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11.发明申请公开(公告)号：US20210243898A1
公开(公告)日：2021-08-05
申请号：US17215001
申请日：2021-03-29
Applicant: TactoTek Oy
Inventor： Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen , Paavo Niskala , Mikko Sippari , Pasi Raappana , Antti Keränen
Abstract: A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.
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12.发明授权公开(公告)号：US10986735B2
公开(公告)日：2021-04-20
申请号：US16168927
申请日：2018-10-24
Applicant: TactoTek Oy
Inventor： Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen , Paavo Niskala , Mikko Sippari , Pasi Raappana , Antti Keränen
Abstract: A method for manufacturing an electromechanical structure includes producing conductors on a flat film and estimating a strain that a plurality of locations on the flat film will undergo during formation of the flat film into a three-dimensional film. The method further includes attaching electronic elements on the flat film at selected locations of the plurality of locations on the flat film. The estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations. The method further includes forming the flat film into the three-dimensional film and injection molding material on the three-dimensional film.
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13.发明授权公开(公告)号：US10986734B2
公开(公告)日：2021-04-20
申请号：US16140633
申请日：2018-09-25
Applicant: TactoTek Oy
Inventor： Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen , Paavo Niskala , Mikko Sippari , Pasi Raappana , Antti Keränen
Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.
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公开(公告)号：US10408391B2
公开(公告)日：2019-09-10
申请号：US15824152
申请日：2017-11-28
Applicant: TactoTek Oy
Inventor： Sami Torvinen
IPC: F21S4/00 , F21K9/61 , F21V8/00 , H05K1/02 , H05K1/18 , H01L25/075 , F21Y103/37 , F21Y103/10 , F21Y115/10 , H05K3/00 , H05K3/12 , H01L33/60 , H01L33/62
Abstract: Embodiments of light-emitting multilayer structures incorporating substrate films 3D-formed with recesses for light sources and plastics material molded thereupon are presented. Related methods of manufacture are set forth as well.
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公开(公告)号：US09869810B2
公开(公告)日：2018-01-16
申请号：US14264273
申请日：2014-04-29
Applicant: TactoTek Oy
Inventor： Antti Keranen , Jarmo Saaski , Tuomas Heikkila , Paavo Niskala , Kari Severinkangas , Sami Torvinen
CPC classification number: G02B6/0065 , G02B6/0036 , G02B6/0051 , G02B6/006 , G02B6/0091
Abstract: A method for manufacturing an electronic product, includes: obtaining a flexible, optically substantially transparent or translucent, substrate sheet; printing a number of electrical conductors on the substrate sheet in accordance with a predefined schematic; printing or disposing a number of electronic components including optoelectronic light emissive, preferably LED (light-emitting diode), components on the substrate sheet in accordance with the schematic, wherein at least some of the printed conductors are configured to provide electrical current thereto; and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate so as to establish a functional multi-layer structure, where the light emitted by the light emissive components is incoupled to the lightguide, propagates therewithin, and is at least partly outcoupled to the environment through the substrate sheet. Related arrangement and electronic device are presented.
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Patent Agency Ranking
公开(公告)号：US09297675B2
公开(公告)日：2016-03-29
申请号：US14046425
申请日：2013-10-04
Applicant: TactoTek Oy
Inventor： Antti Keränen , Mikko Heikkinen
IPC: G01D11/28
CPC classification number: G01D11/28 , F21K9/60 , F21V23/04 , H01H13/83 , H01H2219/028 , H01H2219/039 , H01H2219/056 , H01H2219/06
Abstract: A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.
Abstract translation: 用于电子设备的复合层压组件为由组件限定的一个或多个指示器形状提供集成背光。 组件包括基本上不透明的盖构件，以遮蔽电子设备的至少一部分。 盖构件中的半透明指示器结构限定相应的指示器形状，以允许背光通过盖构件。 光学导电材料的光学基质层被附着到盖构件的内表面，其中多个照明装置嵌入在光学矩阵层中并且横向偏离相关联的指示器结构。 多个照明装置可以连接到承载在盖构件的内表面上的电路。
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公开(公告)号：US20250048813A1
公开(公告)日：2025-02-06
申请号：US18922834
申请日：2024-10-22
Applicant: TactoTek Oy
Inventor： Antti KERÄNEN , Sami TORVINEN , Tero HEIKKINEN , Pasi KORHONEN , Pälvi APILO , Mikko HEIKKINEN , Jarmo SÄÄSKI , Paavo NISKALA , Ville WALLENIUS , Heikki TUOVINEN , Janne ASIKKALA , Taneli SALMI , Suvi KELA , Outi RUSANEN , Johanna JUVANI , Mikko SIPPARI , Tomi SIMULA , Tapio RAUTIO , Samuli YRJÄNÄ , Tero RAJANIEMI , Simo KOIVIKKO , Juha-Matti HINTIKKA , Hasse SINIVAARA , Vinski BRÄYSY , Olimpia MIGLIORE , Juha SEPPONEN
IPC: H01L33/60 , H01L25/075 , H01L33/00 , H01L33/62
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design including at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector
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公开(公告)号：US12130005B2
公开(公告)日：2024-10-29
申请号：US18339427
申请日：2023-06-22
Applicant: TactoTek Oy
Inventor： Antti Keränen , Sami Torvinen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
CPC classification number: F21V7/00
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.
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公开(公告)号：US11910530B2
公开(公告)日：2024-02-20
申请号：US17704264
申请日：2022-03-25
Applicant: TactoTek Oy
Inventor： Vinski Bräysy , Ilpo Hänninen , Pälvi Apilo , Mikko Heikkinen , Topi Wuori , Mikko Sippari , Heikki Alamäki
Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.
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20.发明公开公开(公告)号：US20230309242A1
公开(公告)日：2023-09-28
申请号：US18191427
申请日：2023-03-28
Applicant: TactoTek Oy
Inventor： Tomi SIMULA , Tapio RAUTIO
CPC classification number: H05K3/284 , H05K3/0067 , H05K1/0393 , H05K1/111 , H05K3/1283 , H05K2203/1316 , H05K2203/1322
Abstract: The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.
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