公开(公告)号：US11557492B2

公开(公告)日：2023-01-17

申请号：US16890041

申请日：2020-06-02

Applicant: Tokyo Electron Limited

Inventor： Satoshi Biwa ,  Satoshi Okamura ,  Gentaro Goshi

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/04 ,  B08B7/04 ,  B08B7/00

Abstract: A substrate processing apparatus includes: a processing container including a processing space capable of accommodating a substrate in a state where a surface of the substrate is wet by a liquid; a processing fluid supply that supplies a processing fluid in a supercritical state to the processing space toward the liquid; a first exhaust line connected to a first exhaust source; a second exhaust line connected to a second exhaust source and connected to the first exhaust line between the first exhaust source and the processing space; and a controller controlling the second exhaust pressure. The processing fluid in the supercritical state contacts the liquid to dry the substrate, and the controller makes the second exhaust pressure to be higher than the first exhaust pressure during a period in which the processing fluid supply stops supplying the processing fluid to the processing space.

公开(公告)号：US10593571B2

公开(公告)日：2020-03-17

申请号：US15467001

申请日：2017-03-23

Applicant: Tokyo Electron Limited

Inventor： Hiroaki Inadomi ,  Tooru Nakamura ,  Kouji Kimoto ,  Yasuo Kiyohara ,  Satoshi Okamura ,  Satoshi Biwa ,  Nobuya Yamamoto ,  Katsuhiro Ookawa ,  Keiichi Yahata ,  Tetsuro Nakahara

IPC: H01L21/67 ,  B08B3/02 ,  B08B3/08 ,  B08B3/10

Abstract: Provided is a substrate processing apparatus including a liquid processing unit that performs a liquid processing on a substrate; a drying processing unit that performs a drying processing on the substrate in a wet state; a first conveyance unit that conveys the substrate to the liquid processing unit; a second conveyance unit that conveys the substrate in the wet state from the liquid processing unit to the drying processing unit; and a third conveyance unit that conveys the substrate before the liquid processing in the liquid processing unit and to convey the substrate after the drying processing from the drying processing unit. The first and second conveyance units and the drying processing unit are disposed on a side that faces the third conveyance unit, and the liquid processing unit is disposed on a side that faces the first and second conveyance units and is opposite to the third conveyance unit.

公开(公告)号：US10381246B2

公开(公告)日：2019-08-13

申请号：US15806481

申请日：2017-11-08

Applicant: Tokyo Electron Limited

Inventor： Satoshi Okamura ,  Satoshi Biwa

IPC: B08B3/08 ,  B08B7/00 ,  H01L21/02 ,  H01L21/67 ,  H01L21/677

Abstract: Disclosed is a substrate processing apparatus including: a container body configured to accommodate a substrate and perform a processing on the substrate using a high-pressure processing fluid; a conveyance port configured to carry the substrate into and out of the container body; an opening formed in the container body at a position different from the conveyance port; and a cover member configured to close the opening.

公开(公告)号：US10276425B2

公开(公告)日：2019-04-30

申请号：US14943138

申请日：2015-11-17

Applicant: Tokyo Electron Limited

Inventor： Terufumi Wakiyama ,  Norihiro Ito ,  Jiro Higashijima ,  Satoshi Biwa

IPC: H01L21/67 ,  H01L21/687

Abstract: A substrate processing system includes: a holding plate provided to be rotatable around a vertical axis; a substrate holding member provided on the holding plate to hold a substrate; a rotary drive unit that rotates the substrate in a predetermined direction; and a processing fluid supply unit that supplies a processing liquid to the substrate. The substrate holding member includes a first side portion provided at a position facing the substrate and a second side portion and a third side portion that are adjacent to the first side portion. The first side portion includes a gripping portion configured to grip an end surface of the substrate. The second side portion forms a pointed end portion with the first side portion, and includes a liquid flow guide portion that guides the processing liquid to a lower side of the substrate after the processing liquid is supplied to the substrate.