METHOD TO FABRICATE III-N SEMICONDUCTOR DEVICES ON THE N-FACE OF LAYERS WHICH ARE GROWN IN THE III-FACE DIRECTION USING WAFER BONDING AND SUBSTRATE REMOVAL
    13.
    发明申请
    METHOD TO FABRICATE III-N SEMICONDUCTOR DEVICES ON THE N-FACE OF LAYERS WHICH ARE GROWN IN THE III-FACE DIRECTION USING WAFER BONDING AND SUBSTRATE REMOVAL 审中-公开
    使用波形焊接和基板去除在III面形成的层的N面上制造III-N半导体器件的方法

    公开(公告)号:US20090085065A1

    公开(公告)日:2009-04-02

    申请号:US12059907

    申请日:2008-03-31

    摘要: A method for fabricating III-N semiconductor devices on the N-face of layers comprising (a) growing a III-nitride semiconductor device structure in a Ga-polar direction on a substrate, (b) attaching a Ga face of the III-nitride semiconductor device structure to a host substrate, and (c) removing the substrate to expose the N-face surface of the III-nitride semiconductor device structure. An N-polar (000-1) oriented III-nitride semiconductor device is also disclosed, comprising one or more (000-1) oriented nitride layers, each having an N-face opposite a group III-face, wherein at least one N-face is an at least partially exposed N-face, and a host substrate attached to one of the group III-faces.

    摘要翻译: 一种用于在层的N面上制造III-N半导体器件的方法,包括(a)在衬底上生长Ga极性方向上的III族氮化物半导体器件结构,(b)将III族氮化物的Ga面 半导体器件结构,以及(c)去除衬底以露出III族氮化物半导体器件结构的N面。 还公开了一种N极(000-1)取向的III族氮化物半导体器件,其包括一个或多个(000-1)取向的氮化物层,每个具有与III族面相反的N面,其中至少一个N 表面是至少部分暴露的N面,以及附着到III组面中的一个的主体衬底。

    Polarization-doped field effect transistors (POLFETS) and materials and methods for making the same
    14.
    发明申请
    Polarization-doped field effect transistors (POLFETS) and materials and methods for making the same 有权
    极化掺杂场效应晶体管(POLFETS)及其制作方法

    公开(公告)号:US20060231860A1

    公开(公告)日:2006-10-19

    申请号:US11241804

    申请日:2005-09-29

    IPC分类号: H01L31/00

    摘要: Novel GaN/AlGaN metal-semiconductor field-effect transistor (MESFET) structures grown without any impurity doping in the channel. A high-mobility polarization-induced bulk channel charge is created by grading the channel region linearly from GaN to Al0.3Ga0.7N over a distance, e.g., 1000 Å. A polarization-doped field effect transistor (PolFET) was fabricated and tested under DC and RF conditions. A current density of 850 mA/mm and transconductance of 93 mS/mm was observed under DC conditions. Small-signal characterization of 0.7 μm gate length devices had a cutoff frequency, ƒτ=19 GHz, and a maximum oscillation of ƒmax=46 GHz. The PolFETs perform better than comparable MESFETs with impurity-doped channels, and are suitable for high microwave power applications. An important advantage of these devices over AlGaN/GaN HEMTs is that the transconductance vs. gate voltage profile can be tailored by compositional grading for better large-signal linearity.

    摘要翻译: 新型GaN / AlGaN金属半导体场效应晶体管(MESFET)结构在通道中没有任何杂质掺杂生长。 高迁移率极化诱导的体通道电荷是通过使沟道区域在一定距离(例如)1000处从GaN线性地分级至Al 0.3 N 0.7 N N N而产生的。 在DC和RF条件下制造和测试偏振掺杂场效应晶体管(PolFET)。 在直流条件下观察到电流密度为850mA / mm,跨导为93mS / mm。 0.7μm门极长度器件的小信号表征具有截止频率f T T T = 19GHz,f max max = 46GHz的最大振荡。 PolFET比具有杂质掺杂通道的可比MESFET性能更好,适用于高微波功率应用。 这些器件对AlGaN / GaN HEMT的一个重要优点是跨导与栅极电压分布可以通过组合分级来定制,以获得更好的大信号线性度。