17/025 , B08B2203/0229 , C11D11/0047 , H01L21/02041
Abstract: Disclosed is a substrate processing apparatus including: a holding unit configured to hold a substrate; a processing liquid supply unit configured to supply a first processing liquid and a second processing liquid to the substrate; a first cup configured to recover the first processing liquid; a second cup disposed adjacent to the first cup and configured to recover the second processing liquid; a recovery portion defined by a peripheral wall portion that is erected on a bottom portion of the first cup; and a cleaning liquid supply unit configured to supply a cleaning liquid to the recovery portion. The peripheral wall portion is cleaned by causing the cleaning liquid supplied by the cleaning liquid supply unit to overflow from the peripheral wall portion to the second cup side.
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公开(公告)号：US20230001458A1
公开(公告)日：2023-01-05
申请号：US17810385
申请日：2022-07-01
Applicant: Tokyo Electron Limited
Inventor： Yusuke Hashimoto , Daisuke Goto , Kanta Mori , Jiro Higashijima , Nobuhiro Ogata
Abstract: A substrate processing apparatus includes a holder configured to hold a substrate; a driving unit configured to rotate the holder; an inner cup body provided in the holder to surround the substrate held by the holder; a mist guard, surrounding the holder and the inner cup body, configured to be moved up and down; a cleaning liquid supply configured to supply a cleaning liquid; and a controller. The controller is configured to perform: supplying a processing liquid to the substrate from a processing liquid supply, in a state that the substrate is held by the holder and the mist guard is raised; and dispersing, after the supplying of the processing liquid, the cleaning liquid supplied from the cleaning liquid supply to an entire inner peripheral surface of the mist guard, in a state that the substrate is carried out from the holder and the mist guard is raised.
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Patent Agency Ranking
公开(公告)号：US11024518B2
公开(公告)日：2021-06-01
申请号：US15747921
申请日：2016-07-28
Applicant: Tokyo Electron Limited
Inventor： Norihiro Ito , Jiro Higashijima , Nobuhiro Ogata , Takahisa Otsuka , Yuichi Douki , Yusuke Hashimoto , Kazuhiro Aiura , Daisuke Goto
Abstract: A substrate processing apparatus includes a stationary cup body 51 provided to surround a substrate holding unit 31 and configured to receive a processing liquid or mist of the processing liquid discharged onto a substrate, the stationary cup body not being moved relatively with respect to a processing vessel; a mist guard 80; and a guard elevating mechanism 84 configured to elevate the mist guard. Here, the mist guard is provided at an outside of the stationary cup body to surround the stationary cup body and configured to block a liquid scattered outwards beyond a space above the stationary cup body. Further, the mist guard includes a cylindrical portion 81 of a cylindrical shape and a protruding portion 82 protruded from an upper portion of the cylindrical portion toward an inside of the cylindrical portion.
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公开(公告)号：US09346084B2
公开(公告)日：2016-05-24
申请号：US13680426
申请日：2012-11-19
Applicant: Tokyo Electron Limited
Inventor： Shuichi Nagamine , Yusuke Hashimoto
CPC classification number: B08B3/10 , B08B3/12 , H01L21/67028
Abstract: Disclosed is a liquid processing apparatus capable of performing a liquid processing and a drying processing in a position each having a different height. The liquid processing apparatus includes: a substrate holding unit configured to hold a substrate; a rotation driving unit configured to rotate the substrate holding unit; a substrate holding unit elevating member configured to lift and lower the substrate holding unit; a processing liquid supply unit configured to supply a processing liquid to the substrate; a liquid receiving cup configured to surround the substrate when the processing liquid is being supplied to the substrate; a drying cup located above the substrate and the liquid receiving cup when the processing liquid is being supplied to the substrate. The drying cup surrounds the substrate and located above the liquid receiving cup when the substrate is being dried.
Abstract translation: 公开了一种能够在各自具有不同高度的位置进行液体处理和干燥处理的液体处理装置。 液体处理装置包括：基板保持单元，被配置为保持基板; 旋转驱动单元，其构造成使所述基板保持单元旋转; 基板保持单元升降构件，被配置为升高和降低所述基板保持单元; 处理液供给单元，其构造成将处理液供给到所述基板; 液体容纳杯，其构造成当所述处理液体被供应到所述基底时围绕所述基底; 当处理液体被供给到基底时，位于基底上方的干燥杯和液体接收杯。 当基底被干燥时，干燥杯围绕基底并位于液体接收杯上方。
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公开(公告)号：US12007692B2
公开(公告)日：2024-06-11
申请号：US18077577
申请日：2022-12-08
Applicant: Tokyo Electron Limited
Inventor： Hiroki Sakurai , Nobuhiro Ogata , Daisuke Goto , Kanta Mori , Kenji Yada , Yusuke Hashimoto , Shoki Mizuguchi , Yenrui Hsu
CPC classification number: G03F7/3021 , G03F7/426
Abstract: A nozzle that mixes fluid containing steam or mist of pressurized pure water and processing liquid containing at least sulfuric acid and ejects mixed fluid of the fluid and the processing liquid, the nozzle comprising: at least one first ejection port ejecting the fluid; at least one second ejection port ejecting the processing liquid; and at least one lead-out path being in fluid communication with the at least one first ejection port and the at least one second ejection port and leading out the mixed fluid of the fluid ejected from the at least one first ejection port and the processing liquid ejected from the at least one second ejection port, wherein the at least one first ejection port or the at least one second ejection port is arranged to be directed to position deviated from central axis of the at least one lead-out path in a plan view.
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公开(公告)号：US10475671B2
公开(公告)日：2019-11-12
申请号：US15390902
申请日：2016-12-27
Applicant: Tokyo Electron Limited
Inventor： Jiro Higashijima , Nobuhiro Ogata , Yusuke Hashimoto
Abstract: Disclosed is a substrate processing apparatus including: a holding unit configured to hold a substrate; a processing liquid supply unit configured to supply a first processing liquid and a second processing liquid to the substrate; a first cup configured to recover the first processing liquid; a second cup disposed adjacent to the first cup and configured to recover the second processing liquid; a recovery portion defined by a peripheral wall portion that is erected on a bottom portion of the first cup; and a cleaning liquid supply unit configured to supply a cleaning liquid to the recovery portion. The peripheral wall portion is cleaned by causing the cleaning liquid supplied by the cleaning liquid supply unit to overflow from the peripheral wall portion to the second cup side.
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公开(公告)号：US09266153B2
公开(公告)日：2016-02-23
申请号：US14233496
申请日：2012-10-16
Applicant: TOKYO ELECTRON LIMITED
Inventor： Shuichi Nagamine , Yusuke Hashimoto
IPC: B08B3/00 , B08B3/04 , H01L21/67 , H01L21/677 , H01L21/687 , H01L21/311
CPC classification number: B08B3/04 , H01L21/31133 , H01L21/67028 , H01L21/67051 , H01L21/67057 , H01L21/67109 , H01L21/67748 , H01L21/68792
Abstract: A substrate processing apparatus includes: a storage tank configured to store a liquid; a substrate support unit configured to rotatably, horizontally support a substrate; and a plate driving unit configured to move the substrate support unit between an immersion position at which the substrate is immersed into the liquid stored in the storage tank, and a separation position located above the immersion position, at which the substrate is separated from the liquid stored in the storage tank. The substrate processing apparatus also includes a rotary drive unit configured to rotate the substrate supported by the substrate support unit, and liquid supply units configured to supply a liquid to the substrate that is being rotated by the rotary drive unit in the separation position.
Abstract translation: 一种基板处理装置，包括：储存罐，被配置为储存液体; 基板支撑单元，被配置为可旋转地水平地支撑基板; 以及板驱动单元，其构造成将所述基板支撑单元移动到所述基板浸入到所述储存槽中的液体的浸渍位置之间，以及位于所述浸渍位置上方的分离位置，在所述分离位置处所述基板与所述液体分离 储存在储罐中。 基板处理装置还包括：旋转驱动单元，被配置为使由基板支撑单元支撑的基板旋转，以及液体供应单元，其构造成将液体供应到由旋转驱动单元在分离位置旋转的基板。
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