公开(公告)号：US20080298933A1

公开(公告)日：2008-12-04

申请号：US11754789

申请日：2007-05-29

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Fu-Kang Tien ,  Jui-Pin Hung

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Fu-Kang Tien ,  Jui-Pin Hung

IPC分类号： H01L21/00

CPC分类号： H01L21/67017 ,  H01L21/67393 ,  H01L21/67772

摘要： An apparatus includes a first enclosure, a first door, at least one first valve, at least one inlet diffuser and at least one substrate holder. The first enclosure has a first opening. The first door is configured to seal the first opening. The first valve is coupled to the first enclosure. The inlet diffuser is coupled to the first valve and configured to provide a first gas with a temperature substantially higher than a temperature of an environment around the first enclosure. Each substrate holder disposed within the first enclosure supports at least one substrate.

摘要翻译： 一种装置包括第一外壳，第一门，至少一个第一阀，至少一个入口扩散器和至少一个基板支架。 第一个外壳具有第一个开口。 第一个门被配置为密封第一个开口。 第一阀联接到第一外壳。 入口扩散器联接到第一阀并且被配置为提供具有基本上高于围绕第一外壳的环境的温度的温度的第一气体。 设置在第一外壳内的每个衬底保持器支撑至少一个衬底。

公开(公告)号：US07758338B2

公开(公告)日：2010-07-20

申请号：US11754789

申请日：2007-05-29

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Fu-Kang Tien ,  Jui-Pin Hung

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Fu-Kang Tien ,  Jui-Pin Hung

IPC分类号： F27B5/16

CPC分类号： H01L21/67017 ,  H01L21/67393 ,  H01L21/67772

摘要： An apparatus includes a first enclosure, a first door, at least one first valve, at least one inlet diffuser and at least one substrate holder. The first enclosure has a first opening. The first door is configured to seal the first opening. The first valve is coupled to the first enclosure. The inlet diffuser is coupled to the first valve and configured to provide a first gas with a temperature substantially higher than a temperature of an environment around the first enclosure. Each substrate holder disposed within the first enclosure supports at least one substrate.

摘要翻译： 一种装置包括第一外壳，第一门，至少一个第一阀，至少一个入口扩散器和至少一个基板支架。 第一个外壳具有第一个开口。 第一个门被配置为密封第一个开口。 第一阀联接到第一外壳。 入口扩散器联接到第一阀并且被配置为提供具有基本上高于围绕第一外壳的环境的温度的温度的第一气体。 设置在第一外壳内的每个衬底保持器支撑至少一个衬底。

公开(公告)号：US20080295412A1

公开(公告)日：2008-12-04

申请号：US11755508

申请日：2007-05-30

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Jui-Pin Hung ,  Ming-Shih Yeh

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Jui-Pin Hung ,  Ming-Shih Yeh

IPC分类号： E06B7/16 ,  H01L21/00

CPC分类号： H01L21/67373 ,  H01L21/67376 ,  H01L21/67389

摘要： An apparatus includes an enclosure and a door configured to seal the enclosure. The door includes a plate. A rotational apparatus is disposed over the plate. At least one first member with a first arm extends from a first rib of the first member. At least one second member with a second arm extends from a second rib of the second member. The first and second arms are connected to the rotational apparatus. At least one corner member has a first edge. The first edge has a shape corresponding to a shape of a corner of the frame. The corner member is connected to a first end of the third arm. A second end of the third arm is connected to the rotational apparatus. A sealing material is disposed along a first longitudinal side of the first rib and a second longitudinal side of the second rib.

摘要翻译： 一种装置包括外壳和构造成密封外壳的门。 门包括一个板。 旋转装置设置在板上。 具有第一臂的至少一个第一构件从第一构件的第一肋延伸。 具有第二臂的至少一个第二构件从第二构件的第二肋延伸。 第一和第二臂连接到旋转装置。 至少一个角部件具有第一边缘。 第一边缘具有与框架的角部的形状对应的形状。 角部件连接到第三臂的第一端。 第三臂的第二端连接到旋转装置。 密封材料沿着第一肋的第一纵向侧面和第二肋的第二纵向侧面设置。

公开(公告)号：US20090317214A1

公开(公告)日：2009-12-24

申请号：US12435861

申请日：2009-05-05

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

IPC分类号： H01L21/00 ,  H01L21/677 ,  H01L21/67 ,  B65D81/26 ,  F25B29/00

CPC分类号： H01L21/67772 ,  H01L21/67017 ,  Y10S414/135

摘要： A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.

摘要翻译： 公开了一种半导体制造系统，接口系统，载体和用于提供环境受控环境的方法。 半导体制造系统包括多个处理室; 至少一个接口系统，其中所述接口系统包括第一环境控制元件; 至少一个载体，其中载体包括第二环境控制元件; 以及耦合到所述多个处理室，所述至少一个接口系统和所述至少一个载体的控制模块。

公开(公告)号：US08827695B2

公开(公告)日：2014-09-09

申请号：US12435861

申请日：2009-05-05

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

IPC分类号： F27D15/00 ,  H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67772 ,  H01L21/67017 ,  Y10S414/135

摘要： A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.

摘要翻译： 公开了一种半导体制造系统，接口系统，载体和用于提供环境受控环境的方法。 半导体制造系统包括多个处理室; 至少一个接口系统，其中所述接口系统包括第一环境控制元件; 至少一个载体，其中载体包括第二环境控制元件; 以及耦合到所述多个处理室，所述至少一个接口系统和所述至少一个载体的控制模块。

公开(公告)号：US08109407B2

公开(公告)日：2012-02-07

申请号：US11755508

申请日：2007-05-30

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Jui-Pin Hung ,  Ming-Shih Yeh

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Jui-Pin Hung ,  Ming-Shih Yeh

IPC分类号： B65D45/28 ,  B65D53/06

CPC分类号： H01L21/67373 ,  H01L21/67376 ,  H01L21/67389

摘要： An apparatus includes an enclosure and a door configured to seal the enclosure. The door includes a plate. A rotational apparatus is disposed over the plate. At least one first member with a first arm extends from a first rib of the first member. At least one second member with a second arm extends from a second rib of the second member. The first and second arms are connected to the rotational apparatus. At least one corner member has a first edge. The first edge has a shape corresponding to a shape of a corner of the frame. The corner member is connected to a first end of the third arm. A second end of the third arm is connected to the rotational apparatus. A sealing material is disposed along a first longitudinal side of the first rib and a second longitudinal side of the second rib.

摘要翻译： 一种装置包括外壳和构造成密封外壳的门。 门包括一个板。 旋转装置设置在板上。 具有第一臂的至少一个第一构件从第一构件的第一肋延伸。 具有第二臂的至少一个第二构件从第二构件的第二肋延伸。 第一和第二臂连接到旋转装置。 至少一个角部件具有第一边缘。 第一边缘具有与框架的角部的形状对应的形状。 角部件连接到第三臂的第一端。 第三臂的第二端连接到旋转装置。 密封材料沿着第一肋的第一纵向侧面和第二肋的第二纵向侧面设置。

公开(公告)号：US20090142903A1

公开(公告)日：2009-06-04

申请号：US12054097

申请日：2008-03-24

申请人： Chen-Hua Yu ,  Jui-Pin Hung ,  Weng-Jin Wu ,  Jean Wang ,  Wen-Chih Chiou

发明人： Chen-Hua Yu ,  Jui-Pin Hung ,  Weng-Jin Wu ,  Jean Wang ,  Wen-Chih Chiou

IPC分类号： H01L21/30 ,  B29C65/00

CPC分类号： H01L25/50 ,  H01L21/67051 ,  H01L24/28 ,  H01L24/75 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/8301 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01094 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/19042 ,  Y10T156/14 ,  H01L2924/00

摘要： The present disclosure provides a bonding apparatus. The bonding apparatus includes a cleaning module designed for cleaning chips; and a chip-to-wafer bonding chamber configured to receive the chips from the cleaning module and designed for bonding the chips to a wafer.

摘要翻译： 本公开提供了一种接合装置。 接合装置包括设计用于清洁芯片的清洁模块; 以及芯片到晶片接合室，其被配置为从所述清洁模块接收所述芯片并被设计用于将所述芯片接合到晶片。

公开(公告)号：US08387674B2

公开(公告)日：2013-03-05

申请号：US12054097

申请日：2008-03-24

申请人： Chen-Hua Yu ,  Jui-Pin Hung ,  Weng-Jin Wu ,  Jean Wang ,  Wen-Chih Chiou

发明人： Chen-Hua Yu ,  Jui-Pin Hung ,  Weng-Jin Wu ,  Jean Wang ,  Wen-Chih Chiou

IPC分类号： B29C65/00

CPC分类号： H01L25/50 ,  H01L21/67051 ,  H01L24/28 ,  H01L24/75 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/8301 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01094 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/19042 ,  Y10T156/14 ,  H01L2924/00

摘要： The present disclosure provides a bonding apparatus. The bonding apparatus includes a cleaning module designed for cleaning chips; and a chip-to-wafer bonding chamber configured to receive the chips from the cleaning module and designed for bonding the chips to a wafer.

公开(公告)号：US08276648B2

公开(公告)日：2012-10-02

申请号：US13356950

申请日：2012-01-24

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

IPC分类号： B22D11/00

CPC分类号： C23C14/3407 ,  C23C14/3414 ,  H01J37/3435 ,  H01J37/3479 ,  H01J37/3482 ,  Y10T29/49826 ,  Y10T29/4998

摘要： A method for forming a tube-based detector for signaling when a PVD target is reduced to a predetermined quantity of the PVD target material includes providing a mold member having an inner molding member and an outer molding member defining a space therebetween, melting a desired tube material, injecting the molten tube material into the space between the inner molding member and the outer molding member, cooling the molten tube material, removing the tube from the mold member after the molten tube material has cooled and solidified into a tube, embedding the tube in the physical vapor deposition target, wherein the tube forms an enclosure of the tube-based detector.

摘要翻译： 一种用于形成用于在PVD靶减少到预定量的PVD靶材料时进行信号传导的基于管的检测器的方法包括提供具有内部模制构件的模具构件和在其间限定空间的外部模制构件，熔化所需的管 材料，将熔融管材注入内部模制件和外部模制件之间的空间中，冷却熔融管材料，在熔融管材冷却并固化成管之后，从模具构件中取出管子，将管子 在物理气相沉积靶中，其中管形成基于管的检测器的外壳。

公开(公告)号：US20120131784A1

公开(公告)日：2012-05-31

申请号：US13356950

申请日：2012-01-24

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

IPC分类号： B23P11/00

CPC分类号： C23C14/3407 ,  C23C14/3414 ,  H01J37/3435 ,  H01J37/3479 ,  H01J37/3482 ,  Y10T29/49826 ,  Y10T29/4998

摘要： A method for forming a tube-based detector for signaling when a PVD target is reduced to a predetermined quantity of the PVD target material includes providing a mold member having an inner molding member and an outer molding member defining a space therebetween, melting a desired tube material, injecting the molten tube material into the space between the inner molding member and the outer molding member, cooling the molten tube material, removing the tube from the mold member after the molten tube material has cooled and solidified into a tube, embedding the tube in the physical vapor deposition target, wherein the tube forms an enclosure of the tube-based detector.

摘要翻译： 一种用于形成用于在PVD靶减少到预定量的PVD靶材料时进行信号传导的基于管的检测器的方法包括提供具有内部模制构件的模具构件和在其间限定空间的外部模制构件，熔化所需的管 材料，将熔融管材注入内部模制件和外部模制件之间的空间中，冷却熔融管材料，在熔融管材冷却并固化成管之后，从模具构件中取出管子，将管子 在物理气相沉积靶中，其中管形成基于管的检测器的外壳。