公开(公告)号：US20080311298A1

公开(公告)日：2008-12-18

申请号：US12139317

申请日：2008-06-13

申请人： Heinz Kappler

发明人： Heinz Kappler

IPC分类号： B05D5/00 ,  B05C13/00

CPC分类号： B05C1/025 ,  B05C1/027 ,  B05C1/0808 ,  B05C1/0813 ,  B05C1/10 ,  B05C1/165 ,  B05C13/02 ,  H01L21/6715 ,  H01L21/67706 ,  H01L21/6776 ,  H05K3/0085 ,  H05K2203/0143 ,  H05K2203/1509

摘要： The invention relates to a device for treating the surfaces of silicon wafers, comprising transport rollers for transporting the silicon wafers on a transport plane, which is determined by the transport rollers, and at least one conveyor device which wets the silicon wafer with an aqueous process medium. The conveyor device is arranged in such a manner below the transport plane that it touches the transport plane for wetting the substrate surface, which is oriented in the downward direction, with a process medium. The conveyor device is in direct contact with the substrate surface and is a roller with a larger diameter at its two ends for contacting the marginal areas at the underside of the silicon wafers for wetting them with the process medium.

摘要翻译： 本发明涉及一种用于处理硅晶片表面的装置，包括用于在由输送辊确定的输送平面上输送硅晶片的输送辊，以及至少一个使用含水方法润湿硅晶片的输送装置 中。 传送装置以传送平面的方式设置在传送平面的下方，该传送平面与传送平面相接触，以便用处理介质润湿朝向下方的基板表面。 传送装置与衬底表面直接接触，并且是其两端具有较大直径的辊，用于接触硅晶片下侧的边缘区域，以便与处理介质一起润湿它们。

公开(公告)号：US20080142358A1

公开(公告)日：2008-06-19

申请号：US12025471

申请日：2008-02-04

申请人： Christian Schmid

发明人： Christian Schmid

IPC分类号： C25D17/00

CPC分类号： C25D7/0621 ,  C25D17/00 ,  C25D17/001 ,  C25D17/005 ,  C25D17/08 ,  H05K3/241

摘要： In order to treat solar cells in an electroplating device, they can be inserted into a grid-like or tray-like picking-up device. They are thus mechanically held and electrical contact is made with them via contacts. Instead of individual solar cells, the picking-up devices are moved with a large number of inserted solar cells through the electroplating device for treatment. Electrical contact with the solar cells is in this case made via the contacts and the frame limbs on a projecting angle section together with edge strips of the pick-up. Contact rollers rest on the edge strips and are connected to an electrical power source.

摘要翻译： 为了处理电镀装置中的太阳能电池，可以将它们插入网状或托盘状拾取装置中。 因此它们被机械地保持，并通过触点与它们进行电接触。 代替单独的太阳能电池，拾取装置通过大量插入的太阳能电池移动通过电镀装置进行处理。 在这种情况下，与太阳能电池的电接触是通过触点和框架四肢与突出的角部分一起和拾取器的边缘带一起制成的。 接触辊靠在边缘条上，并连接到电源。

公开(公告)号：US07267522B2

公开(公告)日：2007-09-11

申请号：US10494773

申请日：2002-10-29

申请人： Heinz Kappler

发明人： Heinz Kappler

IPC分类号： A01D90/08 ,  B65G57/00 ,  B65H29/32

CPC分类号： H05K13/0061

摘要： One embodiment of the invention is a method for placing circuit boards in a receiving container, comprising the following steps: a) gripping and lifting a circuit board with a first grappling device, b) moving the first grappling device and the receiving container relative to each other, such that the receiving container is located below the first grappling device, c) the first grappling device lowers the circuit board into the receiving container, d) gripping and lifting a partition layer from a dispenser with a second grappling device, e) reversion to step b), such that the receiving container is accessible from above and is below the second grappling device, f) the partition layer is placed in the receiving container on top of the previously placed circuit board and g) start the process at a).

摘要翻译： 本发明的一个实施例是一种用于将电路板放置在接收容器中的方法，包括以下步骤：a）用第一抓取装置夹持和提起电路板，b）相对于每一个移动第一抓取装置和接收容器 另一方面，使得接收容器位于第一抓钩装置下方，c）第一抓取装置将电路板降低到接收容器中，d）用具有第二抓取装置的分配器抓住并提起分隔层，e）回复 到步骤b），使得接收容器可以从上方接近并且位于第二抓斗装置下方，f）分隔层被放置在接收容器中，位于先前放置的电路板的顶部，并且g）在a）开始该过程， 。

公开(公告)号：US5529081A

公开(公告)日：1996-06-25

申请号：US902319

申请日：1992-06-22

申请人： Heinz Kappler

发明人： Heinz Kappler

IPC分类号： C23F1/08 ,  C25D17/28 ,  C25F7/00 ,  H05K3/00 ,  H05K13/00 ,  B08B3/02

CPC分类号： H05K13/0069 ,  C23F1/08 ,  C25D7/0621 ,  C25F7/00 ,  H05K3/0085

摘要： In an apparatus for the treatment of board-shaped articles, particularly printed circuit boards, with a liquid treatment medium, particularly a cleaning, etching, metallizing or rinsing liquid, along a substantially horizontal conveying path defined by a conveying means, for improving the handling of thin circuit boards it is proposed that the conveying means on either side of the conveying path and both above and below the conveying plane comprises elements guiding the longitudinal edges of the boards.

摘要翻译： 在用于处理具有液体处理介质，特别是清洁，蚀刻，金属化或冲洗液体的板状制品，特别是印刷电路板的设备中，沿着由输送装置限定的基本上水平的输送路径，用于改善处理 的薄板电路板，建议在输送路径的任一侧和输送平面的上方和下方的输送装置包括引导板的纵向边缘的元件。

公开(公告)号：US5335681A

公开(公告)日：1994-08-09

申请号：US902320

申请日：1992-06-22

申请人： Christian Schmid

发明人： Christian Schmid

IPC分类号： B05B15/04 ,  C23F1/08 ,  C25D21/04 ,  C25F7/00 ,  H05K3/00 ,  D06B3/02

CPC分类号： B05B15/0425 ,  C23F1/08 ,  C25D17/001 ,  C25D21/00 ,  C25D21/04 ,  C25D7/0621 ,  C25D7/0685 ,  C25F7/00 ,  H05K3/0085 ,  Y10S134/902

摘要： In order when treating printed circuit boards with liquids, particularly during cleaning, etching, metallizing or rinsing, to achieve a precisely time measurable and effective treatment, the area supplied by means of a spray or swell nozzle or a stationary wave is limited by suction devices (24, 25, 41, 42). The latter are positioned upstream and downstream of the application (28, 38). The spray or suction nozzles (22, 24, 25) are arranged in a common casing and the boards (12) to be treated move horizontally passed its lower periphery.

摘要翻译： 为了在用液体处理印刷电路板时，特别是在清洁，蚀刻，金属化或漂洗期间，为了实现精确时间可测量和有效的处理，通过喷雾或溶胀喷嘴或固定波提供的区域受到抽吸装置 （24,25,41,42）。 后者位于应用程序（28,38）的上游和下游。 喷嘴或吸嘴（22,24,25）布置在公共壳体中，待处理的板（12）水平移动通过其下周边。

公开(公告)号：US20230284391A1

公开(公告)日：2023-09-07

申请号：US18019104

申请日：2021-07-15

申请人： Gebr. Schmid GmbH

发明人： Christian Buchner ,  Jürgen Haungs ,  Christian Schmid

IPC分类号： H05K3/06

CPC分类号： H05K3/062 ,  H05K2203/107

摘要： A method of producing a printed circuit board includes providing a base substrate that is a film or plate, has first and second substrate sides and consists partly of an electrically non-conducting organic polymer material, where the first substrate side is covered with a capping metal layer, and regionally removing the capping metal layer, wherein regionally removing the capping metal layer includes applying a mask layer to the capping metal layer, regionally removing the mask layer by a laser so that the first substrate side is divided into at least one first subregion, in which the first substrate side is covered only with the capping metal layer, and into at least one second subregion, in which the first substrate side is covered with the capping metal layer and by the mask layer, and removing the capping metal layer in the at least one first subregion by an etching solution.

公开(公告)号：US08524008B2

公开(公告)日：2013-09-03

申请号：US13355223

申请日：2012-01-20

申请人： Sven Worm ,  Reinhard Huber

发明人： Sven Worm ,  Reinhard Huber

IPC分类号： B08B3/04

CPC分类号： H01L31/18 ,  B28D5/0076 ,  B28D5/0082 ,  H01L21/67051 ,  H01L21/67313

摘要： In the case of a device and a method for cleaning substrates on a carrier, to the underside of which the substrates are fastened so as to be parallel to and slightly apart from one another, the carrier has in its interior a plurality of longitudinal channels, which run parallel to one another. As a result of the sawing of the wafers, they merge, via openings, into interstices between the substrates. As a result of a relative movement, an elongate tube, from which cleaning fluid is let out, is introduced into one of the longitudinal channels, the relative movement being achieved substantially through moving of the carrier.

摘要翻译： 在用于清洁载体上的基板的装置和方法的情况下，基板的下侧被紧固以彼此平行并且稍微分开，载体在其内部具有多个纵向通道， 它们彼此平行。 作为晶片锯切的结果，它们通过开口合并到基板之间的空隙中。 作为相对运动的结果，从其中排出清洁流体的细长管被引入到纵向通道之一中，基本上通过移动载体来实现相对运动。

公开(公告)号：US08387636B2

公开(公告)日：2013-03-05

申请号：US13356259

申请日：2012-01-23

申请人： Christoph Hartmann ,  Sven Worm

发明人： Christoph Hartmann ,  Sven Worm

IPC分类号： B08B3/02

CPC分类号： H01L21/67051 ,  B28D5/0076 ,  B28D5/0082 ,  H01L21/67313

摘要： An apparatus for cleaning substrates on a carrier, which has in the interior thereof a plurality of longitudinal passages, which run parallel to one another and are connected to the outside at the underside of the carrier via openings. There is provided a plurality of elongated pipes, which are arranged on a pipe holder and are connected in a fluid-conducting manner to a fluid supply. A centering template is provided, which encompasses the pipes and is displaceable in the longitudinal direction thereof between an attachment position in the end region of the pipes away from the pipe holder and a working position, which lies between the attachment position and the pipe holder. The centering template bears against the carrier, such that the pipes are then aligned exactly with the longitudinal passages.

摘要翻译： 一种用于清洁载体上的基板的装置，其在其内部具有多个彼此平行延伸并在载体通孔的下侧连接到外部的多个纵向通道。 设置有多个细长管，它们设置在管保持器上并且以流体传导方式连接到流体供应。 提供了一种定心模板，其包围管道，并且可在纵向方向上位于远离管座的管道端部区域中的安装位置和位于安装位置与管座之间的工作位置之间。 定心模板抵靠载体，使得管道然后与纵向通道精确对准。

公开(公告)号：US08349637B2

公开(公告)日：2013-01-08

申请号：US12554592

申请日：2009-09-04

申请人： Christian Schmid ,  Dirk Habermann

发明人： Christian Schmid ,  Dirk Habermann

IPC分类号： H01L21/00 ,  H01L31/04

CPC分类号： H01L31/022425 ,  H01L31/022466 ,  H01L31/068 ,  H01L31/0684 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

摘要： In a method for the production of a solar cell, a flat aluminium layer is applied to the back of a solar cell substrate. The aluminium is alloyed into the silicon substrate by the effect of the temperature and forms an aluminium BSF. The remaining aluminium that has not been alloyed into the silicon is subsequently removed. The aluminium BSF is transparent to light.

摘要翻译： 在制造太阳能电池的方法中，将平坦的铝层施加到太阳能电池基板的背面。 通过温度的作用将铝合金化到硅衬底中并形成铝BSF。 随后除去未合金化到硅中的剩余的铝。 铝BSF对光是透明的。

公开(公告)号：US20120276749A1

公开(公告)日：2012-11-01

申请号：US13518660

申请日：2010-12-23

申请人： Dirk Habermann ,  Martin Schoch ,  Maher Izaaryene ,  Friedhelm Stein

发明人： Dirk Habermann ,  Martin Schoch ,  Maher Izaaryene ,  Friedhelm Stein

IPC分类号： H01L21/306 ,  B05B1/14

CPC分类号： H01L21/6708

摘要： In a method for processing monocrystalline silicon wafers, which are transported while lying flat along a horizontal transport path, etching solution for texturing the surface is applied from above by means of nozzles or the like. The etching solution is applied from above several times in succession onto the upper side of the silicon substrates, remains there and reacts with the silicon substrate.

摘要翻译： 在沿着水平传送路径平坦地输送的单晶硅晶片的处理方法中，通过喷嘴等从上方施加用于纹理化表面的蚀刻液。 蚀刻溶液从上述几次连续地施加到硅衬底的上侧，保留在那里并与硅衬底反应。