公开(公告)号：US20110178752A1

公开(公告)日：2011-07-21

申请号：US13046171

申请日：2011-03-11

Applicant: Leonard Hayden

Inventor： Leonard Hayden

IPC: G06F19/00

CPC classification number: G01R27/32 ,  G01D18/00 ,  G01R35/005

Abstract: A method of compensating a calibration for a vector network analyzer includes performing calibrations on at least a pair of ports to determine error terms associated with each port wherein at least one of the error terms is based upon selecting the reactance of the load standard from a set of potential values in a manner such that the reference reactance errors are reduced.

Abstract translation: 补偿矢量网络分析仪的校准的方法包括在至少一对端口上执行校准以确定与每个端口相关联的误差项，其中至少一个误差项基于从一组中选择负载标准的电抗 的电位值，使得参考电抗误差减小。

公开(公告)号：US07908107B2

公开(公告)日：2011-03-15

申请号：US11879865

申请日：2007-07-18

Applicant: Leonard Hayden

Inventor： Leonard Hayden

IPC: G01R35/00

CPC classification number: G01R27/32 ,  G01D18/00 ,  G01R35/005

Abstract: A method of compensating a calibration for a vector network analyzer includes performing calibrations on at least a pair of ports to determine error terms associated with each port wherein at least one of the error terms is based upon selecting the reactance of the load standard from a set of potential values in a manner such that the reference reactance errors are reduced.

Abstract translation: 补偿矢量网络分析仪的校准的方法包括在至少一对端口上执行校准以确定与每个端口相关联的误差项，其中至少一个误差项基于从一组中选择负载标准的电抗 的电位值，使得参考电抗误差减小。

公开(公告)号：US07876115B2

公开(公告)日：2011-01-25

申请号：US12378648

申请日：2009-02-17

Applicant: Craig Stewart ,  Anthony Lord ,  Jeff Spencer ,  Terry Burcham ,  Peter McCann ,  Rod Jones ,  John Dunklee ,  Tim Lesher ,  David Newton

Inventor： Craig Stewart ,  Anthony Lord ,  Jeff Spencer ,  Terry Burcham ,  Peter McCann ,  Rod Jones ,  John Dunklee ,  Tim Lesher ,  David Newton

IPC: G01R31/02 ,  G01R31/00

CPC classification number: G01R31/2887

Abstract: A chuck includes a conductive element that contacts a device under test in a location on the chuck. The chuck includes an upper surface for supporting a device under test and a conductive element that extends through the chuck to the upper surface of the chuck. The conductive element is electrically isolated from the upper surface of the chuck, and makes electrical contact with any device under test supported by the chuck.

Abstract translation: 卡盘包括在卡盘上的位置接触被测设备的导电元件。 卡盘包括用于支撑被测器件的上表面和贯穿卡盘延伸到卡盘上表面的导电元件。 导电元件与卡盘的上表面电绝缘，并与由卡盘支撑的任何被测器件电接触。

公开(公告)号：US07688091B2

公开(公告)日：2010-03-30

申请号：US12075385

申请日：2008-03-10

Applicant: Peter Andrews ,  Brad Froemke ,  John Dunklee

Inventor： Peter Andrews ,  Brad Froemke ,  John Dunklee

IPC: G01R31/02

CPC classification number: G01R31/2887

Abstract: An improved chuck with lift pins within a probe station. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.

Abstract translation: 一个改进的卡盘，在探针台内有升降针。 卡盘组件可以具有外周边和上表面。 提升销可以定位在卡盘组件的周边内，并且可以相对于卡盘组件的上表面相对垂直运动。

公开(公告)号：US20090267625A1

公开(公告)日：2009-10-29

申请号：US12378659

申请日：2009-02-17

Applicant: K. Reed Gleason ,  Tim Lesher ,  Mike Andrews ,  John Martin

Inventor： K. Reed Gleason ,  Tim Lesher ,  Mike Andrews ,  John Martin

IPC: G01R31/02 ,  G01R1/067

CPC classification number: G01R1/07342 ,  G01R1/06738 ,  G01R1/06772

Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Abstract translation: 用于测量高频集成电路或其他微电子器件的电气特性的探针测量系统。

公开(公告)号：US07554322B2

公开(公告)日：2009-06-30

申请号：US11083677

申请日：2005-03-16

Applicant: Greg Nordgren ,  John Dunklee

Inventor： Greg Nordgren ,  John Dunklee

IPC: G01R31/28

CPC classification number: G01R31/2886 ,  G01R31/2887 ,  Y10T279/29

Abstract: A probe station for testing a wafer.

Abstract translation: 用于测试晶圆的探测台。

公开(公告)号：US07498828B2

公开(公告)日：2009-03-03

申请号：US11820518

申请日：2007-06-20

Applicant: John Dunklee ,  Clarence E. Cowan

Inventor： John Dunklee ,  Clarence E. Cowan

IPC: G01R31/02 ,  G01R31/28

CPC classification number: G01R31/2851 ,  G01R31/2886 ,  G01R31/2887

Abstract: A probe assembly suitable for high-current measurements of an electrical device.

Abstract translation: 适用于电气设备的高电流测量的探头组件。

公开(公告)号：US07492175B2

公开(公告)日：2009-02-17

申请号：US12008594

申请日：2008-01-10

Applicant: Kenneth Smith ,  Reed Gleason

Inventor： Kenneth Smith ,  Reed Gleason

IPC: G01R31/02 ,  G01R31/26

CPC classification number: G01R1/0735

Abstract: A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, and supporting at least a signal conductor located between a pair of spaced apart guard conductors. The guard conductors of the probe card are electrically interconnected proximate the interconnection between the probe card and the membrane assembly. The guard conductors of the membrane assembly are electrically interconnected proximate the interconnection between the probe card and the membrane assembly.

Abstract translation: 膜探测组件包括其上承载有导体的探针卡，其中所述导体至少包括位于一对间隔开的保护导体之间的信号导体。 膜组件包括其上具有触点的膜，并且支撑位于一对间隔开的保护导体之间的至少一个信号导体。 探针卡的保护导体在探针卡和膜组件之间的互连附近电互连。 膜组件的保护导体在探针卡和膜组件之间的互连附近电互连。

公开(公告)号：US07489149B2

公开(公告)日：2009-02-10

申请号：US11977280

申请日：2007-10-24

Applicant: K. Reed Gleason ,  Tim Lesher ,  Eric W. Strid ,  Mike Andrews ,  John Martin ,  John Dunklee ,  Leonard Hayden ,  Amr M. E. Safwat

Inventor： K. Reed Gleason ,  Tim Lesher ,  Eric W. Strid ,  Mike Andrews ,  John Martin ,  John Dunklee ,  Leonard Hayden ,  Amr M. E. Safwat

IPC: G01R11/67

CPC classification number: G01R1/06772 ,  G01R1/06711 ,  G01R1/06755 ,  G01R1/06777

Abstract: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal oath and the probe tip.

Abstract translation: 用于测量高频下的集成电路或其他微电子器件的电特性的探针可以包括支持互连测试仪器的信号路径的电介质基底，以及屏蔽信号誓言和探针尖端的探针尖端和接地路径。

公开(公告)号：US20090021273A1

公开(公告)日：2009-01-22

申请号：US12283984

申请日：2008-09-16

Applicant: Eric Strid ,  Richard Campbell

Inventor： Eric Strid ,  Richard Campbell

IPC: G01R1/02

CPC classification number: G01R31/2884

Abstract: A test structure for characterizing integrated circuits on a wafer includes a differential cell outputting a differential mode signal in response to a differential mode input signal. The probe pads of the test structure are arrayed linearly enabling placement of the test structure in a saw street between dies.

Abstract translation: 用于表征晶片上的集成电路的测试结构包括响应于差分模式输入信号而输出差分模式信号的差分单元。 测试结构的探针焊盘线性排列，可以将测试结构放置在管芯之间的锯道中。