-
公开(公告)号：US07143772B2
公开(公告)日：2006-12-05
申请号：US10733283
申请日：2003-12-12
IPC分类号： B08B3/12
CPC分类号： H05K3/4069 , H05K3/0032 , H05K3/0055 , H05K3/0088 , H05K2201/0355 , H05K2203/0191 , H05K2203/0257 , H05K2203/0285 , H05K2203/0786 , H05K2203/081 , H05K2203/1461 , Y10S134/902 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , Y10T428/13
摘要： It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.
摘要翻译： 通过去除受影响的材料和形成孔时产生的异物，可以获得清洁的高质量电路板。 电路基板的制造方法包括：（a）通过将作为掩模的膜材料粘合到基板材料上来制备薄膜基板材料，（b）通过向其施加激光而在薄膜基板材料上形成孔 ，（c）通过超声波清洗，不从膜材剥离薄膜材料，从薄膜基板材料上选择性除去粘附在薄膜基板材料上的不必要的材料。 当形成孔时产生诸如异物等不必要的材料，并且不需要的材料粘附到基板材料上。 在去除这种不必要的材料之后，使用膜材料作为掩模将导电材料设置在孔中，并且膜材料随后从基板材料中去除。
-
12.发明授权Method and system of drying materials and method of manufacturing circuit boards using the same 失效干燥材料的方法和系统以及使用其制造电路板的方法公开(公告)号：US06893530B2
公开(公告)日：2005-05-17
申请号：US10068025
申请日：2002-02-08
CPC分类号： H05K3/4069 , F26B5/04 , H05K3/0032 , H05K3/0055 , H05K3/227 , H05K2201/0355 , H05K2203/0191 , H05K2203/081 , H05K2203/085 , H05K2203/1461
摘要： A method and system of cleaning to remove cutting dust and the like generated and adhering to a board material (1a) during drilling for electrical connection, and drying the board material, in a process of manufacturing a circuit board for small electronic equipment and the like. A large amount of board materials can be treated without receiving thermal damage by performing the steps of: placing sheets of the board material that have absorbed moisture resulting from cleaning, like a stack in a vacuum chamber (11); and drying the board material by repeating evacuation and pressurization under predetermined conditions while heating the board material.
摘要翻译： 在制造小型电子设备的电路板的过程中，清洁以除去在钻孔期间产生并附着在板材料（1a）上的电气连接和干燥板材的切割灰尘等的方法和系统， 喜欢。 可以通过执行以下步骤来处理大量的板材料：不会在真空室（11）中将堆积的吸收湿气的板材的片材放置在真空室（11）中; 并在加热基板材料的同时在预定条件下重复抽真空并干燥板材。
-
公开(公告)号：US06365844B2
公开(公告)日：2002-04-02
申请号：US09248020
申请日：1999-02-10
申请人： Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hidenori Hayashi , Toru Fujimoto , Toshiharu Okada , Izuru Nakai
发明人： Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hidenori Hayashi , Toru Fujimoto , Toshiharu Okada , Izuru Nakai
IPC分类号： H05K111
CPC分类号： H05K3/4069 , H05K1/0366 , H05K3/0017 , H05K3/0032 , H05K2201/0278 , H05K2201/0355 , H05K2201/09581 , H05K2203/1136 , H05K2203/1461 , Y10T29/49165
摘要： In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.
摘要翻译： 在制造双层或多层印刷线路板的过程中，利用辐射能在衬底的穿孔过程中，在孔的内壁上形成通过变换衬底材料产生的变质物质层。 变质物质层防止形成在孔的内壁上的电连接装置的导电材料在基体的表面上分散或渗透到基底中。
-
14.发明授权Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material 失效用于制造电路形成基板和电路形成基板材料的方法和装置公开(公告)号：US06814836B2
公开(公告)日：2004-11-09
申请号：US10128417
申请日：2002-04-24
IPC分类号： B23K2600
CPC分类号： H05K3/0032 , H05K3/227 , H05K3/4069 , H05K2201/0355 , H05K2203/081 , H05K2203/085 , H05K2203/1383 , H05K2203/1388 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T156/1056 , Y10T156/1062 , Y10T428/24994 , Y10T442/2902
摘要： A method for manufacturing a printed wiring board, comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability printed wiring board.
摘要翻译： 一种制造印刷电路板的方法，包括通过诸如激光束的能量束形成孔的步骤，其中防止通过渗透到孔的内壁表面的基底材料树脂形成树脂膜 通过作为用于形成用于形成在两面或多层上的互连电路的通孔或非贯通孔的成孔步骤的预处理，通过除湿步骤降低基板材料的吸水率，由此 可以通过防止树脂成膜不良而获得高可靠性的印刷线路板来实现高质量的孔形成。
-
15.发明授权公开(公告)号：US06671951B2
公开(公告)日：2004-01-06
申请号：US09975780
申请日：2001-10-12
申请人： Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hidenori Hayashi , Toru Fujimoto , Toshiharu Okada , Izuru Nakai
发明人： Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hidenori Hayashi , Toru Fujimoto , Toshiharu Okada , Izuru Nakai
IPC分类号： H01R2368
CPC分类号： H05K3/4069 , H05K1/0366 , H05K3/0032 , H05K2201/0278 , H05K2201/0355 , H05K2201/09581 , H05K2203/1136 , H05K2203/1461 , Y10T29/49165 , Y10T428/24917 , Y10T428/249953 , Y10T428/249996
摘要： In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.
摘要翻译： 在制造双层或多层印刷线路板的过程中，利用辐射能在衬底的穿孔过程中，在孔的内壁上形成通过变换衬底材料产生的变质物质层。 变质物质层防止形成在孔的内壁上的电连接装置的导电材料在基体的表面上分散或渗透到基底中。
-
16.发明授权Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material 失效用于制造电路形成基板和电路形成基板材料的方法和装置公开(公告)号：US06838164B2
公开(公告)日：2005-01-04
申请号：US10128418
申请日：2002-04-24
CPC分类号： H05K3/0032 , H05K3/227 , H05K3/4069 , H05K2201/0355 , H05K2203/081 , H05K2203/085 , H05K2203/1383 , H05K2203/1388 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T156/1056 , Y10T156/1062 , Y10T428/24994 , Y10T442/2902
摘要： A method for manufacturing a printed wiring board, comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability printed wiring board.
摘要翻译： 一种制造印刷电路板的方法，包括通过诸如激光束的能量束形成孔的步骤，其中防止通过渗透到孔的内壁表面的基底材料树脂形成树脂膜 通过作为用于形成用于形成在两面或多层上的互连电路的通孔或非贯通孔的成孔步骤的预处理，通过除湿步骤降低基板材料的吸水率，由此 可以通过防止树脂成膜不良而获得高可靠性的印刷线路板来实现高质量的孔形成。
-
公开(公告)号：US06820331B2
公开(公告)日：2004-11-23
申请号：US09736499
申请日：2000-12-15
IPC分类号： H01K310
CPC分类号： H05K3/4069 , H05K3/0032 , H05K3/0055 , H05K3/0088 , H05K2201/0355 , H05K2203/0191 , H05K2203/0257 , H05K2203/0285 , H05K2203/0786 , H05K2203/081 , H05K2203/1461 , Y10S134/902 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , Y10T428/13
摘要： It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.
摘要翻译： 通过去除受影响的材料和形成孔时产生的异物，可以获得清洁的高质量电路板。 电路基板的制造方法包括：（a）通过将作为掩模的膜材料粘合到基板材料上来制备薄膜基板材料，（b）通过向其施加激光而在薄膜基板材料上形成孔 ，（c）通过超声波清洗，不从膜材剥离薄膜材料，从薄膜基板材料上选择性除去粘附在薄膜基板材料上的不必要的材料。 当形成孔时产生诸如异物等不必要的材料，并且不需要的材料粘附到基板材料上。 在去除这种不必要的材料之后，使用膜材料作为掩模将导电材料设置在孔中，并且膜材料随后从基板材料中去除。
-
18.发明授权公开(公告)号：US06409869B1
公开(公告)日：2002-06-25
申请号：US09355455
申请日：1999-09-15
IPC分类号： B23K2600
CPC分类号： H05K3/0032 , H05K3/227 , H05K3/4069 , H05K2201/0355 , H05K2203/081 , H05K2203/085 , H05K2203/1383 , H05K2203/1388 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T156/1056 , Y10T156/1062 , Y10T428/24994 , Y10T442/2902
摘要： A method for manufacturing a printed wiring board, comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability printed wiring board.
-
19.发明授权公开(公告)号：US06518515B2
公开(公告)日：2003-02-11
申请号：US09976376
申请日：2001-10-12
申请人： Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hidenori Hayashi , Toru Fujimoto , Toshiharu Okada , Izuru Nakai
发明人： Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hidenori Hayashi , Toru Fujimoto , Toshiharu Okada , Izuru Nakai
IPC分类号： H01R909
CPC分类号： H05K3/4069 , H05K1/0366 , H05K3/0032 , H05K2201/0278 , H05K2201/0355 , H05K2201/09581 , H05K2203/1136 , H05K2203/1461 , Y10T29/49165 , Y10T428/24917 , Y10T428/249953 , Y10T428/249996
摘要： In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.
摘要翻译： 在制造双层或多层印刷线路板的过程中，利用辐射能在衬底的穿孔过程中，在孔的内壁上形成通过变换衬底材料产生的变质物质层。 变质物质层防止形成在孔的内壁上的导电材料在衬底的表面上分散或渗透到衬底中。
-
20.发明授权Process for producing zeolite film, and zeolite film obtained by the process 有权制备沸石膜的方法和通过该方法获得的沸石膜公开(公告)号：US08697760B2
公开(公告)日：2014-04-15
申请号：US13433081
申请日：2012-03-28
申请人： Shinji Nakamura , Makiko Niino , Makoto Miyahara
发明人： Shinji Nakamura , Makiko Niino , Makoto Miyahara
CPC分类号： C01B39/04 , B01D53/228 , B01D67/0046 , B01D67/0051 , B01D69/02 , B01D71/028 , B01D2325/04 , C01B39/48
摘要： A process for producing a zeolite film is provided in which seed crystals thinly adhere to the surface of a support to form a thin and even zeolite film having fewer defects than conventional zeolite films. Also provided is a zeolite film obtained by the producing process. The process for producing the zeolite film comprises: a particle adhesion step of allowing a slurry, where zeolite particles which become seeds are dispersed, to flow down on the surface of a base material by the self-weight of the slurry, so that the zeolite particles adhere to the base material; and a film formation step of immersing the base material, to which the zeolite particles adhere, into a sol to carry out hydrothermal synthesis, thereby forming the zeolite film on the base material.
摘要翻译： 提供了一种制备沸石膜的方法，其中晶种与载体的表面轻薄地粘合以形成比常规沸石膜具有更少缺陷的薄而均匀的沸石膜。 还提供了通过制备方法获得的沸石膜。 制造沸石膜的方法包括：粒子粘合步骤，其中使分散有成为种子的沸石颗粒的浆料通过浆料的自身重量在基材的表面上向下流动，使得沸石 颗粒附着在基材上; 以及成膜步骤，将沉积有沸石颗粒的基材浸入溶胶中进行水热合成，从而在基材上形成沸石膜。
-
-
-
-
-
-
-
-
-
搜索结果
134 条记录 (耗时 0.029 秒)
