公开(公告)号：US20170371092A1

公开(公告)日：2017-12-28

申请号：US15672684

申请日：2017-08-09

申请人： TactoTek Oy

发明人： Antti KERANEN ,  Jarmo SAASKI ,  Tuomas HEIKKILA ,  Paavo NISKALA ,  Kari SEVERINKANGAS ,  Sami TORVINEN

IPC分类号： F21V8/00

CPC分类号： G02B6/0065 ,  G02B6/0036 ,  G02B6/0051 ,  G02B6/006 ,  G02B6/0091

摘要： A method for manufacturing an electronic product, including obtaining a flexible, optically substantially transparent or translucent, substrate sheet, printing, by an additive printed electronics process, a plurality of electrical conductors on the substrate sheet, printing or disposing, a plurality of electronic components including optoelectronic light emissive components on the substrate sheet, at least some of the printed conductors being configured to provide electrical current thereto, providing at least one graphic on the substrate sheet, the at least one graphic configured to enable outcoupling of light, and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate sheet to establish a multi-layer structure, the light emitted by the light emissive components being received by the lightguide sheet, propagating therewithin, and then being at least partly emitted to the environment through the at least one graphic.

公开(公告)号：US20180149321A1

公开(公告)日：2018-05-31

申请号：US15824152

申请日：2017-11-28

申请人： TactoTek Oy

发明人： Sami TORVINEN

IPC分类号： F21K9/61 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/00 ,  F21V8/00

CPC分类号： F21K9/61 ,  F21Y2103/10 ,  F21Y2103/37 ,  F21Y2115/10 ,  G02B6/0001 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H05K1/0274 ,  H05K1/0284 ,  H05K1/0296 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/1216 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/1105

摘要： Embodiments of light-emittting multilayer structures incorporating substrate films 3D-formed with recesses for light sources and plastics material molded thereupon are presented. Related methods of manufacture are set forth as well.

公开(公告)号：US20240003516A1

公开(公告)日：2024-01-04

申请号：US18339427

申请日：2023-06-22

申请人： TactoTek Oy

发明人： Antti KERÄNEN ,  Sami TORVINEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC分类号： F21V7/00

CPC分类号： F21V7/00

摘要： An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

公开(公告)号：US20240021764A1

公开(公告)日：2024-01-18

申请号：US18476676

申请日：2023-09-28

申请人： TactoTek Oy

发明人： Antti KERÄNEN ,  Sami TORVINEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC分类号： H01L33/60 ,  H01L33/00 ,  H01L33/62 ,  H01L25/075

CPC分类号： H01L33/60 ,  H01L33/005 ,  H01L33/62 ,  H01L25/0753 ,  H01L2933/0058 ,  H01L2933/0066

摘要： An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

公开(公告)号：US20150308639A1

公开(公告)日：2015-10-29

申请号：US14264273

申请日：2014-04-29

申请人： Tactotek Oy

发明人： Antti KERANEN ,  Jarmo SAASKI ,  Tuomas HEIKKILA ,  Paavo NISKALA ,  Kari SEVERINKANGAS ,  Sami TORVINEN

IPC分类号： F21K99/00 ,  F21V8/00

CPC分类号： G02B6/0065 ,  G02B6/0036 ,  G02B6/0051 ,  G02B6/006 ,  G02B6/0091

摘要： A method for manufacturing an electronic product, includes: obtaining a flexible, optically substantially transparent or translucent, substrate sheet; printing a number of electrical conductors on the substrate sheet in accordance with a predefined schematic; printing or disposing a number of electronic components including optoelectronic light emissive, preferably LED (light-emitting diode), components on the substrate sheet in accordance with the schematic, wherein at least some of the printed conductors are configured to provide electrical current thereto; and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate so as to establish a functional multi-layer structure, where the light emitted by the light emissive components is incoupled to the lightguide, propagates therewithin, and is at least partly outcoupled to the environment through the substrate sheet. Related arrangement and electronic device are presented.

摘要翻译： 一种电子产品的制造方法，包括：获得柔性光学上基本上透明或半透明的基片; 根据预定示意图在基片上印刷多个电导体; 根据示意图，在基板上打印或布置包括光电发光，优选LED（发光二极管））的多个电子部件，其中至少一些印刷导体被配置为向其提供电流; 以及将柔性的光学上基本上透明的光导薄片附接到所述基底上，以便建立功能性多层结构，其中由所述光发射组件发射的光被耦合到所述光导，在其中传播，并且至少部分地耦合到 通过基板的环境。 介绍了相关的布置和电子设备。