摘要:
A plasmon generator has a front end face located in a medium facing surface of a magnetic head. The plasmon generator includes a first portion formed of a first metal material and a second portion formed of a second metal material. The first portion has an inclined surface facing toward the front end face. The second portion is located between the inclined surface and the front end face, and includes a first end face located in the front end face and a second end face in contact with the inclined surface. The second metal material is higher in Vickers hardness than the first metal material. The first portion has a plasmon exciting part. The front end face generates near-field light.
摘要:
A thermally-assisted magnetic recording head includes a main pole, a waveguide, and a plasmon generator. The waveguide includes a core and a cladding. The plasmon generator is configured to excite a surface plasmon based on light propagating through the core. The plasmon generator has a front end face located in a medium facing surface, and a first inclined surface connected to the front end face and facing toward the medium facing surface. The main pole includes an interposition part interposed between the first inclined surface and the medium facing surface. The interposition part has a second inclined surface that is opposed to the first inclined surface with an insulating film interposed therebetween.
摘要:
A near-field light generator includes a waveguide and a plasmon generator. The waveguide has a core and a cladding. The core has first and second evanescent light generating surfaces disposed such that the plasmon generator is interposed therebetween. The plasmon generator has an outer surface, the outer surface including: a front end face; a first plasmon exciting part that is opposed to the first evanescent light generating surface with a predetermined spacing therebetween; and a second plasmon exciting part that is opposed to the second evanescent light generating surface with a predetermined spacing therebetween.
摘要:
A plasmon generator includes a first portion and a second portion. A core of a waveguide includes a main body portion and a protruding portion. The main body portion has a first surface and a second surface parallel to each other. The protruding portion lies on the first surface. A cladding of the waveguide includes a receiving-portion-forming layer lying on the first surface. At least part of the first portion of the plasmon generator is received in a receiving portion defined by the protruding portion and the receiving-portion-forming layer.
摘要:
A plasmon generator has a front end face located in a medium facing surface of a magnetic head. The plasmon generator includes a first layer formed of a first metal material, a second layer formed of a second metal material, and a third layer formed of a third metal material. Each of the second and third layers has an end portion constituting part of the front end face. The first layer does not have any portion constituting part of the front end face. The first and second metal materials are higher in electrical conductivity than the third metal material. The third metal material is higher in Vickers hardness than the first and second metal materials. The first layer has a plasmon exciting part.
摘要:
A thermally-assisted magnetic recording head includes: a main pole having an end face located in a medium facing surface; a waveguide; a plasmon generator having a near-field light generating part located in the medium facing surface; and a shield located on the rear side in the direction of travel of a recording medium with respect to the main pole. The shield has an end face located in the medium facing surface and lying on the rear side in the direction of travel of the recording medium with respect to the end face of the main pole. The end face of the main pole and the end face of the shield are at a distance of 50 to 300 nm from each other. The near-field light generating part is located between the end face of the main pole and the end face of the shield in the medium facing surface.
摘要:
A thermally-assisted magnetic recording head includes: a main pole and a plasmon generator disposed to align along the direction of travel of a recording medium; a first heat sink layer having two portions that are located on opposite sides of the plasmon generator in the track width direction; a second heat sink layer having two portions that are located on opposite sides of the main pole in the track width direction; and a nonmagnetic layer disposed between the plasmon generator and the main pole. The first and second heat sink layers are each made of SiC or AlN. The nonmagnetic layer is made of a material that is lower in thermal conductivity at 25° C. than alumina.
摘要:
A thin-film magnetic head includes a main magnetic pole layer, write shield layer, gap layer, and thin-film coils, which are laminated on a substrate. A return magnetic pole layer is spaced from the medium-opposing surface on the side opposite to the write shield layer with the main magnetic pole layer intervening therebetween. A connecting magnetic layer is formed using a magnetic material to connect the return magnetic pole layer to the write shield layer on the side closer to the medium-opposing surface than is the thin-film coil. The thin-film coil is wound as a flat spiral around the write shield layer. A part of the thin-film coil wound as the flat spiral is disposed only at a position distanced from the substrate than is the main magnetic pole layer.
摘要:
A main package includes a plurality of stacked semiconductor chips and a plurality of first terminals associated with different ones of the semiconductor chips. An additional package includes an additional semiconductor chip and at least one second terminal electrically connected to the additional semiconductor chip. The additional semiconductor chip is to substitute for one of the plurality of semiconductor chips in the main package. The main package and the additional package are arranged in one of a plurality of relative positional relationships that is selected according to which one of the plurality of semiconductor chips in the main package is to be substituted with the additional semiconductor chip.
摘要:
A memory device has a laminated chip package and a controller plate. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller plate. A plurality of opposing wiring electrodes are formed at an opposing surface of the controller plate. A plurality of outside wiring electrodes are formed on the rear side of the opposing surface. Connection electrodes connecting the opposing wiring electrodes and the outside wiring electrodes are formed on the side surface of the controller plate. The interposed chip has a plurality of interposed wiring electrodes. The plurality of interposed wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of the plurality of opposing wiring electrodes. The controller plate is laid on the interposed chip.