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    Systems and methods for temperature control of semiconductor wafers
    1.
    发明申请
    Systems and methods for temperature control of semiconductor wafers 审中-公开
    半导体晶圆温度控制系统和方法

    公开(公告)号：US20060023395A1

    公开(公告)日：2006-02-02

    申请号：US11085354

    申请日：2005-03-21

    申请人： Yi-Li Hsiao ,  Tse-Yi Chen ,  Jerry Hwang ,  Chin-Hsin Peng ,  Jean Wang ,  Chen-Hua Yu

    发明人： Yi-Li Hsiao ,  Tse-Yi Chen ,  Jerry Hwang ,  Chin-Hsin Peng ,  Jean Wang ,  Chen-Hua Yu

    IPC分类号： H01T23/00

    CPC分类号： H01L21/6831 ,  H01L21/67109

    摘要： Systems and methods for temperature control of semiconductor wafers are provided. An exemplary embodiment of semiconductor wafer is held by an electrostatic chuck. An exemplary embodiment of system includes a cooling apparatus connecting the electrostatic chuck. The cooling apparatus comprises an inlet, an outlet, a porous flow layer, a porous contact layer contacting the electrostatic chuck, and a porous heat exchange layer disposed between the flow layer and the contact layer. The inlet communicates with the flow layer, and the outlet communicates with the contact layer. The fluid medium is introduced into the flow layer from the inlet and sequentially flows through the heat exchange layer and the contact layer. The fluid medium is discharged from the contact layer through the outlet, thereby exchanging heat from the semiconductor wafer.

    摘要翻译： 提供了用于半导体晶片温度控制的系统和方法。 半导体晶片的示例性实施例由静电卡盘保持。 系统的示例性实施例包括连接静电卡盘的冷却装置。 冷却装置包括入口，出口，多孔流动层，与静电卡盘接触的多孔接触层和设置在流动层和接触层之间的多孔热交换层。 入口与流动层连通，出口与接触层连通。 流体介质从入口引入流层，并依次流过热交换层和接触层。 流体介质通过出口从接触层排出，从而交换来自半导体晶片的热量。

    System and method for dry chamber temperature control
    4.
    发明申请
    System and method for dry chamber temperature control 审中-公开
    干室温度控制系统和方法

    公开(公告)号：US20050016467A1

    公开(公告)日：2005-01-27

    申请号：US10626998

    申请日：2003-07-24

    申请人： Yi-Li Hsiao ,  Mei-Sheng Zhou ,  Chin-Hsin Peng ,  Chien-Ling Huang ,  Tse-Yi Chen ,  Chun-Yi Lee ,  Hsueh-Chang Wu

    发明人： Yi-Li Hsiao ,  Mei-Sheng Zhou ,  Chin-Hsin Peng ,  Chien-Ling Huang ,  Tse-Yi Chen ,  Chun-Yi Lee ,  Hsueh-Chang Wu

    IPC分类号： C23C16/00 ,  H01L21/00

    CPC分类号： H01L21/67248 ,  H01J2237/2001 ,  H01L21/67109

    摘要： A system and method which is capable of compensating for unintended elevations in process temperatures induced in a substrate during a semiconductor fabrication process in order to reduce or eliminate disparities in critical dimensions of device features. The system may be a plasma etching system comprising a process chamber containing an electrostatic chuck (ESC) for supporting a wafer substrate. A chiller outside the process chamber includes a main coolant chamber, which contains a main coolant fluid, as well as an compensation coolant chamber, which contains an compensation coolant fluid. A main circulation loop normally circulates the main coolant fluid from the main coolant chamber through the electrostatic chuck to maintain the chuck at a desired set point temperature.

    摘要翻译： 一种系统和方法，其能够在半导体制造过程期间补偿在衬底中感应的工艺温度中的意外高度，以便减少或消除器件特征的关键尺寸的不均匀性。 该系统可以是包括含有用于支撑晶片衬底的静电吸盘（ESC）的处理室的等离子体蚀刻系统。 处理室外部的冷却器包括主冷却剂室，其包含主冷却剂流体，以及补偿冷却剂室，其包含补偿冷却剂流体。 主循环回路通常使主冷却剂流体从主冷却剂室通过静电吸盘循环，以将卡盘保持在所需的设定点温度。

    Adjustable anode assembly for a substrate wet processing apparatus
    5.
    发明授权
    Adjustable anode assembly for a substrate wet processing apparatus 有权
    一种用于基底湿法处理设备的可调阳极组件

    公开(公告)号：US08101052B2

    公开(公告)日：2012-01-24

    申请号：US11563515

    申请日：2006-11-27

    申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

    发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

    IPC分类号： C25D17/12 ,  C25B9/12

    CPC分类号： C25D17/12 ,  C25D7/123 ,  C25D17/001

    摘要： An adjustable anode assembly for a wet processing apparatus to allow selective tuning of the electrical field density distribution within a wet process chemical of the apparatus, which in turn allows the process specification or specifications to be selectively varied across the process surface of a wafer when processed by the apparatus. The adjustable anode assembly includes an anode which may be divided into several plates, at least one of which is capable of being moved from a first plane to at least a second plane.

    摘要翻译： 一种用于湿处理设备的可调节阳极组件，用于允许选择性地调节设备的湿法化学品中的电场密度分布，这又允许在处理过程中跨过晶片的工艺表面选择性地改变工艺规格或规格 通过该装置。 可调节阳极组件包括阳极，该阳极可分为多个板，其中至少一个能够从第一平面移动到至少第二平面。

    NOVEL WAFER'S AMBIANCE CONTROL
    6.
    发明申请
    NOVEL WAFER'S AMBIANCE CONTROL 有权
    新浪潮的安全控制

    公开(公告)号：US20090317214A1

    公开(公告)日：2009-12-24

    申请号：US12435861

    申请日：2009-05-05

    申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

    发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

    IPC分类号： H01L21/00 ,  H01L21/677 ,  H01L21/67 ,  B65D81/26 ,  F25B29/00

    CPC分类号： H01L21/67772 ,  H01L21/67017 ,  Y10S414/135

    摘要： A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.

    摘要翻译： 公开了一种半导体制造系统，接口系统，载体和用于提供环境受控环境的方法。 半导体制造系统包括多个处理室; 至少一个接口系统，其中所述接口系统包括第一环境控制元件; 至少一个载体，其中载体包括第二环境控制元件; 以及耦合到所述多个处理室，所述至少一个接口系统和所述至少一个载体的控制模块。

    Apparatus for storing substrates
    7.
    发明授权
    Apparatus for storing substrates 有权
    用于存储基板的装置

    公开(公告)号：US08109407B2

    公开(公告)日：2012-02-07

    申请号：US11755508

    申请日：2007-05-30

    申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Jui-Pin Hung ,  Ming-Shih Yeh

    发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Jui-Pin Hung ,  Ming-Shih Yeh

    IPC分类号： B65D45/28 ,  B65D53/06

    CPC分类号： H01L21/67373 ,  H01L21/67376 ,  H01L21/67389

    摘要： An apparatus includes an enclosure and a door configured to seal the enclosure. The door includes a plate. A rotational apparatus is disposed over the plate. At least one first member with a first arm extends from a first rib of the first member. At least one second member with a second arm extends from a second rib of the second member. The first and second arms are connected to the rotational apparatus. At least one corner member has a first edge. The first edge has a shape corresponding to a shape of a corner of the frame. The corner member is connected to a first end of the third arm. A second end of the third arm is connected to the rotational apparatus. A sealing material is disposed along a first longitudinal side of the first rib and a second longitudinal side of the second rib.

    摘要翻译： 一种装置包括外壳和构造成密封外壳的门。 门包括一个板。 旋转装置设置在板上。 具有第一臂的至少一个第一构件从第一构件的第一肋延伸。 具有第二臂的至少一个第二构件从第二构件的第二肋延伸。 第一和第二臂连接到旋转装置。 至少一个角部件具有第一边缘。 第一边缘具有与框架的角部的形状对应的形状。 角部件连接到第三臂的第一端。 第三臂的第二端连接到旋转装置。 密封材料沿着第一肋的第一纵向侧面和第二肋的第二纵向侧面设置。

    SUBSTRATE CARRIER, PORT APPARATUS AND FACILITY INTERFACE AND APPARATUS INCLUDING SAME
    8.
    发明申请
    SUBSTRATE CARRIER, PORT APPARATUS AND FACILITY INTERFACE AND APPARATUS INCLUDING SAME 有权
    底板承载器，端口装置和设备接口以及包括其中的设备

    公开(公告)号：US20080298933A1

    公开(公告)日：2008-12-04

    申请号：US11754789

    申请日：2007-05-29

    申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Fu-Kang Tien ,  Jui-Pin Hung

    发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Fu-Kang Tien ,  Jui-Pin Hung

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67017 ,  H01L21/67393 ,  H01L21/67772

    摘要： An apparatus includes a first enclosure, a first door, at least one first valve, at least one inlet diffuser and at least one substrate holder. The first enclosure has a first opening. The first door is configured to seal the first opening. The first valve is coupled to the first enclosure. The inlet diffuser is coupled to the first valve and configured to provide a first gas with a temperature substantially higher than a temperature of an environment around the first enclosure. Each substrate holder disposed within the first enclosure supports at least one substrate.

    摘要翻译： 一种装置包括第一外壳，第一门，至少一个第一阀，至少一个入口扩散器和至少一个基板支架。 第一个外壳具有第一个开口。 第一个门被配置为密封第一个开口。 第一阀联接到第一外壳。 入口扩散器联接到第一阀并且被配置为提供具有基本上高于围绕第一外壳的环境的温度的温度的第一气体。 设置在第一外壳内的每个衬底保持器支撑至少一个衬底。

    ADJUSTABLE ANODE ASSEMBLY FOR A SUBSTRATE WET PROCESSING APPARATUS
    9.
    发明申请
    ADJUSTABLE ANODE ASSEMBLY FOR A SUBSTRATE WET PROCESSING APPARATUS 有权
    可调式阳极装置用于基板湿处理装置

    公开(公告)号：US20080121526A1

    公开(公告)日：2008-05-29

    申请号：US11563515

    申请日：2006-11-27

    申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

    发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

    IPC分类号： C25D5/04 ,  C25D17/10 ,  C25D17/00

    CPC分类号： C25D17/12 ,  C25D7/123 ,  C25D17/001

    摘要： An adjustable anode assembly for a wet processing apparatus to allow selective tuning of the electrical field density distribution within a wet process chemical of the apparatus, which in turn allows the process specification or specifications to be selectively varied across the process surface of a wafer when processed by the apparatus. The adjustable anode assembly includes an anode which may be divided into several plates, at least one of which is capable of being moved from a first plane to at least a second plane.

    摘要翻译： 一种用于湿处理设备的可调节阳极组件，用于允许选择性地调节设备的湿法化学品中的电场密度分布，这又允许在处理过程中跨过晶片的工艺表面选择性地改变工艺规格或规格 通过该装置。 可调节阳极组件包括阳极，该阳极可分为多个板，其中至少一个能够从第一平面移动到至少第二平面。

    Wafer's ambiance control
    10.
    发明授权
    Wafer's ambiance control 有权
    晶圆的氛围控制

    公开(公告)号：US08827695B2

    公开(公告)日：2014-09-09

    申请号：US12435861

    申请日：2009-05-05

    申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

    发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

    IPC分类号： F27D15/00 ,  H01L21/677 ,  H01L21/67

    CPC分类号： H01L21/67772 ,  H01L21/67017 ,  Y10S414/135

    摘要： A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.

    摘要翻译： 公开了一种半导体制造系统，接口系统，载体和用于提供环境受控环境的方法。 半导体制造系统包括多个处理室; 至少一个接口系统，其中所述接口系统包括第一环境控制元件; 至少一个载体，其中载体包括第二环境控制元件; 以及耦合到所述多个处理室，所述至少一个接口系统和所述至少一个载体的控制模块。