Semiconductor device and method of manufacturing the same
    11.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08680599B2

    公开(公告)日:2014-03-25

    申请号:US13207002

    申请日:2011-08-10

    IPC分类号: H01L27/108 H01L21/8242

    摘要: To provide a more reliable semiconductor device including a lower-cost and more reliable capacitor and a method of manufacturing the same. This manufacturing method comprises the steps of: preparing a semiconductor substrate; and forming, over one of the major surfaces of the semiconductor substrate, a first metal electrode including an aluminum layer, a dielectric layer over the first metal electrode, and a second metal electrode over the dielectric layer. In the step of forming the first metal electrode, the aluminum layer is formed so that the surface thereof satisfies a relationship of Rmax

    摘要翻译: 为了提供一种更可靠的半导体装置及其制造方法。 该制造方法包括以下步骤:制备半导体衬底; 以及在所述半导体衬底的一个主表面上形成第一金属电极,所述第一金属电极包括铝层,所述第一金属电极上的电介质层和所述电介质层上的第二金属电极。 在形成第一金属电极的步骤中,形成铝层,使得其表面满足Rmax <80nm,Rms <10nm和Ra <9nm的关系。 形成第一金属电极的步骤包括以下步骤:形成至少一个第一阻挡层; 在所述第一阻挡层上形成所述铝层; 并使构成铝层的结晶重结晶。

    AIR PRE-TREATMENT DEVICE
    12.
    发明申请
    AIR PRE-TREATMENT DEVICE 有权
    空气预处理装置

    公开(公告)号:US20110303086A1

    公开(公告)日:2011-12-15

    申请号:US13058944

    申请日:2010-06-15

    IPC分类号: B03C3/68 B01D46/00

    摘要: The present technology provides an air pre-treatment and monitoring device that includes an inlet port configured to receive an air flow and an outlet port configured to expel the air flow. The illustrative air pre-treatment device further includes a multiple-stage filter arranged between the inlet and outlet ports and that is configured to filter particles from the air flow.

    摘要翻译: 本技术提供了一种空气预处理和监测装置,其包括构造成接收空气流的入口端口和被配置为排出空气流的出口端口。 示例性空气预处理装置还包括布置在入口和出口之间的多级过滤器,并且被配置为从空气流中过滤颗粒。

    Oscillation control device and synchronization system
    13.
    发明授权
    Oscillation control device and synchronization system 有权
    振荡控制装置和同步系统

    公开(公告)号:US07647032B2

    公开(公告)日:2010-01-12

    申请号:US11541634

    申请日:2006-10-03

    IPC分类号: H04B1/16 H04B1/06

    CPC分类号: H03L7/00

    摘要: An oscillation control device for controlling a frequency of an oscillator located at the remote site from a standard laboratory having a standard oscillator. The control device includes: a comparison section to compare a frequency of the frequency signal synchronized with a radio signal produced by a signal processing section with a frequency of a oscillation signal outputted from an oscillator to be controlled, an acquisition section to obtain, through a communication network, a comparison result which is obtained by a comparison of a frequency of the standard oscillator held by the standard laboratory and a frequency of the radio signal, a calculation section to calculate deviation between the frequency of the oscillator to be controlled and the frequency of the standard oscillator based on their comparison, and a control section to control the frequency of the oscillator to be controlled, based on the deviation calculated.

    摘要翻译: 一种振荡控制装置,用于从具有标准振荡器的标准实验室控制位于远端的振荡器的频率。 控制装置包括:比较部,其将与由信号处理部生成的无线信号同步的频率信号的频率与从被控制的振荡器输出的振荡信号的频率进行比较;获取部, 通信网络,通过比较由标准实验室保持的标准振荡器的频率和无线电信号的频率获得的比较结果,计算部分,用于计算要控制的振荡器的频率与频率之间的偏差 基于其比较的标准振荡器,以及基于计算的偏差来控制要控制的振荡器的频率的控制部分。

    Oscillation control device and synchronization system
    14.
    发明申请
    Oscillation control device and synchronization system 有权
    振荡控制装置和同步系统

    公开(公告)号:US20070077902A1

    公开(公告)日:2007-04-05

    申请号:US11541634

    申请日:2006-10-03

    IPC分类号: H04B1/18

    CPC分类号: H03L7/00

    摘要: An oscillation control device for controlling a frequency of an oscillator located at the remote site from a standard laboratory having a standard oscillator. The control device includes: a comparison section to compare a frequency of the frequency signal synchronized with a radio signal produced by a signal processing section with a frequency of a oscillation signal outputted from an oscillator to be controlled, an acquisition section to obtain, through a communication network, a comparison result which is obtained by a comparison of a frequency of the standard oscillator held by the standard laboratory and a frequency of the radio signal, a calculation section to calculate deviation between the frequency of the oscillator to be controlled and the frequency of the standard oscillator based on their comparison, and a control section to control the frequency of the oscillator to be controlled, based on the deviation calculated.

    摘要翻译: 一种振荡控制装置,用于从具有标准振荡器的标准实验室控制位于远端的振荡器的频率。 控制装置包括:比较部,其将与由信号处理部生成的无线信号同步的频率信号的频率与从被控制的振荡器输出的振荡信号的频率进行比较;获取部, 通信网络,通过比较由标准实验室保持的标准振荡器的频率和无线电信号的频率获得的比较结果,计算部分,用于计算要控制的振荡器的频率与频率之间的偏差 基于其比较的标准振荡器,以及基于计算的偏差来控制要控制的振荡器的频率的控制部分。

    Interconnection structure
    15.
    发明申请
    Interconnection structure 审中-公开
    互连结构

    公开(公告)号:US20070029677A1

    公开(公告)日:2007-02-08

    申请号:US11488634

    申请日:2006-07-19

    IPC分类号: H01L23/48

    摘要: An interconnection structure includes a lower interconnection layer formed on a substrate and composed of a copper layer, an interlayer insulating layer formed on the lower interconnection layer and having a via reaching the lower interconnection layer, an upper interconnection layer electrically connected to the lower interconnection layer through the via, and composed of a copper layer formed in the interlayer insulating layer, and a barrier metal layer formed between the upper interconnection layer and the interlayer insulating layer. The barrier metal layer has an opening in a bottom portion of the via, and through that opening, the upper interconnection layer comes in direct contact with the lower interconnection layer in the bottom portion of the via. Thus, an interconnection structure suppressing concentration of voids in an interconnection under a via due to stress migration can be attained.

    摘要翻译: 互连结构包括形成在基板上并由铜层构成的下互连层,形成在下布线层上并具有到达下互连层的通孔的层间绝缘层,与互连层下电连接的上互连层 并且由形成在层间绝缘层中的铜层构成,以及形成在上互连层和层间绝缘层之间的阻挡金属层。 阻挡金属层在通孔的底部具有开口,并且通过该开口,上互连层与通孔的底部中的下互连层直接接触。 因此,可以获得抑制由于应力迁移导致的通孔内的互连中的空隙浓度的互连结构。

    Method of producing semiconductor wafer
    16.
    发明授权
    Method of producing semiconductor wafer 有权
    半导体晶圆的制造方法

    公开(公告)号:US06273791B1

    公开(公告)日:2001-08-14

    申请号:US09319968

    申请日:1999-06-14

    IPC分类号: B24B100

    摘要: A method of producing a semiconductor wafer, which can prevent the breakage of a wafer, and also can reduce the working time in a series of operations attended by back surface grinding of the semiconductor wafer. The method involves producing a semiconductor wafer wherein an adhesive tape is applied on the surface of the semiconductor wafer and, after grinding the back surface of the semiconductor wafer using a grinding machine, the adhesive tape is peeled off, said process comprises using an adhesive tape having heat shrinkability as the adhesive tape, grinding the back surface of the semiconductor wafer and heating the adhesive tape in the grinding machine, thereby peeling off the adhesive tape from the surface of the semiconductor wafer.

    摘要翻译: 一种半导体晶片的制造方法,其能够防止晶片的破损,并且还可以减少半导体晶片的背面研磨所引起的一系列操作中的工作时间。 该方法包括制造半导体晶片,其中将粘合带施加在半导体晶片的表面上,并且在使用研磨机研磨半导体晶片的背表面之后,将胶带剥离,所述方法包括使用胶带 作为粘合带具有热收缩性,研磨半导体晶片的背面并加热研磨机中的粘合带,从而从半导体晶片的表面剥离粘合带。

    Method of producing ink jet print head
    17.
    发明授权
    Method of producing ink jet print head 失效
    喷墨打印头的制造方法

    公开(公告)号:US5479685A

    公开(公告)日:1996-01-02

    申请号:US206759

    申请日:1994-03-07

    IPC分类号: B41J2/16 H01L41/22 B41J2/045

    摘要: A method of producing an ink jet print head includes the steps of forming separate ink paths with a predetermined pattern on a head base; fixing a vibration plate to a separate ink path side of the head base; temporarily fixing a piezoelectric element to a dummy substrate; patterning the piezoelectric element in accordance with the pattern of the separate ink paths of the head base to form separate piezoelectric elements: sticking a piezoelectric element side of the dummy substrate to the vibration plate so that the separate piezoelctric elements on the dummy substrate respectively correspond to the separate ink paths of the head base; and removing the dummy substrate.

    摘要翻译: 一种制造喷墨打印头的方法包括以下步骤:在头基部上形成具有预定图案的分开的油墨通道; 将振动板固定到头基座的单独墨路径侧; 将压电元件临时固定到虚设衬底; 根据头基座的分开的油墨路径的图案图案化压电元件,以形成分离的压电元件:将虚拟基板的压电元件侧粘贴到振动板上,使得虚拟基板上的分离的压电元件分别对应于 头基座的独立油墨路径; 并去除虚设衬底。

    Acoustic wave filter
    18.
    发明授权
    Acoustic wave filter 有权
    声波滤波器

    公开(公告)号:US07728699B2

    公开(公告)日:2010-06-01

    申请号:US12359424

    申请日:2009-01-26

    IPC分类号: H03H9/145 H03H9/64

    CPC分类号: H03H9/6436 H03H9/1452

    摘要: A longitudinally coupled resonator acoustic wave filter device that utilizes an inter-IDT resonance mode with a reduced insertion loss has a structure in which apodization weights are assigned in first to third IDTs having narrow pitch electrode finger portions in portions other than the narrow pitch electrode finger portions, such that the electrode finger overlap width sequentially varies in an acoustic wave propagating direction in which an acoustic wave propagates, and portions of the IDTs located at ends adjacent to the narrow pitch electrode finger portions have a maximum electrode finger overlap width.

    摘要翻译: 利用具有减小的插入损耗的IDT间谐振模式的纵向耦合谐振器声波滤波器装置具有这样的结构,其中,在窄间距电极指之外的部分中,在具有窄间距电极指部分的第一至第三IDT中分配变迹权重 使得电极指重叠宽度在声波传播的声波传播方向上顺序变化,并且位于与窄间距电极指部相邻的端部处的IDT的部分具有最大电极指重叠宽度。

    Ink jet recording apparatus and drive unit and method for ink jet head
    19.
    发明授权
    Ink jet recording apparatus and drive unit and method for ink jet head 有权
    喷墨记录装置及喷墨头的驱动装置及方法

    公开(公告)号:US06371599B1

    公开(公告)日:2002-04-16

    申请号:US09295644

    申请日:1999-04-20

    IPC分类号: B41J204

    摘要: The present invention relates to an ink jet recording apparatus using an electrostatic actuator. The present invention provides an ink jet recording apparatus comprising a resilient oscillating plate that is facing a pressure chamber that communicates with a nozzle, a first electrode provided on said oscillating plate, a second electrode opposing said first electrode across a space, and a voltage application unit that applies across the first electrode and the second electrode a first voltage that causes the ink in said pressure chamber to be ejected and a second voltage that does not cause the ink to be ejected, wherein said second voltage is applied a specified time prior to the application of the first voltage, so that the residual electrical charges on the first electrode and/or the second electrode can be positively discharged.

    摘要翻译: 本发明涉及使用静电致动器的喷墨记录装置。 本发明提供一种喷墨记录装置,其特征在于,包括:弹性振动板,其面向与喷嘴连通的压力室,设置在所述振动板上的第一电极,跨越空间与所述第一电极相对的第二电极,以及电压施加 单元,其跨过第一电极和第二电极施加使得所述压力室中的墨水被喷射的第一电压和不引起墨水喷射的第二电压,其中所述第二电压在 施加第一电压,使得第一电极和/或第二电极上的残留电荷能够被正确地排出。

    Preparation process of semiconductor wafer
    20.
    发明授权
    Preparation process of semiconductor wafer 失效
    半导体晶圆的制备工艺

    公开(公告)号:US6159827A

    公开(公告)日:2000-12-12

    申请号:US285702

    申请日:1999-04-05

    摘要: An object of the invention is to provide a preparation process of a semiconductor wafer, in which breakage of the wafer on grinding the back surface of the wafer and on peeling the adhesive tape is prevented, and the operation time can be reduced. The preparation process of a semiconductor wafer comprises the steps of: adhering an adhesive tape on a front surface of a semiconductor wafer; grinding a back surface of the semiconductor wafer by a grinding machine; peeling the adhesive tape; and cleaning the front surface of the semiconductor wafer, wherein an adhesive tape having heat shrinkability is used as the adhesive tape, and after grinding the back surface of the semiconductor wafer, warm water at a temperature of from 50 to 99.degree. C. is poured to peel the adhesive tape in a wafer cleaning machine, and the front surface of the semiconductor wafer is cleaned in the wafer cleaning machine.

    摘要翻译: 本发明的目的是提供一种半导体晶片的制备方法,其中防止在研磨晶片的背面和剥离胶带时晶片破损,并且可以降低操作时间。 半导体晶片的制备方法包括以下步骤:将粘合带粘附在半导体晶片的前表面上; 通过研磨机研磨半导体晶片的背面; 剥去胶带; 并且清洗半导体晶片的前表面,其中使用具有热收缩性的粘合带作为粘合带,并且在研磨半导体晶片的背表面之后,将温度为50至99℃的温水倒入 将晶片清洗机中的胶带剥离,在晶圆清洗机中清洗半导体晶片的前表面。