公开(公告)号：US08133380B2

公开(公告)日：2012-03-13

申请号：US12222733

申请日：2008-08-14

申请人： Takayuki Saito ,  Tsukuru Suzuki ,  Yuji Makita ,  Kaoru Yamada ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Osamu Nabeya ,  Kazuto Hirokawa ,  Mitsuhiko Shirakashi ,  Yasushi Toma ,  Itsuki Kobata

发明人： Takayuki Saito ,  Tsukuru Suzuki ,  Yuji Makita ,  Kaoru Yamada ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Osamu Nabeya ,  Kazuto Hirokawa ,  Mitsuhiko Shirakashi ,  Yasushi Toma ,  Itsuki Kobata

IPC分类号： B23H3/10

CPC分类号： C25F3/00 ,  B01J49/30 ,  C25F7/00

摘要： A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.

摘要翻译： 用于再生离子交换剂的方法和装置可以容易且快速地再生离子交换器，并且可以在再生离子交换器的清洁和废液的处理时最小化负载。 再生污染离子交换器的方法包括：提供一对再生电极和对置电极，设置在电极之间的隔板和设置在对电极与隔板之间的再生用离子交换器; 并在再生电极和对电极之间施加电压，同时在隔板和再生电极之间提供液体，并且还在分隔件和对电极之间供应液体。

公开(公告)号：USD644855S1

公开(公告)日：2011-09-13

申请号：US29357684

申请日：2010-03-16

申请人： Takayuki Saito

设计人： Takayuki Saito

公开(公告)号：US20090090397A1

公开(公告)日：2009-04-09

申请号：US12314197

申请日：2008-12-05

申请人： Takayuki Saito ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Kenya Ito ,  Masayuki Kamezawa ,  Kenji Yamaguchi

发明人： Takayuki Saito ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Kenya Ito ,  Masayuki Kamezawa ,  Kenji Yamaguchi

IPC分类号： B08B3/04

CPC分类号： H01L21/6708 ,  B08B3/02 ,  Y10S134/902

摘要： The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder 11 for holding a substrate W substantially horizontally and rotating the substrate W, and a processing liquid supply unit 15 for supplying a processing liquid onto a peripheral portion of the substrate W which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate W. The substrate processing apparatus for use in cleaning a substrate includes a substrate holder 54 for holding a substrate W substantially horizontally and rotating the substrate W, and a cleaning liquid supply unit 53 having a cleaning liquid outlet 53a which is oriented from a center of the substrate W toward a peripheral portion of the substrate W with an elevation angle of not more than 45° from a surface of the substrate W. The cleaning liquid supply unit 53 supplies a cleaning liquid to the surface of the substrate W at a flow velocity of not less than 0.1 m/s.

摘要翻译： 本发明提供一种适用于腐蚀形成在基板的周边部分上的薄膜的蚀刻装置中的基板处理装置和基板处理方法。 本发明还提供一种适用于在已被蚀刻的基板上进行清洗处理的清洗装置的基板处理装置和基板处理方法。 用于蚀刻的基板处理装置包括基板保持器11，用于基本上水平地保持基板W并旋转基板W;以及处理液体供应单元15，用于将处理液体供应到正在旋转的基板W的周边部分 处理液体相对于基板W是静止的。用于清洗基板的基板处理装置包括：基板保持件54，用于基本上水平地保持基板W并旋转基板W;以及清洗液供给部 单元53具有从基板W的中心朝向基板W的周边部分取向的清洗液出口53a，其与基板W的表面的仰角不大于45°。清洗液供给单元53 以不小于0.1m / s的流速将清洗液供给到基板W的表面。

公开(公告)号：US07476290B2

公开(公告)日：2009-01-13

申请号：US10695826

申请日：2003-10-30

申请人： Takayuki Saito ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Kenya Ito ,  Masayuki Kamezawa ,  Kenji Yamaguchi

发明人： Takayuki Saito ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Kenya Ito ,  Masayuki Kamezawa ,  Kenji Yamaguchi

IPC分类号： B08B7/04

CPC分类号： H01L21/6708 ,  B08B3/02 ,  Y10S134/902

摘要： The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder for holding a substrate substantially horizontally and rotating the substrate, and a processing liquid supply unit for supplying a processing liquid onto a peripheral portion of the substrate which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate. The substrate processing apparatus for use in cleaning a substrate includes a substrate holder for holding a substrate substantially horizontally and rotating the substrate, and a cleaning liquid supply unit having a cleaning liquid outlet which is oriented from a center of the substrate toward a peripheral portion of the substrate with an elevation angle of not more than 45° from a surface of the substrate. The cleaning liquid supply unit supplies a cleaning liquid to the surface of the substrate at a flow velocity of not less than 0.1 m/s.

摘要翻译： 本发明提供一种适用于腐蚀形成在基板的周边部分上的薄膜的蚀刻装置中的基板处理装置和基板处理方法。 本发明还提供一种适用于在已被蚀刻的基板上进行清洗处理的清洗装置的基板处理装置和基板处理方法。 用于蚀刻的基板处理装置包括：基板保持器，用于基本上水平地保持基板并旋转基板;以及处理液体供应单元，用于将处理液体供应到正在旋转的基板的周边部分， 处理液相对于基板静止。 用于清洗基板的基板处理装置包括基板保持器，用于基本水平地保持基板并旋转基板;以及清洗液供给单元，其具有从基板的中心朝向基板的周边部分 该衬底的仰角与衬底的表面不超过45°。 清洗液供给部以不小于0.1m / s的流速向基板的表面供给清洗液。

公开(公告)号：US07459265B2

公开(公告)日：2008-12-02

申请号：US11255877

申请日：2005-10-24

申请人： Takeo Ishibashi ,  Takayuki Saito ,  Maya Itoh ,  Shuji Nakao

发明人： Takeo Ishibashi ,  Takayuki Saito ,  Maya Itoh ,  Shuji Nakao

IPC分类号： G03F7/00

CPC分类号： G03F7/70466 ,  G03F1/00

摘要： First, a first exposure process is performed using dipole illumination with only a grating-pattern forming region as a substantial object to be exposed. Next, a second exposure process is performed with only a standard-pattern forming region as a substantial object to be exposed. A development process is then performed to obtain a resist pattern. A mask for the first exposure process is such that a light blocking pattern is formed on the whole surface of a standard-pattern mask part corresponding to the standard-pattern forming region. A mask for the second exposure is such that a light blocking pattern is formed on the whole surface of a grating-pattern mask part corresponding to the grating-pattern forming region.

摘要翻译： 首先，使用仅具有光栅图案形成区域的偶极照明作为要暴露的实质对象来执行第一曝光处理。 接下来，仅以标准图案形成区域作为要曝光的实质物体进行第二曝光处理。 然后进行显影处理以获得抗蚀剂图案。 用于第一曝光处理的掩模使得在对应于标准图案形成区域的标准图案掩模部件的整个表面上形成遮光图案。 用于第二曝光的掩模使得在对应于光栅图案形成区域的光栅图案掩模部分的整个表面上形成遮光图案。

公开(公告)号：US07208076B2

公开(公告)日：2007-04-24

申请号：US10485177

申请日：2002-09-11

申请人： Itsuki Kobata ,  Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Yuji Makita ,  Hozumi Yasuda

发明人： Itsuki Kobata ,  Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Yuji Makita ,  Hozumi Yasuda

IPC分类号： C25F7/00 ,  C25F5/00 ,  C25F3/14

CPC分类号： H01L21/6708 ,  C25F3/00 ,  C25F7/00

摘要： A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.

公开(公告)号：US20060144711A1

公开(公告)日：2006-07-06

申请号：US10534232

申请日：2003-07-18

申请人： Itsuki Kobata ,  Masayuki Kumekawa ,  Osamu Nabeya ,  Roberto Serikawa ,  Takayuki Saito ,  Tsukuru Suzuki ,  Akira Kodera ,  Hozumi Yasuda ,  Takeshi Iizumi ,  Mitsuhiko Shirakashi

发明人： Itsuki Kobata ,  Masayuki Kumekawa ,  Osamu Nabeya ,  Roberto Serikawa ,  Takayuki Saito ,  Tsukuru Suzuki ,  Akira Kodera ,  Hozumi Yasuda ,  Takeshi Iizumi ,  Mitsuhiko Shirakashi

IPC分类号： B23H7/20

CPC分类号： B23H3/02 ,  B23H5/08 ,  B23H9/00

摘要： A object of this invention is to provide an electrolytic processing method and apparatus that can suppress a change in the electric conductivity of a fluid due to contaminants, such as processing products produced in electrolytic processing, so that the fluid can maintain good flattening properties. The electrolytic processing apparatus of this invention includes: a processing electrode (42) that can come into contact with a workpiece (W); a feeding electrode (44) for feeding electricity to the workpiece (W); a holder (22) for holding the workpiece (W); a power source (26) for applying a voltage between the processing electrode (42) and the feeding electrode (44); a fluid supply section (50) for supplying a fluid between the workpiece (W) and at least one of the processing electrode (42) and the feeding electrode (44); a sensor (80) for measuring the electric conductivity of the fluid; and a control section (84) for changing the processing conditions based on the electric conductivity measured by the sensor (80).

摘要翻译： 本发明的目的是提供一种电解处理方法和装置，其可以抑制由电解处理中产生的加工产品等污染物引起的流体的导电性变化，使得流体能够保持良好的平坦化性能。 本发明的电解处理装置包括：可与工件（W）接触的处理电极（42）; 用于向工件（W）供电的供电电极（44）; 用于保持工件（W）的保持器（22）; 用于在处理电极（42）和馈电电极（44）之间施加电压的电源（26）; 用于在工件（W）和处理电极（42）和馈电电极（44）中的至少一个之间供应流体的流体供应部分（50）; 用于测量流体的电导率的传感器（80）; 以及用于根据由传感器（80）测量的电导率来改变处理条件的控制部分（84）。

公开(公告)号：US06743349B2

公开(公告)日：2004-06-01

申请号：US09897913

申请日：2001-07-05

申请人： Yuzo Mori ,  Mitsuhiko Shirakashi ,  Yasushi Toma ,  Itsuki Kobata ,  Takayuki Saito

发明人： Yuzo Mori ,  Mitsuhiko Shirakashi ,  Yasushi Toma ,  Itsuki Kobata ,  Takayuki Saito

IPC分类号： C25F316

CPC分类号： B23H3/00 ,  B23H3/08

摘要： An electrochemical machining apparatus comprises a machining chamber for holding ultrapure water, a cathode/anode immersed in the ultrapure water held in the machining chamber, and a workpiece holding portion for holding a workpiece at a predetermined distance from the cathode/anode so that a surface, to be machined, of the workpiece is brought into contact with the ultrapure water. The electrochemical machining apparatus further comprises an anode/cathode contact brought into contact with the workpiece held by the workpiece holding portion so that the workpiece serves as an anode/cathode, a catalyst having a strongly basic anion exchange function or a strongly acidic cation exchange function, a power source for applying a voltage between the cathode/anode and the workpiece, and a moving mechanism for relatively moving the workpiece and the catalyst. The catalyst is disposed between the cathode/anode and the workpiece held by the workpiece holding portion.

公开(公告)号：US06686751B1

公开(公告)日：2004-02-03

申请号：US09926195

申请日：2001-09-21

申请人： Takayuki Saito ,  Syu Nakanishi ,  Kanroku Chounan

发明人： Takayuki Saito ,  Syu Nakanishi ,  Kanroku Chounan

IPC分类号： G01N2706

CPC分类号： G01N27/06 ,  G01N33/182

摘要： The present invention provide a method and an apparatus for detecting anions in water which does not require replacement of ion exchange resins and the like and can perform precise measurement at low cost in a simple operation. The apparatus for detecting anions in water according to the present invention is an apparatus for detecting anions in water with the use of an electric conductivity cell and is constituted by an electrolyzer having an anode chamber having an anode plate and a cation chamber having a cathode plate via a cation exchange membrane, a direct-current power unit for applying a direct-current voltage between the anode and the cathode of the electrolyzer and an electric conductivity cell for measuring the electric conductivity of a sample water, and a flow passage for introducing a sample water into the anode chamber and a treated water flow passage for discharging the treated water which has been subjected to electrolytic treatment in the anode chamber which are connected to the anode chamber, respectively, and the treated water flow passage being connected to the cathode chamber via an electric conductivity cell.

摘要翻译： 本发明提供一种用于检测水中阴离子的方法和装置，其不需要更换离子交换树脂等，并且可以在简单的操作中以低成本执行精确的测量。 根据本发明的用于检测水中阴离子的装置是一种使用电导电池检测水中阴离子的装置，由具有阳极室和阳极室的电解槽构成，阳极室具有阴极板 通过阳离子交换膜，用于在电解槽的阳极和阴极之间施加直流电压的直流电力单元和用于测量样品水的电导率的电导池，以及用于引入 将水进入阳极室和经处理的水流通道，用于分别在与阳极室连接的阳极室中排出经过电解处理的处理水，处理过的水流通道连接到阴极室 通过电导电池。

公开(公告)号：US06602396B2

公开(公告)日：2003-08-05

申请号：US09996674

申请日：2001-11-30

申请人： Yuzo Mori ,  Mitsuhiko Shirakashi ,  Takayuki Saito ,  Yasushi Toma ,  Akira Fukunaga ,  Itsuki Kobata

发明人： Yuzo Mori ,  Mitsuhiko Shirakashi ,  Takayuki Saito ,  Yasushi Toma ,  Akira Fukunaga ,  Itsuki Kobata

IPC分类号： B23H300

CPC分类号： C25F3/00 ,  B23H3/08

摘要： An anode as a workpiece, and a cathode opposed to the anode with a predetermined spacing are placed in ultrapure water. A catalytic material promoting dissociation of the ultrapure water and having water permeability is disposed between the workpiece and the cathode. A flow of the ultrapure water is formed inside the catalytic material, with a voltage being applied between the workpiece and the cathode, to decompose water molecules in the ultrapure water into hydrogen ions and hydroxide ions, and supply the resulting hydroxide ions to a surface of the workpiece, thereby performing removal processing of or oxide film formation on the workpiece through a chemical dissolution reaction or an oxidation reaction mediated by the hydroxide ions. Thus, clean processing can be performed by use of hydroxide ions in ultrapure water, with no impurities left behind on the processed surface of the workpiece.