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公开(公告)号：US06180867B2
公开(公告)日：2001-01-30
申请号：US09395135
申请日：1999-09-13
申请人： Kristina Helena Valborg Hedengren , William Paul Kornrumpf , Mark Lloyd Miller , Beale Hibbs Opsahl-Ong , Egidijus Edward Uzgiris
发明人： Kristina Helena Valborg Hedengren , William Paul Kornrumpf , Mark Lloyd Miller , Beale Hibbs Opsahl-Ong , Egidijus Edward Uzgiris
IPC分类号： H01L3500
摘要： A thermal sensor array includes a dielectric layer including a plurality of individual thermal sensors and a pattern of deposited electrical interconnections facing at least one surface of the dielectric layer for providing electrical connections from each of the plurality of individual thermal sensors, the dielectric layer and the pattern of deposited electrical interconnections being surface-conformable. The thermal sensor array can be used in a diagnostic tool that further includes: a scanning device coupled to the pattern of deposited electrical interconnections for obtaining sensor signals from the thermal sensors; and a computer for processing the sensor signals to estimate temperature distributions.
摘要翻译： 热传感器阵列包括介电层，其包括多个单独的热传感器和面向电介质层的至少一个表面的沉积电互连图案，用于提供从多个单个热传感器，电介质层和 沉积电互连的图案是表面一致的。 所述热传感器阵列可用于诊断工具，所述诊断工具还包括：耦合到所述沉积电互连图案的扫描装置，用于从所述热传感器获得传感器信号; 以及用于处理传感器信号以估计温度分布的计算机。
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公开(公告)号：US5909004A
公开(公告)日：1999-06-01
申请号：US632809
申请日：1996-04-17
摘要： A thermocouple array includes a dielectric layer having via openings therethrough, a first patterned conductive layer facing one surface of the dielectric layer, and a second patterned conductive layer facing another surface of the dielectric layer. Portions of the second patterned conductive layer can extend through the via openings to couple respective portions of the first patterned conductive layer. The second patterned conductive layer has a different thermal emf than the first patterned conductive layer. The dielectric layer, the first patterned conductive layer, and the second patterned conductive layer can be surface-conformable.
摘要翻译： 热电偶阵列包括具有穿过其中的通路开口的电介质层，面向电介质层的一个表面的第一图案化导电层和面向电介质层另一表面的第二图案化导电层。 第二图案化导电层的一部分可以延伸穿过通路开口以耦合第一图案化导电层的相应部分。 第二图案化导电层具有与第一图案化导电层不同的热emf。 电介质层，第一图案化导电层和第二图案化导电层可以是表面一致的。
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13.发明授权Multilayer eddy current probe array for complete coverage of an inspection surface without mechanical scanning 失效多层涡流探头阵列，无需机械扫描即可完整覆盖检测表面
公开(公告)号：US5659248A
公开(公告)日：1997-08-19
申请号：US632182
申请日：1996-04-15
CPC分类号： G01N27/9013 , G01N27/82
摘要： An eddy current surface measurement array structure for complete coverage of an underlying inspection surface without requiring mechanical scanning is disclosed. A three-dimensional array of eddy current sense elements is organized as a plurality of layers of two-dimensional sub-arrays. The sub-arrays, although in different layers, are essentially identical in configuration, and are staggered such that the sense elements of one layer provide at least partial coverage of portions of the inspection surface not covered by the sense elements of another layer. As many staggered layers are included as are necessary to ensure that no "blind spots" remain, for complete coverage of the underlying inspection surface. The sense elements are disposed in a layered flexible structure fabricated employing high density interconnect fabrication techniques or other photolithographic techniques. Static (electronic) scanning is employed, by individual layer and by row and column within each layer, to form a two-dimensional image of the inspection surface.
摘要翻译： 公开了一种用于完全覆盖底层检查表面而不需要机械扫描的涡流表面测量阵列结构。 涡流感测元件的三维阵列被组织为多层二维子阵列。 子阵列尽管在不同的层中基本上在相同的结构上并且交错，使得一层的感测元件至少部分地覆盖检查表面的未被另一层的感测元件覆盖的部分。 包括许多交错的层，以确保不存在“盲点”，以完全覆盖底层检查表面。 传感元件设置在使用高密度互连制造技术或其它光刻技术制造的分层柔性结构中。 使用静态（电子）扫描，通过单层和每层内的行和列来形成检查表面的二维图像。
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公开(公告)号：US06655011B1
公开(公告)日：2003-12-02
申请号：US09677718
申请日：2000-10-02
IPC分类号： H01H1100
CPC分类号： H01H1/0036 , H01H61/0107 , H01H2001/0042 , H01H2001/0073 , H01H2001/0084 , H01H2061/006 , Y10T29/49105 , Y10T29/49128 , Y10T29/49155
摘要： A switch structure having a base surface; a first high density interconnect (HDI) plastic interconnect layer overlying the base surface layer; a cavity within the HDI plastic interconnect layer; at least one patterned shape memory alloy (SMA) layer overlying the HDI plastic interconnect layer and the cavity, and at least one patterned conductive layer over the at least one patterned SMA layer; a fixed contact pad within the cavity and attached to the base surface and a movable contact pad attached to a portion of the first patterned SMA layer within the cavity such that when the first and second patterned SMA layers and the first and second patterned metallized layers are in a first stable position, the movable contact pad touches the fixed contact pad, thereby providing an electrical connection and forming a closed switch. The structure has a second stable position in which the SMA and metallized layers are flexed away from the cavity so that the contact pads are not in contact and form an open switch.
摘要翻译： 具有基面的开关结构; 覆盖基底表面层的第一高密度互连（HDI）塑料互连层; HDI塑料互连层内的空腔; 覆盖HDI塑料互连层和空腔的至少一个图案形状记忆合金（SMA）层，以及至少一个图案化的SMA层上的至少一个图案化导电层; 空腔内的固定接触焊盘并附接到基体表面，以及可移动接触垫，其附接到空腔内的第一图案化SMA层的一部分，使得当第一和第二图案化SMA层和第一和第二图案化金属化层为 在第一稳定位置，可动接触垫接触固定接触垫，由此提供电连接并形成闭合的开关。 该结构具有第二稳定位置，其中SMA和金属化层从空腔弯曲，使得接触焊盘不接触并形成开放的开关。
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公开(公告)号：US06419635B1
公开(公告)日：2002-07-16
申请号：US09635463
申请日：2000-08-11
申请人： Kristina Helena Valborg Hedengren , William Paul Kornrumpf , Mark Lloyd Miller , Egidijus Edward Uzgiris
发明人： Kristina Helena Valborg Hedengren , William Paul Kornrumpf , Mark Lloyd Miller , Egidijus Edward Uzgiris
IPC分类号： A61B500
CPC分类号： A61B5/01
摘要： An in situ breast tumor temperature profile measuring probe includes a rod, thermal sensors and electrical output leads. The thermal sensors are formed in spaced apart holes in an outer insulating layer of the rod and a common electrical input lead to provide an electrical input signal to the thermal sensors is disposed below and has portions exposed at the holes and electrically connected to the thermal sensors. The thermal sensors receive the electrical input signal from the common electrical input lead, sense the temperature of biological matter adjacent to the thermal sensors and produce an electrical output signal correlated thereto. Each electrical output lead mounted to the outer insulating layer is in electrical contact with a different one of the thermal sensors to receive the electrical output signal from the one thermal sensor and output the same.
摘要翻译： 原位乳腺肿瘤温度剖面测量探头包括杆，热传感器和电输出引线。 热传感器形成在杆的外部绝缘层中的间隔开的孔中，并且公共电输入引线提供到热传感器的电输入信号设置在下方并且具有暴露在孔处的部分并电连接到热传感器 。 热传感器接收来自公共电输入引线的电输入信号，感测与热传感器相邻的生物物质的温度，并产生与之相关的电输出信号。 安装到外绝缘层的每个电输出引线与不同的一个热传感器电接触，以接收来自一个热传感器的电输出信号并输出。
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16.发明授权Multiple electrode assembly with extendible electrodes and methods of fabrication and application 有权具有可扩展电极的多电极组件及其制造和应用方法公开(公告)号：US06415169B1
公开(公告)日：2002-07-02
申请号：US09583405
申请日：2000-05-31
申请人： William Paul Kornrumpf , Shankara Bonthu Reddy , David Anthony Lovejoy , Donald Eugene Brodnick
发明人： William Paul Kornrumpf , Shankara Bonthu Reddy , David Anthony Lovejoy , Donald Eugene Brodnick
IPC分类号： A61B50408
CPC分类号： A61B5/6841 , A61B5/04085
摘要： A flexible multiple electrode assembly includes at least one fixed electrode; at least one extendible electrode; and electrically conductive interconnections coupling the at least one fixed electrode and the at least one extendible electrode to a common connector. The at least one extendible electrode is adapted to be physically separable from the at least one fixed electrode while remaining electrically coupled to the common connector. In one embodiment, an array of fixed and extendible electrodes is configured for the acquisition of electrical pulses from a heart for transmission to an electrocardiograph (EKG or ECG) device.
摘要翻译： 柔性多电极组件包括至少一个固定电极; 至少一个可延伸电极; 以及将所述至少一个固定电极和所述至少一个可延伸电极耦合到公共连接器的导电互连。 所述至少一个可延伸电极适于在物理上与所述至少一个固定电极分离，同时保持电耦合到所述公共连接器。 在一个实施例中，固定和可延伸电极的阵列被配置用于从心脏获取电脉冲以传输到心电图仪（EKG或ECG）装置。
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17.发明授权Fabrication of compact magnetic circulator components in microwave packages using high density interconnections 失效使用高密度互连在微波封装中制造紧凑型磁环行器组件
公开(公告)号：US5776275A
公开(公告)日：1998-07-07
申请号：US734558
申请日：1996-10-21
申请人： Vikram Bidare Krishnamurthy , Kyung Wook Paik , Mario Ghezzo , William Paul Kornrumpf , Eric Joseph Wildi
发明人： Vikram Bidare Krishnamurthy , Kyung Wook Paik , Mario Ghezzo , William Paul Kornrumpf , Eric Joseph Wildi
CPC分类号： H01P1/387 , H01P11/00 , H05K1/0237 , H05K1/16 , H05K1/182 , Y10T29/4913 , Y10T29/49165
摘要： A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.
摘要翻译： 使用微波高密度互连（HDI）结构将磁性循环器结合到多芯片模块中。 预先包装的循环器可以插入现成的高密度互连多芯片模块中; 该预包装循环器可以使用具有在信号线上方和下方具有两个接地层的信号线的带状线设计，或者具有在信号线下方具有一个信号线和一个接地层的微带传输线设计。 或者，循环器可以直接制造在具有带状线或微带传输线设计的高密度互连多芯片模块中。
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公开(公告)号：US5730113A
公开(公告)日：1998-03-24
申请号：US570223
申请日：1995-12-11
CPC分类号： H01L21/78 , B06B1/0622 , Y10T29/42 , Y10T29/49016
摘要： An array ultrasonic transducer precursor includes a body of piezoelectric material with a dielectric substrate bonded to a surface of the body. Circuit elements supported on the dielectric substrate include, in an active region, physically parallel signal conductors arranged in a pattern with spaces between adjacent ones of the conductors. Dicing saw cuts made in these spaces define individual circuit elements within the piezoelectric body. The circuit elements outside the active region include a set of resistive alignment elements in predetermined positions with reference to the pattern of signal conductors. The transducer precursor is mounted in a dicing saw fixture, and initial cuts made with the dicing saw remove portions of the resistive alignment elements. Locations of the initial cuts with reference to the resistive alignment elements are determined by measuring resistances of the resistive alignment elements after the initial cuts.
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