公开(公告)号：US20140027896A1

公开(公告)日：2014-01-30

申请号：US13681437

申请日：2012-11-20

申请人： Baoguan Yin ,  Junhua Luo ,  Deguo Sun

发明人： Baoguan Yin ,  Junhua Luo ,  Deguo Sun

IPC分类号： H01L23/49 ,  H01L21/56

CPC分类号： H01L23/49575 ,  H01L21/56 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49 ,  H01L23/49537 ,  H01L23/49541 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements.

摘要翻译： 一种组装半导体器件的方法包括提供具有由衬底角元件连接的衬底元件阵列并由角部元件之间延伸的槽分隔的衬底。 半导体管芯位于衬底元件上。 提供了一种帽，框架和接触结构，其具有相应的帽子阵列，所述帽子由将帽子连接到框架角元件，连接框架角元件的框架元件以及由框架元件支撑的一组电接触元件的角部支腿支撑。 盖，框架和接触结构安装在基板上，盖子延伸在对应的模具上，框架角元件延伸在基板角元件上，并且设置在槽中的电接触元件组。 模具与电接触元件电连接并且组件被封装和分割。 Singulating移除框架元素。

公开(公告)号：US08481369B2

公开(公告)日：2013-07-09

申请号：US13004028

申请日：2011-01-11

申请人： Junhua Luo ,  Xingshou Pang ,  Jinzhong Yao

发明人： Junhua Luo ,  Xingshou Pang ,  Jinzhong Yao

IPC分类号： H01L21/56

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

摘要： A no-lead type semiconductor package is formed by attaching a die to a top surface of a flag of a lead frame and then taping a bottom surface of the flag and leads of the lead frame. Die bonding pads are connected to the leads with wires and then the assembly is put in a mold chase and encapsulated with a plastic material. The mold chase has protrusions between the flag and the leads of a lead frame, and between the leads themselves, which causes indentations to be formed between the leads and between the flag and the leads. The method is particularly useful for making quad flat no lead (QFN) devices and power-QFN type devices.

摘要翻译： 无引线型半导体封装通过将管芯附接到引线框架的标志的顶表面，然后贴合引线框架的标志和引线的底表面而形成。 芯片焊盘通过导线连接到引线，然后将组件放入模具中并用塑料材料封装。 模具追踪在引线框架的标志和引线之间以及引线本身之间具有突起，这导致引线之间以及引脚之间形成凹痕。 该方法对于制造四边形无铅（QFN）器件和功率QFN型器件特别有用。

公开(公告)号：US20110189823A1

公开(公告)日：2011-08-04

申请号：US13004028

申请日：2011-01-11

申请人： Junhua Luo ,  Xingshou Pang ,  Jinzhong Yao

发明人： Junhua Luo ,  Xingshou Pang ,  Jinzhong Yao

IPC分类号： H01L21/56

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

摘要： A no-lead type semiconductor package is formed by attaching a die to a top surface of a flag of a lead frame and then taping a bottom surface of the flag and leads of the lead frame. Die bonding pads are connected to the leads with wires and then the assembly is put in a mold chase and encapsulated with a plastic material. The mold chase has protrusions between the flag and the leads of a lead frame, and between the leads themselves, which causes indentations to be formed between the leads and between the flag and the leads. The method is particularly useful for making quad flat no lead (QFN) devices and power-QFN type devices.

摘要翻译： 无引线型半导体封装通过将管芯附接到引线框架的标志的顶表面，然后贴合引线框架的标记和引线的底表面而形成。 芯片焊盘通过导线连接到引线，然后将组件放入模具中并用塑料材料封装。 模具追踪在引线框架的标志和引线之间以及引线本身之间具有突起，这导致引线之间以及引脚之间形成凹痕。 该方法对于制造四边形无铅（QFN）器件和功率QFN型器件特别有用。

公开(公告)号：US20100283135A1

公开(公告)日：2010-11-11

申请号：US12753118

申请日：2010-04-02

申请人： Jinzhong YAO ,  Zhigang Bai ,  Junhua Luo ,  Meijiang Song ,  Hong Zhu

发明人： Jinzhong YAO ,  Zhigang Bai ,  Junhua Luo ,  Meijiang Song ,  Hong Zhu

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06165 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lead frame including a lead frame structure having a die support area and a plurality of electrical contact areas has shallow recesses formed on a surface of the lead frame structure.

摘要翻译： 包括具有管芯支撑区域和多个电接触区域的引线框架结构的引线框架具有形成在引线框架结构的表面上的浅凹槽。