RESIN COMPOSITION AND MOLDED PRODUCT THEREOF

    公开(公告)号:US20220033652A1

    公开(公告)日:2022-02-03

    申请号:US17279711

    申请日:2019-09-13

    Abstract: Provided is a resin composition configured to show a small change in the void ratio of hollow resin particles during mold processing and configured to stably mold a lightweight molded product. The resin composition is a resin composition comprising 50 parts by mass to 95 parts by mass of a thermoplastic plastomer and 5 parts by mass to 50 parts by mass of hollow resin particles, wherein the hollow resin particles have a void ratio of from 50% to 85%; wherein the hollow resin particles have a shell containing a resin; and wherein, with respect to 100 parts by mass of repeating units constituting the resin, 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit and 0 part by mass to 70 parts by mass of a non-crosslinkable monomer unit are contained as a polymerizable monomer unit.

    METHOD FOR PRODUCING LATEX AND METHOD FOR PRODUCING HOLLOW RESIN PARTICLES

    公开(公告)号:US20210087349A1

    公开(公告)日:2021-03-25

    申请号:US16634233

    申请日:2018-07-31

    Abstract: Provided is a method for producing a latex comprising hollow resin particles each with a high void ratio and a method for producing hollow resin particles each with a higher void ratio. In the method for producing the latex: a suspension treatment of the mixture liquid which comprises a monomer, a crosslinkable monomer, an oil-soluble polymerization initiator, a fat/fatty oil, a hydrocarbon solvent, a suspension stabilizer and an aqueous medium is carried out to prepare a suspension comprising monomer drops; a polymerization reaction of the suspension is carried out to prepare a precursor composition which comprises precursor particles each having a hollow portion including the hydrocarbon solvent.

    Manufacturing method for multi-layer printed circuit board

    公开(公告)号:US10568212B2

    公开(公告)日:2020-02-18

    申请号:US15528081

    申请日:2015-11-26

    Abstract: The present invention enables the manufacture of a small-sized high-density multi-layer printed circuit board. The manufacturing method for a multi-layer printed circuit board, according to the present invention, comprises: a step in which an electrical insulation layer is formed by heating a laminate comprising a substrate, a heat-curable resin composition layer provided on the substrate, and a release substrate provided on the heat-curable resin composition layer, thereby curing the heat-curable resin composition layer, and a step in which a via hole is formed in the electrical insulation layer by irradiating a laser from above the release substrate. In addition, in the present invention, the release substrate has a thickness of at least 80 μm and is formed using a material having a glass transition temperature, the heat-curable resin composition layer has a volatile component-content of 7.0 mass % or less and a thickness of 25 μm or less, and the curing of the heat-curable resin composition layer occurs at a temperature that is not less than the glass transition temperature of the material of the release substrate.

    Method for producing hollow resin particles

    公开(公告)号:US12281184B2

    公开(公告)日:2025-04-22

    申请号:US17425987

    申请日:2020-01-30

    Abstract: The method for producing hollow resin particles includes: carrying out a suspension treatment of a mixture liquid including a polymerizable monomer including a non-crosslinkable monomer and a crosslinkable monomer, a hydrocarbon solvent and an aqueous medium to prepare a suspension, carrying out a polymerization reaction of the suspension to form precursor particles having a hollow portion and including the hydrocarbon solvent in the hollow portion, and removing the hydrocarbon solvent included in the precursor particles to produce hollow resin particles. A content of the crosslinkable monomer is from 35 parts by mass to 95 parts by mass when the total mass of the polymerizable monomer is regarded as 100 parts by mass; a solubility parameter (SP value) of the polymerizable monomer is from 8.70 to 9.42; and a difference between the SP value of the polymerizable monomer and a SP value of the hydrocarbon solvent is 0.60 or more.

    Method for manufacturing toner for electrostatic charge image development

    公开(公告)号:US12061440B2

    公开(公告)日:2024-08-13

    申请号:US17418941

    申请日:2019-12-26

    CPC classification number: G03G9/081 G03G9/08755 G03G9/08795 G03G9/08797

    Abstract: The present invention provides a method for producing a toner for electrostatic-image development comprising: a dispersing step of performing a dispersing treatment in which a cavitation effect is obtained on a color resin particle containing a binder resin, a colorant, a charge control agent, and a release agent in an aqueous dispersion medium so as to obtain a dispersion of the color resin particle; and a heating step of performing a heat treatment on the dispersion of the color resin particle at a temperature of equal to or more than a glass transition temperature of the color resin particle and 95° C. or less for a heating time of 5 minutes or more and 10 hours or less.

    METHOD FOR MANUFACTURING TONER FOR ELECTROSTATIC CHARGE IMAGE DEVELOPMENT

    公开(公告)号:US20220066336A1

    公开(公告)日:2022-03-03

    申请号:US17418941

    申请日:2019-12-26

    Abstract: The preset invention provides a method for producing a toner for electrostatic-image development comprising: a dispersing step of performing a dispersing treatment in which a cavitation effect is obtained on a color resin particle containing a binder resin, a colorant, a charge control agent, and a release agent in an aqueous dispersion median so as to obtain a dispersion of the color resin particle; and a heating step of performing a heat treatment on the dispersion of the color resin particle at a temperature of equal to or more than a glass transition temperature of the color resin particle and 95° C. or less for a heating time of 5 minutes or more and 10 hours or less.

    RESIN COMPOSITION COMPRISING THERMOPLASTIC PLASTOMER AND HOLLOW RESIN PARTICLES AND MOLDED PRODUCT THEREOF

    公开(公告)号:US20250034395A1

    公开(公告)日:2025-01-30

    申请号:US18906857

    申请日:2024-10-04

    Abstract: Provided is a resin composition configured to show a small change in the void ratio of hollow resin particles during mold processing and configured to stably mold a lightweight molded product. The resin composition is a resin composition comprising 50 parts by mass to 95 parts by mass of a thermoplastic plastomer and 5 parts by mass to 50 parts by mass of hollow resin particles, wherein the hollow resin particles have a void ratio of from 50% to 85%; wherein the hollow resin particles have a shell containing a resin; and wherein, with respect to 100 parts by mass of repeating units constituting the resin, 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit and 0 part by mass to 70 parts by mass of a non-crosslinkable monomer unit are contained as a polymerizable monomer unit.

    METHOD FOR PRODUCING HOLLOW RESIN PARTICLES
    20.
    发明公开

    公开(公告)号:US20230357524A1

    公开(公告)日:2023-11-09

    申请号:US18355709

    申请日:2023-07-20

    Abstract: The method produces hollow resin particles. The method comprising steps of: preparing a mixture liquid comprising (A) a monomer comprising at least one monomer selected from the group consisting of a monovinyl monomer and a hydrophilic monomer excluding acrylonitrile and methacrylonitrile, (B) a crosslinkable monomer, (C) an oil-soluble polymerization initiator, (E) a hydrocarbon solvent, (F) a suspension stabilizer and (G) an aqueous medium; carrying out a suspension treatment of the mixture liquid to prepare a suspension; carrying out a polymerization reaction of the suspension to prepare a precursor composition; carrying out a solid-liquid separation of the precursor composition to obtain the precursor particles; and removing the hydrocarbon solvent (E) included in the precursor particles.

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