中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

24 records (took 0.018 seconds)

    Systems and methods for monitoring one or more characteristics of a substrate
    12.
    发明授权
    Systems and methods for monitoring one or more characteristics of a substrate 有权

    公开(公告)号：US11474028B2

    公开(公告)日：2022-10-18

    申请号：US17037050

    申请日：2020-09-29

    Applicant: Tokyo Electron Limited

    Inventor： Michael Carcasi ,  Mark Somervell ,  Joshua Hooge ,  Masahide Tadokoro

    IPC: G01B11/28 ,  G01N21/31 ,  G01B11/06 ,  G01N21/95 ,  H01L21/687 ,  G03F7/16 ,  H01L21/67

    Abstract: A substrate inspection system is provided to monitor characteristics of a substrate, while the substrate is disposed within (or being transferred into/out of) a processing unit of a liquid dispense substrate processing system. The inspection system is integrated within a liquid dispense substrate processing system and includes one or more optical sensors of a reflectometer (such as a spectrometer or laser-based transceiver) configured to obtain spectral data from a substrate. A controller is coupled to receive the spectral data from the optical sensors(s). The one or more optical sensors (or one or more optical fibers coupled to the rest of the optical sensor hardware) are coupled at locations within the substrate processing system. The controller analyzes the spectral data received from the optical sensors(s) to detect characteristic(s) of the substrate including, but not limited to, film thickness (FT), refractive index changes, and associated critical dimension (CD) changes.

    Method and process for stochastic driven detectivity healing
    13.
    发明授权
    Method and process for stochastic driven detectivity healing 有权

    公开(公告)号：US11163236B2

    公开(公告)日：2021-11-02

    申请号：US16993594

    申请日：2020-08-14

    Applicant: Tokyo Electron Limited

    Inventor： Michael Carcasi ,  Seiji Nagahara ,  Congque Dinh ,  Mark Somervell

    IPC: G03F7/20

    Abstract: Substrate processing techniques to alleviate missing contact holes, scummed contact holes and scummed caused bridging are disclosed. In one embodiment, electromagnetic radiation (EMR) absorbing molecules are utilized in a process that uses an initial patterned exposure followed by a flood exposure. In one embodiment, a Photo-Sensitized Chemically-Amplified Resist (PSCAR) resist process is utilized to form contact holes in which an initial exposure and develop process is performed followed by a flood exposure and a second develop process. In another embodiment, a process is utilized in which precursors of EMR absorbing molecules are incorporated into a layer underlying the resist layer. Thus, enhanced formation of EMR absorbing molecules will result at the interface of the resist layer and the underlying layer.

    Method of evaluating aligned patterns in directed self-assembly and using in feedback control scheme
    14.
    发明申请
    Method of evaluating aligned patterns in directed self-assembly and using in feedback control scheme 审中-公开

    公开(公告)号：US20170287126A1

    公开(公告)日：2017-10-05

    申请号：US15281692

    申请日：2016-09-30

    Applicant: Tokyo Electron Limited

    Inventor： Michael Carcasi ,  Mark Somervell

    IPC: G06T7/00 ,  H01L21/66

    CPC classification number: H01L22/12 ,  G06T7/32 ,  G06T7/37 ,  G06T2207/10061 ,  G06T2207/30148

    Abstract: Embodiments of methods and systems for inspecting a pattern are described. The method may include providing a substrate with a pattern formed thereupon, the pattern comprising aligned features. Additionally, the method may include acquiring one of more aerial images of the pattern, each image comprising a 2-dimensional (2D) array of pixels, each pixel having an intensity. Further, the method may include transforming at least one of the one or more aerial images into spatial frequency domain to form a transform. The method may also include selecting an alignment metric defined in the spatial frequency domain, the alignment metric being correlated to a level of alignment of the pattern. Additionally, the method may include calculating the alignment metric to evaluate the level of alignment of the pattern.

    UV-Assisted Stripping of Hardened Photoresist to Create Chemical Templates for Directed Self-Assembly
    15.
    发明申请
    UV-Assisted Stripping of Hardened Photoresist to Create Chemical Templates for Directed Self-Assembly 审中-公开
    UV辅助剥离硬化光致抗蚀剂以创建用于定向自组装的化学模板

    公开(公告)号：US20150064917A1

    公开(公告)日：2015-03-05

    申请号：US14465933

    申请日：2014-08-22

    Applicant: Tokyo Electron Limited

    Inventor： Mark Somervell ,  Ian Brown ,  Ihsan Simms ,  Ainhoa Negreira ,  Kathleen Nafus

    IPC: H01L21/306 ,  H01L21/308 ,  H01L21/02

    Abstract: A processing method is disclosed that enables an improved directed self-assembly (DSA) processing scheme by allowing the formation of improved guide strips in the DSA template that may enable the formation of sub-30 nm features on a substrate. The improved guide strips may be formed by improving the selectivity of wet chemical processing between different organic layers or films. In one embodiment, treating the organic layers with one or more wavelengths of ultraviolet light may improve selectivity. The first wavelength of UV light may be less than 200 nm and the second wavelength of UV light may be greater than 200 nm.

    Abstract translation: 公开了一种处理方法，其通过允许在DSA模板中形成改进的引导条来实现改进的定向自组装（DSA）处理方案，其可以使得能够在衬底上形成亚-30nm特征。 可以通过改善不同有机层或膜之间的湿化学处理的选择性来形成改进的引导条。 在一个实施方案中，用一个或多个紫外光波长处理有机层可提高选择性。 UV光的第一波长可以小于200nm，UV光的第二波长可以大于200nm。

    Predicting across wafer spin-on planarization over a patterned topography
    16.
    发明授权
    Predicting across wafer spin-on planarization over a patterned topography 有权

    公开(公告)号：US11455436B2

    公开(公告)日：2022-09-27

    申请号：US16829416

    申请日：2020-03-25

    Applicant: Tokyo Electron Limited

    Inventor： Ryan Burns ,  Mark Somervell

    IPC: G06F30/10 ,  G06F119/18 ,  G03F7/16

    Abstract: Methods used to more accurately predict spin on layer planarization over a patterned topography are provided. Methods are provided for generating a layer critical dimension model. In one embodiment, the critical dimension model is a layer thickness model that more accurately simulates patterned topography trends, as a function of feature dimensions, surrounding pattern density and radial position across the patterned topography. Additional methods are provided for calibrating the layer thickness model over one or more spatial areas to account for radial variations in the patterned topography. Further methods are provided for using one or more calibrated layer thickness models to predict a thickness of a layer (e.g., a spin on coating) as it is being deposited onto a patterned substrate. The methods disclosed herein may facilitate the planarization (i.e., flatness) of spin-on coatings during the device fabrication to form a uniformly planar layer or layer on the substrate.

    Systems and methods to monitor particulate accumulation for bake chamber cleaning
    17.
    发明授权
    Systems and methods to monitor particulate accumulation for bake chamber cleaning 有权

    公开(公告)号：US11339733B2

    公开(公告)日：2022-05-24

    申请号：US16562844

    申请日：2019-09-06

    Applicant: Tokyo Electron Limited

    Inventor： Michael Carcasi ,  Mark Somervell

    IPC: F02D41/02 ,  F01N11/00 ,  G03F7/16 ,  G03F7/40 ,  H01L21/67 ,  G01N29/02 ,  H01L21/768

    Abstract: Various embodiments of monitoring systems and methods are disclosed herein to monitor particulate accumulation within a bake chamber configured to thermally treat substrates, and determine when the bake chamber requires cleaning. Embodiments of the disclosed monitoring system may generally include one or more sensors to monitor particulate accumulation on one or more inside surfaces of a bake chamber and/or a bake chamber lid assembly, and a controller, which is coupled to receive a sensor output from the one or more sensors and configured to use the sensor output to determine when cleaning is needed. Various types of sensors including, but not limited to, optical sensors, and surface acoustic wave-based sensors may be used in the present disclosure to monitor particulate accumulation inside the bake chamber.

    METHODS AND SYSTEMS TO MONITOR, CONTROL, AND SYNCHRONIZE DISPENSE SYSTEMS
    20.
    发明申请
    METHODS AND SYSTEMS TO MONITOR, CONTROL, AND SYNCHRONIZE DISPENSE SYSTEMS 有权

    公开(公告)号：US20210129174A1

    公开(公告)日：2021-05-06

    申请号：US17037073

    申请日：2020-09-29

    Applicant: Tokyo Electron Limited

    Inventor： Joshua Hooge ,  Michael Carcasi ,  Mark Somervell

    IPC: B05C11/10 ,  B05C5/02 ,  B05C13/02

    Abstract: Embodiments are described herein to monitor and synchronize dispense systems for processing systems. For one embodiment, pressure and flow rate sensors are used to determine a delay between a flow change event and an increase in flow rate, and this delay is used to detect defects or conditions within the dispense system. For one embodiment, dispense system operation is synchronized using flow rate sensors. For one embodiment, simulation models or complex dispense profiles based upon combined pressure/flow/spin/concentration sensor data are used to enable complex process recipes. For one embodiment, dispense-to-dispense pressure and/or flow rate measurements are used to detect dispense parameters and defects. For one embodiment, cameras and image processing are used to detect flow rates from the dispense nozzle, and dispense-to-dispense measurements are used to detect dispense parameters and defects. One or more of the disclosed embodiments can be used in processing systems for microelectronic workpieces.

Patent Agency Ranking