Systems and methods for temperature control of semiconductor wafers
    1.
    发明申请
    Systems and methods for temperature control of semiconductor wafers 审中-公开
    半导体晶圆温度控制系统和方法

    公开(公告)号:US20060023395A1

    公开(公告)日:2006-02-02

    申请号:US11085354

    申请日:2005-03-21

    IPC分类号: H01T23/00

    CPC分类号: H01L21/6831 H01L21/67109

    摘要: Systems and methods for temperature control of semiconductor wafers are provided. An exemplary embodiment of semiconductor wafer is held by an electrostatic chuck. An exemplary embodiment of system includes a cooling apparatus connecting the electrostatic chuck. The cooling apparatus comprises an inlet, an outlet, a porous flow layer, a porous contact layer contacting the electrostatic chuck, and a porous heat exchange layer disposed between the flow layer and the contact layer. The inlet communicates with the flow layer, and the outlet communicates with the contact layer. The fluid medium is introduced into the flow layer from the inlet and sequentially flows through the heat exchange layer and the contact layer. The fluid medium is discharged from the contact layer through the outlet, thereby exchanging heat from the semiconductor wafer.

    摘要翻译: 提供了用于半导体晶片温度控制的系统和方法。 半导体晶片的示例性实施例由静电卡盘保持。 系统的示例性实施例包括连接静电卡盘的冷却装置。 冷却装置包括入口,出口,多孔流动层,与静电卡盘接触的多孔接触层和设置在流动层和接触层之间的多孔热交换层。 入口与流动层连通,出口与接触层连通。 流体介质从入口引入流层,并依次流过热交换层和接触层。 流体介质通过出口从接触层排出,从而交换来自半导体晶片的热量。

    PVD target with end of service life detection capability
    4.
    发明授权
    PVD target with end of service life detection capability 有权
    PVD目标,具有使用寿命检测功能

    公开(公告)号:US08276648B2

    公开(公告)日:2012-10-02

    申请号:US13356950

    申请日:2012-01-24

    IPC分类号: B22D11/00

    摘要: A method for forming a tube-based detector for signaling when a PVD target is reduced to a predetermined quantity of the PVD target material includes providing a mold member having an inner molding member and an outer molding member defining a space therebetween, melting a desired tube material, injecting the molten tube material into the space between the inner molding member and the outer molding member, cooling the molten tube material, removing the tube from the mold member after the molten tube material has cooled and solidified into a tube, embedding the tube in the physical vapor deposition target, wherein the tube forms an enclosure of the tube-based detector.

    摘要翻译: 一种用于形成用于在PVD靶减少到预定量的PVD靶材料时进行信号传导的基于管的检测器的方法包括提供具有内部模制构件的模具构件和在其间限定空间的外部模制构件,熔化所需的管 材料,将熔融管材注入内部模制件和外部模制件之间的空间中,冷却熔融管材料,在熔融管材冷却并固化成管之后,从模具构件中取出管子,将管子 在物理气相沉积靶中,其中管形成基于管的检测器的外壳。

    PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY
    5.
    发明申请
    PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY 有权
    PVD目标终止服务生命检测能力

    公开(公告)号:US20120131784A1

    公开(公告)日:2012-05-31

    申请号:US13356950

    申请日:2012-01-24

    IPC分类号: B23P11/00

    摘要: A method for forming a tube-based detector for signaling when a PVD target is reduced to a predetermined quantity of the PVD target material includes providing a mold member having an inner molding member and an outer molding member defining a space therebetween, melting a desired tube material, injecting the molten tube material into the space between the inner molding member and the outer molding member, cooling the molten tube material, removing the tube from the mold member after the molten tube material has cooled and solidified into a tube, embedding the tube in the physical vapor deposition target, wherein the tube forms an enclosure of the tube-based detector.

    摘要翻译: 一种用于形成用于在PVD靶减少到预定量的PVD靶材料时进行信号传导的基于管的检测器的方法包括提供具有内部模制构件的模具构件和在其间限定空间的外部模制构件,熔化所需的管 材料,将熔融管材注入内部模制件和外部模制件之间的空间中,冷却熔融管材料,在熔融管材冷却并固化成管之后,从模具构件中取出管子,将管子 在物理气相沉积靶中,其中管形成基于管的检测器的外壳。

    PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY
    6.
    发明申请
    PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY 审中-公开
    PVD目标终止服务生命检测能力

    公开(公告)号:US20110126397A1

    公开(公告)日:2011-06-02

    申请号:US13022221

    申请日:2011-02-07

    IPC分类号: B23P11/00 B29C41/42 B29C41/02

    摘要: A PVD target structure for use in physical vapor deposition. The PVD target structure includes a consumable slab of source material and one or more detectors for indicating when the slab of source material is approaching or has been reduced to a given quantity representing a service lifetime endpoint of the target structure. Each detector includes an enclosure which may be made by forming a plurality of bores in a bulk material and separating the bulk material into a plurality of discrete enclosure units each including one of the bores. Alternatively, the enclosure of the detector may be made using a mold having one or more mold members and an extrusion, casting, electrical chemical plating, and/or sheet forming method.

    摘要翻译: 用于物理气相沉积的PVD靶结构。 PVD目标结构包括源材料的可消耗板和一个或多个检测器,用于指示源材料的板块何时接近或已经被减少到表示目标结构的使用寿命端点的给定量。 每个检测器包括可以通过在散装材料中形成多个孔并将散装材料分离成多个分立的包围单元而构成的外壳,每个孔包括孔中的一个。 或者,检测器的外壳可以使用具有一个或多个模具构件的模具和挤出,铸造,电化学镀和/或片材成型方法来制造。

    PVD target with end of service life detection capability
    7.
    发明授权
    PVD target with end of service life detection capability 有权
    PVD目标,具有使用寿命检测功能

    公开(公告)号:US07891536B2

    公开(公告)日:2011-02-22

    申请号:US11427618

    申请日:2006-06-29

    IPC分类号: B21D39/00

    摘要: A PVD target structure for use in physical vapor deposition. The PVD target structure includes a consumable slab of source material and one or more detectors for indicating when the slab of source material is approaching or has been reduced to a given quantity representing a service lifetime endpoint of the target structure. Each detector includes an enclosure which may be made by forming a plurality of bores in a bulk material and separating the bulk material into a plurality of discrete enclosure units each including one of the bores. Alternatively, the enclosure of the detector may be made using a mold having one or more mold members and an extrusion, casting, electrical chemical plating, and/or sheet forming method.

    摘要翻译: 用于物理气相沉积的PVD靶结构。 PVD目标结构包括源材料的可消耗板和一个或多个检测器,用于指示源材料的板块何时接近或已经被减少到表示目标结构的使用寿命端点的给定量。 每个检测器包括可以通过在散装材料中形成多个孔并将散装材料分离成多个分立的包围单元而构成的外壳,每个孔包括孔中的一个。 或者,检测器的外壳可以使用具有一个或多个模具构件的模具和挤出,铸造,电化学镀和/或片材成型方法来制造。

    APPARATUS FOR STORING SUBSTRATES
    8.
    发明申请
    APPARATUS FOR STORING SUBSTRATES 有权
    储存基材的装置

    公开(公告)号:US20080295412A1

    公开(公告)日:2008-12-04

    申请号:US11755508

    申请日:2007-05-30

    IPC分类号: E06B7/16 H01L21/00

    摘要: An apparatus includes an enclosure and a door configured to seal the enclosure. The door includes a plate. A rotational apparatus is disposed over the plate. At least one first member with a first arm extends from a first rib of the first member. At least one second member with a second arm extends from a second rib of the second member. The first and second arms are connected to the rotational apparatus. At least one corner member has a first edge. The first edge has a shape corresponding to a shape of a corner of the frame. The corner member is connected to a first end of the third arm. A second end of the third arm is connected to the rotational apparatus. A sealing material is disposed along a first longitudinal side of the first rib and a second longitudinal side of the second rib.

    摘要翻译: 一种装置包括外壳和构造成密封外壳的门。 门包括一个板。 旋转装置设置在板上。 具有第一臂的至少一个第一构件从第一构件的第一肋延伸。 具有第二臂的至少一个第二构件从第二构件的第二肋延伸。 第一和第二臂连接到旋转装置。 至少一个角部件具有第一边缘。 第一边缘具有与框架的角部的形状对应的形状。 角部件连接到第三臂的第一端。 第三臂的第二端连接到旋转装置。 密封材料沿着第一肋的第一纵向侧面和第二肋的第二纵向侧面设置。

    Wafer's ambiance control
    10.
    发明授权
    Wafer's ambiance control 有权
    晶圆的氛围控制

    公开(公告)号:US08827695B2

    公开(公告)日:2014-09-09

    申请号:US12435861

    申请日:2009-05-05

    摘要: A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.

    摘要翻译: 公开了一种半导体制造系统,接口系统,载体和用于提供环境受控环境的方法。 半导体制造系统包括多个处理室; 至少一个接口系统,其中所述接口系统包括第一环境控制元件; 至少一个载体,其中载体包括第二环境控制元件; 以及耦合到所述多个处理室,所述至少一个接口系统和所述至少一个载体的控制模块。