公开(公告)号：US20070068796A1

公开(公告)日：2007-03-29

申请号：US11463406

申请日：2006-08-09

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

IPC分类号： C23C14/32 ,  C23C14/00

CPC分类号： C23C14/3407 ,  H01J37/3435 ,  H01J37/3479 ,  H01J37/3482

摘要： A method and system for detecting a lifetime of a slab of consumable material used by a process tool. In the method and system, the slab of consumable material is provided with at least one indicator. A determination is made as to whether a value of a signal generated by a detector associated with the at least one indicator during operation of the process tool is equal to a warning setting value, is between the warning setting value and an alarm setting value, is equal to an alarm setting value, or is above the alarm setting value. A first warning is provided if the value of the signal is equal to the warning setting value or between the warning setting value and the alarm setting value, the first warning indicating that the slab of consumable material is approaching a predetermined quantity which is less than an original quantity of the slab of consumable material. A second warning is provided if the value of the signal is between the warning setting value and the alarm setting value, the second warning indicating that the slab of consumable material is approaching the predetermined quantity. An alarm is provided if the value of the signal is equal to the alarm setting value or above the alarm setting value, the alarm indicating that the slab of consumable material is approaching the predetermined quantity or has been reduced to the predetermined quantity.

摘要翻译： 一种用于检测由加工工具使用的消耗材料的板坯的寿命的方法和系统。 在该方法和系统中，消耗材料板具有至少一个指示器。 确定在处理工具的操作期间由与至少一个指示器相关联的检测器产生的信号的值是否等于警告设置值，在警告设置值和报警设置值之间是否为 等于报警设定值，或高于报警设定值。 如果信号的值等于警告设定值或者在警告设定值和警报设定值之间，则提供第一警告，第一警告指示消耗材料的平板接近预定量小于 消耗材料板坯的原始数量。 如果信号值在警告设定值和报警设定值之间，则第二警告提供，第二警告指示消耗材料的板坯接近预定量。 如果信号的值等于报警设定值或报警设定值以上，则指示消耗材料的板坯接近预定量或已经减少到预定量的报警。

公开(公告)号：US20080121526A1

公开(公告)日：2008-05-29

申请号：US11563515

申请日：2006-11-27

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

IPC分类号： C25D5/04 ,  C25D17/10 ,  C25D17/00

CPC分类号： C25D17/12 ,  C25D7/123 ,  C25D17/001

摘要： An adjustable anode assembly for a wet processing apparatus to allow selective tuning of the electrical field density distribution within a wet process chemical of the apparatus, which in turn allows the process specification or specifications to be selectively varied across the process surface of a wafer when processed by the apparatus. The adjustable anode assembly includes an anode which may be divided into several plates, at least one of which is capable of being moved from a first plane to at least a second plane.

摘要翻译： 一种用于湿处理设备的可调节阳极组件，用于允许选择性地调节设备的湿法化学品中的电场密度分布，这又允许在处理过程中跨过晶片的工艺表面选择性地改变工艺规格或规格 通过该装置。 可调节阳极组件包括阳极，该阳极可分为多个板，其中至少一个能够从第一平面移动到至少第二平面。

公开(公告)号：US20070068803A1

公开(公告)日：2007-03-29

申请号：US11427602

申请日：2006-06-29

申请人： Yi-Li Hsiao ,  Jerry Hwang ,  Jyh-Cherng Sheu ,  Lawrance Sheu ,  Jean Wang ,  Chen-Hua Yu

发明人： Yi-Li Hsiao ,  Jerry Hwang ,  Jyh-Cherng Sheu ,  Lawrance Sheu ,  Jean Wang ,  Chen-Hua Yu

IPC分类号： C23C14/00

CPC分类号： C23C14/54 ,  C23C14/3407 ,  C23C14/3414 ,  H01J37/3435 ,  H01J37/3479 ,  H01J37/3482

摘要： A PVD target structure for use in physical vapor deposition. The PVD target structure includes a consumable slab of source material and one or more detectors for indicating when the slab of source material is approaching or has been reduced to a given quantity representing a service lifetime endpoint of the target structure.

摘要翻译： 用于物理气相沉积的PVD靶结构。 PVD目标结构包括源材料的可消耗板和一个或多个检测器，用于指示源材料的板块何时接近或已经被减少到表示目标结构的使用寿命终点的给定量。

公开(公告)号：US07642100B2

公开(公告)日：2010-01-05

申请号：US11559781

申请日：2006-11-14

申请人： Chen-Hua Yu ,  Lawrance Sheu ,  Yi-Li Hsiao ,  Francis Ko

发明人： Chen-Hua Yu ,  Lawrance Sheu ,  Yi-Li Hsiao ,  Francis Ko

IPC分类号： H01L21/66

CPC分类号： H01L22/14 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor processing method includes processing a first substrate while detecting at least one first processing parameter value in a first apparatus. The first processing parameter is analyzed, thereby yielding at least one first predicted parameter value. The first predicted parameter value is compared with a first pre-defined parameter value, thereby yielding at least one first comparison result. A first recipe is applied corresponding to the first comparison result for processing a second substrate in the first apparatus.

摘要翻译： 半导体处理方法包括在检测第一装置中的至少一个第一处理参数值的同时处理第一基板。 分析第一处理参数，从而产生至少一个第一预测参数值。 将第一预测参数值与第一预定义参数值进行比较，从而产生至少一个第一比较结果。 对应于用于处理第一装置中的第二基板的第一比较结果应用第一配方。

公开(公告)号：US20080064127A1

公开(公告)日：2008-03-13

申请号：US11559781

申请日：2006-11-14

申请人： Chen-Hua Yu ,  Lawrance Sheu ,  Yi-Li Hsiao ,  Francis Ko

发明人： Chen-Hua Yu ,  Lawrance Sheu ,  Yi-Li Hsiao ,  Francis Ko

IPC分类号： H01L21/66

CPC分类号： H01L22/14 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor processing method includes processing a first substrate while detecting at least one first processing parameter value in a first apparatus. The first processing parameter is analyzed, thereby yielding at least one first predicted parameter value. The first predicted parameter value is compared with a first pre-defined parameter value, thereby yielding at least one first comparison result. A first recipe is applied corresponding to the first comparison result for processing a second substrate in the first apparatus.

摘要翻译： 半导体处理方法包括在检测第一装置中的至少一个第一处理参数值的同时处理第一基板。 分析第一处理参数，从而产生至少一个第一预测参数值。 将第一预测参数值与第一预定义参数值进行比较，从而产生至少一个第一比较结果。 对应于用于处理第一装置中的第二基板的第一比较结果应用第一配方。

公开(公告)号：US20080295412A1

公开(公告)日：2008-12-04

申请号：US11755508

申请日：2007-05-30

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Jui-Pin Hung ,  Ming-Shih Yeh

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Jui-Pin Hung ,  Ming-Shih Yeh

IPC分类号： E06B7/16 ,  H01L21/00

CPC分类号： H01L21/67373 ,  H01L21/67376 ,  H01L21/67389

摘要： An apparatus includes an enclosure and a door configured to seal the enclosure. The door includes a plate. A rotational apparatus is disposed over the plate. At least one first member with a first arm extends from a first rib of the first member. At least one second member with a second arm extends from a second rib of the second member. The first and second arms are connected to the rotational apparatus. At least one corner member has a first edge. The first edge has a shape corresponding to a shape of a corner of the frame. The corner member is connected to a first end of the third arm. A second end of the third arm is connected to the rotational apparatus. A sealing material is disposed along a first longitudinal side of the first rib and a second longitudinal side of the second rib.

摘要翻译： 一种装置包括外壳和构造成密封外壳的门。 门包括一个板。 旋转装置设置在板上。 具有第一臂的至少一个第一构件从第一构件的第一肋延伸。 具有第二臂的至少一个第二构件从第二构件的第二肋延伸。 第一和第二臂连接到旋转装置。 至少一个角部件具有第一边缘。 第一边缘具有与框架的角部的形状对应的形状。 角部件连接到第三臂的第一端。 第三臂的第二端连接到旋转装置。 密封材料沿着第一肋的第一纵向侧面和第二肋的第二纵向侧面设置。

公开(公告)号：US08827695B2

公开(公告)日：2014-09-09

申请号：US12435861

申请日：2009-05-05

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

IPC分类号： F27D15/00 ,  H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67772 ,  H01L21/67017 ,  Y10S414/135

摘要： A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.

摘要翻译： 公开了一种半导体制造系统，接口系统，载体和用于提供环境受控环境的方法。 半导体制造系统包括多个处理室; 至少一个接口系统，其中所述接口系统包括第一环境控制元件; 至少一个载体，其中载体包括第二环境控制元件; 以及耦合到所述多个处理室，所述至少一个接口系统和所述至少一个载体的控制模块。

公开(公告)号：US07758338B2

公开(公告)日：2010-07-20

申请号：US11754789

申请日：2007-05-29

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Fu-Kang Tien ,  Jui-Pin Hung

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Fu-Kang Tien ,  Jui-Pin Hung

IPC分类号： F27B5/16

CPC分类号： H01L21/67017 ,  H01L21/67393 ,  H01L21/67772

摘要： An apparatus includes a first enclosure, a first door, at least one first valve, at least one inlet diffuser and at least one substrate holder. The first enclosure has a first opening. The first door is configured to seal the first opening. The first valve is coupled to the first enclosure. The inlet diffuser is coupled to the first valve and configured to provide a first gas with a temperature substantially higher than a temperature of an environment around the first enclosure. Each substrate holder disposed within the first enclosure supports at least one substrate.

摘要翻译： 一种装置包括第一外壳，第一门，至少一个第一阀，至少一个入口扩散器和至少一个基板支架。 第一个外壳具有第一个开口。 第一个门被配置为密封第一个开口。 第一阀联接到第一外壳。 入口扩散器联接到第一阀并且被配置为提供具有基本上高于围绕第一外壳的环境的温度的温度的第一气体。 设置在第一外壳内的每个衬底保持器支撑至少一个衬底。

公开(公告)号：US20060023395A1

公开(公告)日：2006-02-02

申请号：US11085354

申请日：2005-03-21

申请人： Yi-Li Hsiao ,  Tse-Yi Chen ,  Jerry Hwang ,  Chin-Hsin Peng ,  Jean Wang ,  Chen-Hua Yu

发明人： Yi-Li Hsiao ,  Tse-Yi Chen ,  Jerry Hwang ,  Chin-Hsin Peng ,  Jean Wang ,  Chen-Hua Yu

IPC分类号： H01T23/00

CPC分类号： H01L21/6831 ,  H01L21/67109

摘要： Systems and methods for temperature control of semiconductor wafers are provided. An exemplary embodiment of semiconductor wafer is held by an electrostatic chuck. An exemplary embodiment of system includes a cooling apparatus connecting the electrostatic chuck. The cooling apparatus comprises an inlet, an outlet, a porous flow layer, a porous contact layer contacting the electrostatic chuck, and a porous heat exchange layer disposed between the flow layer and the contact layer. The inlet communicates with the flow layer, and the outlet communicates with the contact layer. The fluid medium is introduced into the flow layer from the inlet and sequentially flows through the heat exchange layer and the contact layer. The fluid medium is discharged from the contact layer through the outlet, thereby exchanging heat from the semiconductor wafer.

摘要翻译： 提供了用于半导体晶片温度控制的系统和方法。 半导体晶片的示例性实施例由静电卡盘保持。 系统的示例性实施例包括连接静电卡盘的冷却装置。 冷却装置包括入口，出口，多孔流动层，与静电卡盘接触的多孔接触层和设置在流动层和接触层之间的多孔热交换层。 入口与流动层连通，出口与接触层连通。 流体介质从入口引入流层，并依次流过热交换层和接触层。 流体介质通过出口从接触层排出，从而交换来自半导体晶片的热量。

公开(公告)号：US20090317214A1

公开(公告)日：2009-12-24

申请号：US12435861

申请日：2009-05-05

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

IPC分类号： H01L21/00 ,  H01L21/677 ,  H01L21/67 ,  B65D81/26 ,  F25B29/00

CPC分类号： H01L21/67772 ,  H01L21/67017 ,  Y10S414/135

摘要： A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.

摘要翻译： 公开了一种半导体制造系统，接口系统，载体和用于提供环境受控环境的方法。 半导体制造系统包括多个处理室; 至少一个接口系统，其中所述接口系统包括第一环境控制元件; 至少一个载体，其中载体包括第二环境控制元件; 以及耦合到所述多个处理室，所述至少一个接口系统和所述至少一个载体的控制模块。