Method of characterizing a device
    11.
    发明申请
    Method of characterizing a device 审中-公开
    表征设备的方法

    公开(公告)号:US20160003888A1

    公开(公告)日:2016-01-07

    申请号:US14321841

    申请日:2014-07-02

    CPC classification number: G01R31/2621

    Abstract: A method of characterizing a device may be used to determine a metal work function of the device according to a threshold voltage, a body effect, and an oxide capacitance of the device. The threshold voltage may be determined according to a current to voltage curve. The oxide capacitance may be determined according to a capacitor to voltage curve.

    Abstract translation: 可以使用表征器件的方法来根据器件的阈值电压,体效应和氧化物电容来确定器件的金属功函数。 可以根据电流 - 电压曲线来确定阈值电压。 可以根据电容器对电压曲线来确定氧化物电容。

    METHOD FOR DERIVING CHARACTERISTIC VALUES OF MOS TRANSISTOR
    14.
    发明申请
    METHOD FOR DERIVING CHARACTERISTIC VALUES OF MOS TRANSISTOR 有权
    用于衍射MOS晶体管特性值的方法

    公开(公告)号:US20140343880A1

    公开(公告)日:2014-11-20

    申请号:US13894021

    申请日:2013-05-14

    CPC classification number: G01R19/0084 G01R31/2621

    Abstract: A method for deriving characteristic values of a MOS transistor is described. A set of ηk values is provided. A set of VBi values (i=1 to M, M≧3) is provided. A set of RSDi,j (i=1 to M−1, j=i+1 to M) values each under a pair of VBi and VBj, or a set of Vtq—q,j (q is one of 1 to M, j is 1 to M excluding q) values under VBq is derived for each ηk, with an iteration method. The ηk value making the set of RSDi,j values or Vtq—q,j values closest to each other is determined as an accurate ηk value. The mean value of RSDi,j at the accurate ηk value is calculated as an accurate RSD value.

    Abstract translation: 描述用于导出MOS晶体管的特性值的方法。 提供了一组&eegr k值。 提供一组VBi值(i = 1〜M,M≥3)。 一组RSDi,j(i = 1〜M-1,j = i + 1〜M)的值分别为一对VBi和VBj,或一组Vtq-q,j(q为1〜M ,j为1到M,不包括q)使用迭代方法为每个&eegr k导出VBq下的值。 使得最接近的RSDi,j值或Vtq-q,j值的集合被确定为精确的k值。 RSDi,j在精确的k值的平均值被计算为准确的RSD值。

    Layout pattern of magnetoresistive random access memory

    公开(公告)号:US12190926B2

    公开(公告)日:2025-01-07

    申请号:US18108025

    申请日:2023-02-10

    Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region, a first gate pattern extending from the first cell region to the third cell region along a first direction, a first diffusion region extending from the first cell region to the second cell region along a second direction, a first metal pattern adjacent to one side of the first gate pattern and overlapping the first diffusion region, a source line pattern extending from the first cell region to the second cell region along the second direction, and a first spin orbit torque (SOT) pattern extending along the first direction and overlapping the first metal pattern and the source line pattern.

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