公开(公告)号：US08008769B2

公开(公告)日：2011-08-30

申请号：US12150047

申请日：2008-04-23

申请人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/34

CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L25/03 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.

摘要翻译： 公开了一种散热半导体封装结构及其制造方法。 该方法包括：在至少半导体芯片和封装单元上布置并电连接到芯片载体; 在所述封装单元的顶表面上设置有经由所述平坦部分具有平坦部分和支撑部分的散热元件; 在由散热元件的平坦部分和支撑部分形成的接收空间中接收封装单元和半导体芯片; 以及在芯片载体密封剂上形成以封装封装单元，半导体芯片和散热元件。 散热元件消散封装单元产生的热量，提供EMI屏蔽，防止封装单元与密封剂之间的分层，降低热阻，防止开裂。

公开(公告)号：US07889511B2

公开(公告)日：2011-02-15

申请号：US12535397

申请日：2009-08-04

申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

IPC分类号： H05K7/10

CPC分类号： H01R43/0256 ,  H01R43/0228 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a second sidewall of each of the two bond pads. The first sidewall is perpendicular to an alignment direction of the bond pads and the second sidewall is parallel to the alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the second sidewall of the at least one bond pad and a corresponding side of the corresponding opening.

摘要翻译： 提供一种电子载体板，包括载体，形成在载体上的至少两个成对的接合焊盘和覆盖载体的保护层。 保护层形成有与两个接合焊盘相对应的开口。 开口沿相同方向排列，并暴露两个接合焊盘中的每一个的至少第一侧壁和第二侧壁。 第一侧壁垂直于接合焊盘的对准方向，第二侧壁平行于接合焊盘的对准方向。 至少一个接合焊盘的第一侧壁和对应的一个开口的对应侧之间的距离比至少一个接合焊盘的第二侧壁和相应的侧面之间的距离大至少约50μm 的相应开口。

公开(公告)号：US07573722B2

公开(公告)日：2009-08-11

申请号：US11654273

申请日：2007-01-16

申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

IPC分类号： H05K7/10

CPC分类号： H01R43/0256 ,  H01R43/0228 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a fourth sidewall of each of the two bond pads. The first sidewall and the fourth sidewall are both perpendicular to an alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the fourth sidewall of the at least one bond pad and a corresponding side of the corresponding opening.

摘要翻译： 提供一种电子载体板，包括载体，形成在载体上的至少两个成对的接合焊盘和覆盖载体的保护层。 保护层形成有与两个接合焊盘相对应的开口。 开口沿相同的方向排列，并暴露两个接合焊盘中的每一个的至少第一侧壁和第四侧壁。 第一侧壁和第四侧壁都垂直于接合焊盘的对准方向。 至少一个接合焊盘的第一侧壁与对应的一个开口的对应侧之间的距离比至少一个接合焊盘的第四侧壁与相应的侧面之间的距离大至少约50微米 的相应开口。

公开(公告)号：US20070164084A1

公开(公告)日：2007-07-19

申请号：US11654273

申请日：2007-01-16

申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

IPC分类号： A47J36/02

CPC分类号： H01R43/0256 ,  H01R43/0228 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a second sidewall of each of the two bond pads. The first sidewall is perpendicular to an alignment direction of the bond pads and the second sidewall is parallel to the alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the second sidewall of the at least one bond pad and a corresponding side of the corresponding opening.

摘要翻译： 提供一种电子载体板，包括载体，形成在载体上的至少两个成对的接合焊盘和覆盖载体的保护层。 保护层形成有与两个接合焊盘相对应的开口。 开口沿相同方向排列，并暴露两个接合焊盘中的每一个的至少第一侧壁和第二侧壁。 第一侧壁垂直于接合焊盘的对准方向，第二侧壁平行于接合焊盘的对准方向。 至少一个接合焊盘的第一侧壁和对应的一个开口的对应侧之间的距离比至少一个接合焊盘的第二侧壁和相应侧面之间的距离大至少约50μm 的相应开口。

公开(公告)号：US20090288866A1

公开(公告)日：2009-11-26

申请号：US12535397

申请日：2009-08-04

申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

IPC分类号： H05K1/16 ,  H05K1/02

CPC分类号： H01R43/0256 ,  H01R43/0228 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a second sidewall of each of the two bond pads. The first sidewall is perpendicular to an alignment direction of the bond pads and the second sidewall is parallel to the alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the second sidewall of the at least one bond pad and a corresponding side of the corresponding opening.

摘要翻译： 提供一种电子载体板，包括载体，形成在载体上的至少两个成对的接合焊盘和覆盖载体的保护层。 保护层形成有与两个接合焊盘相对应的开口。 开口沿相同方向排列，并暴露两个接合焊盘中的每一个的至少第一侧壁和第二侧壁。 第一侧壁垂直于接合焊盘的对准方向，第二侧壁平行于接合焊盘的对准方向。 至少一个接合焊盘的第一侧壁与对应的一个开口的对应侧之间的距离比至少一个接合焊盘的第二侧壁和相应侧面之间的距离大至少约50μm 的相应开口。