摘要:
A driving device includes a driving control unit that reads out the signal charge generated by at least the charge generating section for a low-sensitivity pixel signal to the charge transfer section, after the predetermined timing, continues incidence of the electromagnetic wave and, after continuing the incidence of the electromagnetic wave, reads out the signal charge generated by at least the charge generating section for a high-sensitivity pixel signal to the charge transfer section, transfers the signal charge read out to the charge transfer section through the charge transfer section, and, concerning at least one of the signal charges for the high-sensitivity pixel signal and the low-sensitivity pixel signal, every time the signal charge is read out to the charge transfer section, transfers the signal charge read out to the charge transfer section through the charge transfer section without retaining the signal charge in the charge transfer section.
摘要:
A solid-state image pickup device including a charge transferrer to transfer a signal charge obtained through photoelectric conversion; a floating diffusion region; a reset means for resetting the potential of the floating diffusion region; and a current source for supplying, to the floating diffusion region, a signal charge corresponding to the quantity of the signal charge transferred by the charge transferrer. The current source such as a current mirror circuit is interposed between the output stage of a horizontal CCD and the floating diffusion region so as to supply thereto a signal charge corresponding to the quantity of the signal charge transferred by the horizontal CCD, hence separating the horizontal CCD and the floating diffusion region potentially from each other, whereby the supply voltage, i.e., the reset voltage for the floating diffusion region, can be set independently of the potential of the horizontal CCD.
摘要:
In a CCD image apparatus in which an image section is horizontally divided into two areas, two horizontal CCDs are related to the two image areas with one-to-one correspondence and transfer the signal electric charges of the two image areas, and the two horizontal CCDs are driven in an identical direction by the same horizontal-driving pulses.
摘要:
In a solid-state image pickup device, third transfer electrodes are disposed in parallel to vertical transfer registers, and second transfer electrodes are disposed vertically to the vertical transfer registers. These transfer electrodes are also formed on the read-out gate portions to supply a driving voltage for reading out signal charges from photoelectric conversion elements. On the basis of the driving voltage applied to both the third and second transfer electrodes, the read-out of the signal charges to the vertical transfer registers is carried out. At the portion where the read-out of the signal charges is carried out, the transfer electrode at the read-out gate portion side and the sensor area of the photoelectric conversion element are formed so as to be adjacent to each other. At the portion where no read-out of signal charges is carried out, an offset area is provided between the transfer electrode at the read-out gate portion side and the sensor area of the photoelectric conversion element.
摘要:
Disclosed is a method for fabricating a solid-state imaging device including a semiconductor substrate of a first conductivity type, a plurality of light-receiving sections provided at a distance in the surface region of the semiconductor substrate, and channel stop regions of a second conductivity type provided between the adjacent light-receiving sections in the surface region and in the internal region of the semiconductor substrate. The method includes the steps of forming a first photoresist layer having openings corresponding to positions at which the channel stop regions are formed; ion-implanting an impurity of a second conductivity type into the semiconductor substrate at a first energy through the first photoresist layer as a mask; forming a second photoresist layer having openings; and ion-implanting an impurity of a second conductivity type into the semiconductor substrate at a second energy through the second photoresist layer as a mask.
摘要:
A solid-state imaging device includes: a semiconductor substrate including a light receiving surface which is divided according to pixels arranged in a matrix shape and is formed with a photoelectric converting section; an electrochromic film which is formed on the semiconductor substrate on a light incident path corresponding to the photoelectric converting section, in a portion of pixels selected from the pixels, and has light transmittance changing from a first transmittance to a second transmittance according to voltage applied thereto; a lower electrode which is formed below the electrochromic film; and an upper electrode which is formed above the electrochromic film.
摘要:
A solid-state imaging device includes: a semiconductor substrate including a light receiving surface which is divided according to pixels arranged in a matrix shape and is formed with a photoelectric converting section; an electrochromic film which is formed on the semiconductor substrate on a light incident path corresponding to the photoelectric converting section, in a portion of pixels selected from the pixels, and has light transmittance changing from a first transmittance to a second transmittance according to voltage applied thereto; a lower electrode which is formed below the electrochromic film; and an upper electrode which is formed above the electrochromic film.
摘要:
A high-impedance substrate is provided, which includes a metallic plate employed as a ground plane, a resonance circuit layer spaced away from the metallic plate by a distance “t”, the resonance circuit layer being provided with at least two resonance circuits having the same height and disposed side by side with a distance “g”, a connecting component connecting the resonance circuit with the metallic plate, and a magnetic material layer interposed between the metallic plate and the resonance circuit layer. The distance “t” between the metallic plate and the resonance circuit layer is confined within the range of 0.1 to 10 mm, the distance “g” between neighboring resonance circuits is confined within the range of 0.01 to 5 mm, the distance “h” between the magnetic material layer and the resonance circuit layer is confined within the range represented by the following inequality 1: g/2≦h≦t/2 inequality 1.
摘要翻译:提供了一种高阻抗衬底,其包括用作接地面的金属板,与金属板隔开距离“t”的谐振电路层,谐振电路层设置有至少两个具有 并列配置有距离“g”,将谐振电路与金属板连接起来的连接部件以及介于金属板和谐振电路层之间的磁性体层。 金属板和谐振电路层之间的距离“t”限制在0.1至10mm的范围内,相邻谐振电路之间的距离“g”限制在0.01至5mm的范围内,距离“h” 在磁性材料层和谐振电路层之间限制在由以下不等式1表示的范围内:g / 2≦̸ h≦̸ t / 2不等式1。
摘要:
An insulating magnetic metal particle includes a magnetic metal particle containing at least one metal selected from the group consisting of Co, Fe, and Ni and having a diameter of 5 to 500 nm, a first inorganic insulating layer made of an oxide that covers the surface of the magnetic metal particle, and a second inorganic insulating layer made of an oxide that produces a eutectic crystal by reacting together with the first inorganic insulating layer at the time of heating them, the second inorganic insulating layer being coated on the first inorganic insulating layer. A thickness ratio of the second inorganic insulating layer with respect to the first inorganic insulating layer is set so that the first inorganic insulating layer remains on the surface of the magnetic metal particle after producing the eutectic crystal.