Projection type video display
    11.
    发明授权
    Projection type video display 失效
    投影型视频显示

    公开(公告)号:US07207679B2

    公开(公告)日:2007-04-24

    申请号:US10878356

    申请日:2004-06-29

    CPC分类号: G03B21/2053

    摘要: A video signal processing circuit inputs a video signal to perform processing such as frequency conversion as well as processing for generating data representing the APL (Average Picture Level) of a frame video for each frame period. A microcomputer functions as a dimmer arithmetic block to perform processing for generating dimmer data upon receipt of APL data, and functions as a lamp driver control block to perform processing for sending out a dimmer command to a lamp driver. The lamp driver receives the dimmer command, to control an amount of light emitted from a light source (a lamp).

    摘要翻译: 视频信号处理电路输入视频信号以执行诸如频率转换的处理,以及用于在每个帧周期中产生表示帧视频的APL(平均画面电平)的数据的处理。 微计算机用作调光算术块,以在接收到APL数据时执行用于产生调光器数据的处理,并且用作灯驱动器控制块,以执行向灯驱动器发送调光器命令的处理。 灯驱动器接收调光器命令,以控制从光源(灯)发出的光量。

    Dispensing device and mounting system
    13.
    发明授权
    Dispensing device and mounting system 失效
    点胶装置和安装系统

    公开(公告)号:US07753253B2

    公开(公告)日:2010-07-13

    申请号:US11594766

    申请日:2006-11-09

    IPC分类号: B29C31/00 H01L23/29 B23K1/012

    摘要: A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser (73) provided in the chamber (52) and discharging underfill agent introduced from the storing means (66, 67) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means (46) for reducing the pressure in the chamber (52) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser (73). The dispensing device (4) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device (4) is also provided by the invention.

    摘要翻译: 用于将底部填充剂填充到基板(K)和芯片(C)之间的间隙中的分配装置(4)包括用于存储底部填充剂(66,67)的装置,用于容纳基板(K)的室(52) 装有底部填充剂并且能够打开/关闭;设置在室(52)中的分配器(73),并将从存储装置(66,67)引入的底部填充剂排放到基板(K)和 以及用于在由分配器(73)排出底部填充剂之前以预定的真空压力减小腔室(52)中的压力的​​第一减压装置(46)。 分配装置(4)可以向衬底(K)提供没有气泡的底部填充剂。 本发明还提供使用该分配装置(4)的安装系统。

    Packaging system
    14.
    发明申请
    Packaging system 失效
    包装系统

    公开(公告)号:US20090011538A1

    公开(公告)日:2009-01-08

    申请号:US11887212

    申请日:2006-03-13

    IPC分类号: H01L21/00

    摘要: A mounting system is provided with a substrate loader section, a chip mounting section, and a substrate unloader section for sequentially taking out substrates whereupon chips are mounted. The mounting system is characterized in that the substrate loader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates, a stage heater for heating/heat insulating a substrate is provided, respectively, at a substrate conveying portion from a substrate waiting stage for the chip mounting section to the chip mounting section, at the chip mounting section, and at a substrate conveying portion from the chip mounting section to the substrate unloader section, and the substrate unloader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates whereupon chips are mounted. The substrate can be sustained at a desirable temperature over the substantially entire mounting process having a series of steps, and in particular, occurrence of problems ascribed to moisture absorption can be suppressed or prevented.

    摘要翻译: 安装系统设置有基板装载部分,芯片安装部分和基板卸载部分,用于顺序取出安装芯片的基板。 安装系统的特征在于,基板装载部分设置有能够将基板与能够容纳多个基板的基板隔套一起隔热的烘箱,分别设置用于加热/隔热基板的台加热器, 在从芯片安装部的基板等待台到芯片安装部,芯片安装部以及从芯片安装部到基板卸载部的基板输送部的基板输送部,基板卸载部是 提供了能够将基板与能够容纳多个基板并因此安装芯片的基板隔套一起烘烤的炉。 可以在具有一系列步骤的基本上整个安装过程中将基材维持在期望的温度,并且特别地,可以抑制或防止归因于吸湿的问题的发生。

    Masking material
    16.
    发明授权
    Masking material 失效
    掩蔽材料

    公开(公告)号:US06462160B1

    公开(公告)日:2002-10-08

    申请号:US09763849

    申请日:2001-02-27

    IPC分类号: C08F11208

    CPC分类号: B05B12/20 B05B12/26

    摘要: A masking member is provided that can be used repeatedly even for surface treatments at a high temperature. The masking member includes a plastic produced by polymerization using a metallocene compound as a catalyst or a polymer alloy containing such a plastic.

    摘要翻译: 提供了能够在高温下进行表面处理而重复使用的掩模构件。 掩模构件包括通过使用茂金属化合物作为催化剂进行聚合制备的塑料或含有这种塑料的聚合物合金。

    Photodetector for receiving an index signal of a beam-index cathode-ray
tube
    17.
    发明授权
    Photodetector for receiving an index signal of a beam-index cathode-ray tube 失效
    用于接收光束索引阴极射线管的索引信号的光检测器

    公开(公告)号:US4894531A

    公开(公告)日:1990-01-16

    申请号:US106847

    申请日:1987-10-13

    CPC分类号: H04N9/24 H01J29/89

    摘要: A photodetector including a planar light guide of a polygonal shape in which organic phosphor is dispersed in a transparent support material, and a pair of photoelectric conversion elements such that light having a wavelength range for exciting the organic phosphor is introduced into the light guide and light generated from the organic phosphor upon the excitation is guided to the photoelectric conversion elements sensitive to a wavelength of the light generated from the organic phosphor. The light guide is formed, at opposite end portions of its one side, with a pair of light emitting surfaces and the photoelectric conversion elements are, respectively, provided at the light emitting end surfaces such that a light receiving surface of each of the photoelectric conversion elements confronts each of the light emitting end surfaces.

    摘要翻译: 一种光电检测器,包括多边形形状的平面光导,其中有机荧光体分散在透明支撑材料中,以及一对光电转换元件,使得具有用于激发有机磷光体的波长范围的光被引入光导和光 在激发时从有机荧光体产生的光被导入对从有机荧光体产生的光的波长敏感的光电转换元件。 光导在其一侧的相对端部形成有一对发光面,并且光电转换元件分别设置在发光端面,使得光电转换中的每一个的光接收表面 元件面对每个发光端面。

    Dispensing device and mounting system
    19.
    发明申请
    Dispensing device and mounting system 失效
    点胶装置和安装系统

    公开(公告)号:US20070111400A1

    公开(公告)日:2007-05-17

    申请号:US11594766

    申请日:2006-11-09

    IPC分类号: H01L21/00

    摘要: A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser (73) provided in the chamber (52) and discharging underfill agent introduced from the storing means (66, 67) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means (46) for reducing the pressure in the chamber (52) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser (73). The dispensing device (4) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device (4) is also provided by the invention.

    摘要翻译: 用于将底部填充剂填充到基板(K)和芯片(C)之间的间隙中的分配装置(4)包括用于存储底部填充剂(66,67)的装置,用于容纳基板(K)的室(52) 装有底部填充剂并且能够打开/关闭;设置在室(52)中的分配器(73),并将从存储装置(66,67)引入的底部填充剂排放到基板(K)和 以及用于在由分配器(73)排出底部填充剂之前以预定的真空压力减小腔室(52)中的压力的​​第一减压装置(46)。 分配装置(4)可以向衬底(K)提供没有气泡的底部填充剂。 本发明还提供使用该分配装置(4)的安装系统。

    Method of high-speed and accurate alignment using a chip mounting device
    20.
    发明授权
    Method of high-speed and accurate alignment using a chip mounting device 失效
    使用芯片安装装置高速准确对准的方法

    公开(公告)号:US06961994B2

    公开(公告)日:2005-11-08

    申请号:US10221142

    申请日:2001-03-08

    摘要: A mounting device including a plurality of heads, each holding a chip, arranged on a circle, is used to realize accurate and high-speed mounting. A mounting device comprises a plurality of heads with calibration marks, first recognition mechanism fixed in a chip mounting position, and second recognition mechanism fixed in another position. Prior to mounting operation, the first recognition mechanism and the second recognition mechanism recognize and store the positions of the calibration marks of the heads. In mounting operation, the first recognition mechanism recognizes the positions of a substrate and the calibration marks of the heads, whereas the second recognition mechanism recognizes the positions of chips attracted on the heads. The heads are moved vertically to adjust plane to be recognized. The chip and the substrate are aligned according to the position information obtained by the recognition mechanisms, and the chips are mounted.

    摘要翻译: 使用包括设置在圆周上的多个头部的安装装置来实现准确和高速的安装。 安装装置包括具有校准标记的多个头部,固定在芯片安装位置的第一识别机构和固定在另一位置的第二识别机构。 在安装操作之前,第一识别机构和第二识别机构识别和存储头部的校准标记的位置。 在安装操作中,第一识别机构识别基板的位置和头的校准标记,而第二识别机构识别吸头头部的位置。 头垂直移动以调整平面以被识别。 芯片和基板根据识别机构获得的位置信息进行对准,并安装芯片。