公开(公告)号：US20170371092A1

公开(公告)日：2017-12-28

申请号：US15672684

申请日：2017-08-09

申请人： TactoTek Oy

发明人： Antti KERANEN ,  Jarmo SAASKI ,  Tuomas HEIKKILA ,  Paavo NISKALA ,  Kari SEVERINKANGAS ,  Sami TORVINEN

IPC分类号： F21V8/00

CPC分类号： G02B6/0065 ,  G02B6/0036 ,  G02B6/0051 ,  G02B6/006 ,  G02B6/0091

摘要： A method for manufacturing an electronic product, including obtaining a flexible, optically substantially transparent or translucent, substrate sheet, printing, by an additive printed electronics process, a plurality of electrical conductors on the substrate sheet, printing or disposing, a plurality of electronic components including optoelectronic light emissive components on the substrate sheet, at least some of the printed conductors being configured to provide electrical current thereto, providing at least one graphic on the substrate sheet, the at least one graphic configured to enable outcoupling of light, and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate sheet to establish a multi-layer structure, the light emitted by the light emissive components being received by the lightguide sheet, propagating therewithin, and then being at least partly emitted to the environment through the at least one graphic.

公开(公告)号：US20240003516A1

公开(公告)日：2024-01-04

申请号：US18339427

申请日：2023-06-22

申请人： TactoTek Oy

发明人： Antti KERÄNEN ,  Sami TORVINEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC分类号： F21V7/00

CPC分类号： F21V7/00

摘要： An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

公开(公告)号：US20240004119A1

公开(公告)日：2024-01-04

申请号：US18326110

申请日：2023-05-31

申请人： TactoTek Oy

发明人： Antti KERÄNEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC分类号： F21V8/00

CPC分类号： G02B6/0031 ,  G02B6/0021 ,  G02B6/0065 ,  G02B6/0041 ,  G02B6/0043 ,  G02B6/0036 ,  G02B6/0061 ,  G02B6/0068 ,  G02B6/0055 ,  G02B6/0073 ,  G02B6/004 ,  G02B6/0051 ,  G02B6/0083 ,  G02B5/0883

摘要： An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.

公开(公告)号：US20190090353A1

公开(公告)日：2019-03-21

申请号：US16195179

申请日：2018-11-19

申请人： TACTOTEK OY

发明人： Paavo NISKALA ,  Pasi RAAPPANA ,  Mikko HEIKKINEN ,  Mikko SIPPARI ,  Jarkko TORVINEN

IPC分类号： H05K3/12 ,  H05K1/18 ,  H05K3/28 ,  H05K3/00 ,  H05K3/30 ,  H05K1/09 ,  H05K1/02

摘要： A method for manufacturing an electronic product, comprising providing a flexible, optionally optically substantially transparent or translucent, substrate film, printing a number of conductive traces of conductive ink on the substrate film, said traces defining a number of conductors and conductive contact areas for the contacts of at least one electronic surface-mountable component, disposing the at least one electronic surface-mountable component, such as an integrated circuit, on the substrate film so that the contacts meet the predefined contact areas when they are still wet to establish the electrical connection therebetween, and further securing, optionally overmoulding, the component. Related arrangement and electronic product are presented.

公开(公告)号：US20240021764A1

公开(公告)日：2024-01-18

申请号：US18476676

申请日：2023-09-28

申请人： TactoTek Oy

发明人： Antti KERÄNEN ,  Sami TORVINEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC分类号： H01L33/60 ,  H01L33/00 ,  H01L33/62 ,  H01L25/075

CPC分类号： H01L33/60 ,  H01L33/005 ,  H01L33/62 ,  H01L25/0753 ,  H01L2933/0058 ,  H01L2933/0066

摘要： An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

公开(公告)号：US20240004120A1

公开(公告)日：2024-01-04

申请号：US18339467

申请日：2023-06-22

申请人： TactoTek Oy

发明人： Antti KERÄNEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC分类号： F21V8/00

CPC分类号： G02B6/0031 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0065 ,  G02B6/0051 ,  G02B6/0036 ,  G02B6/0083 ,  G02B6/0061 ,  G02B6/0021 ,  G02B6/004 ,  G02B6/0043 ,  G02B6/0055 ,  G02B6/0041 ,  G02B5/0883

摘要： An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective laver towards the plastic layer.

公开(公告)号：US20150308639A1

公开(公告)日：2015-10-29

申请号：US14264273

申请日：2014-04-29

申请人： Tactotek Oy

发明人： Antti KERANEN ,  Jarmo SAASKI ,  Tuomas HEIKKILA ,  Paavo NISKALA ,  Kari SEVERINKANGAS ,  Sami TORVINEN

IPC分类号： F21K99/00 ,  F21V8/00

CPC分类号： G02B6/0065 ,  G02B6/0036 ,  G02B6/0051 ,  G02B6/006 ,  G02B6/0091

摘要： A method for manufacturing an electronic product, includes: obtaining a flexible, optically substantially transparent or translucent, substrate sheet; printing a number of electrical conductors on the substrate sheet in accordance with a predefined schematic; printing or disposing a number of electronic components including optoelectronic light emissive, preferably LED (light-emitting diode), components on the substrate sheet in accordance with the schematic, wherein at least some of the printed conductors are configured to provide electrical current thereto; and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate so as to establish a functional multi-layer structure, where the light emitted by the light emissive components is incoupled to the lightguide, propagates therewithin, and is at least partly outcoupled to the environment through the substrate sheet. Related arrangement and electronic device are presented.

摘要翻译： 一种电子产品的制造方法，包括：获得柔性光学上基本上透明或半透明的基片; 根据预定示意图在基片上印刷多个电导体; 根据示意图，在基板上打印或布置包括光电发光，优选LED（发光二极管））的多个电子部件，其中至少一些印刷导体被配置为向其提供电流; 以及将柔性的光学上基本上透明的光导薄片附接到所述基底上，以便建立功能性多层结构，其中由所述光发射组件发射的光被耦合到所述光导，在其中传播，并且至少部分地耦合到 通过基板的环境。 介绍了相关的布置和电子设备。

公开(公告)号：US20150257278A1

公开(公告)日：2015-09-10

申请号：US14198833

申请日：2014-03-06

申请人： TactoTek Oy

发明人： Paavo NISKALA ,  Pasi RAAPPANA ,  Mikko HEIKKINEN ,  Mikko SIPPARI ,  Jarkko TORVINEN

IPC分类号： H05K3/12 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30

CPC分类号： H05K3/1216 ,  H05K1/0284 ,  H05K1/092 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/0108 ,  H05K2203/1105 ,  H05K2203/1316 ,  Y10T29/53174

摘要： A method for manufacturing an electronic product, comprising providing a flexible, optionally optically substantially transparent or translucent, substrate film, printing a number of conductive traces of conductive ink on the substrate film, said traces defining a number of conductors and conductive contact areas for the contacts of at least one electronic surface-mountable component, disposing the at least one electronic surface-mountable component, such as an integrated circuit, on the substrate film so that the contacts meet the predefined contact areas when they are still wet to establish the electrical connection therebetween, and further securing, optionally overmoulding, the component. Related arrangement and electronic product are presented.

摘要翻译： 一种用于制造电子产品的方法，包括提供柔性的，可选地光学上基本上透明或半透明的基底膜，在基底膜上印刷多个导电墨水导电迹线，所述迹线限定多个导体和导电接触区域，用于 至少一个电子表面可安装部件的接触件，将至少一个电子表面安装部件（例如集成电路）布置在基板膜上，使得当它们仍然是湿的时候触点满足预定的接触区域以建立电气 连接，并且进一步固定，任选地包覆成型组件。 介绍相关安排和电子产品。