公开(公告)号：US853351A

公开(公告)日：1907-05-14

申请号：US1905273766

申请日：1905-08-11

申请人： FULTON CO

发明人： FULTON WESTON M

CPC分类号： B23K3/0471

公开(公告)号：US20160050763A1

公开(公告)日：2016-02-18

申请号：US14460296

申请日：2014-08-14

申请人： Apple Inc.

发明人： Chiu-Yu Tang ,  Ibuki Kamei ,  Timothy J. Rasmussen

IPC分类号： H05K3/28 ,  H05K1/11 ,  B23K1/20 ,  H05K3/34 ,  H05K13/04 ,  B23K1/00 ,  H05K1/18 ,  H05K1/02

CPC分类号： B23K1/20 ,  B23K1/0016 ,  B23K3/0471 ,  H05K3/284 ,  H05K3/34 ,  H05K3/3494 ,  H05K2201/10287 ,  H05K2203/1322 ,  H05K2203/304

摘要： A method for connecting or terminating wires to a printed circuit is disclosed. The method includes applying layers, such as a first layer and a second layer, to the printed circuit. The first layer is applied over several active components on the printed circuit, and provides a sealant against ingress of contaminants in the active components. The second layer is a rigid layer applied over the first layer. When the printed circuit is placed in a fixture, a metallic element, such as a thermode or hot bar, presses against the wires to hold the wires against several terminals on the printed circuit. The metallic element is heated to melt solder between the wires and the terminals. The second layer is configured to resist compressive forces from the metallic element and the fixture, such that the printed circuit and the active components are not damaged during the connection process.

摘要翻译： 公开了一种用于将电线连接或接线到印刷电路的方法。 该方法包括将诸如第一层和第二层的层施加到印刷电路。 第一层施加在印刷电路上的几个活性组分上，并且提供了防止活性组分中的污染物侵入的密封剂。 第二层是施加在第一层上的刚性层。 当印刷电路放置在固定装置中时，诸如热电极或热棒之类的金属元件压在电线上，以将电线固定在印刷电路上的几个端子上。 金属元件被加热以在焊丝和端子之间熔化焊料。 第二层被配置为抵抗来自金属元件和夹具的压缩力，使得印刷电路和有源部件在连接过程中不被损坏。

公开(公告)号：US20120312863A1

公开(公告)日：2012-12-13

申请号：US13561460

申请日：2012-07-30

申请人： Kuniaki Sueoka

发明人： Kuniaki Sueoka

IPC分类号： B23K31/12

CPC分类号： B23K3/0471 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/755 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/00

摘要： An apparatus includes a tool head configured for bonding to establish 100 or more electrical and mechanical connections between a silicon chip having a thickness of about 50 microns (μm) or smaller and a substrate, wherein 100 or more solder bumps set on a plurality of contacts on the silicon chip or a plurality of contacts on the substrate are melted by heating between the plurality of contacts of the silicon chip and the substrate, and wherein the melted solder bumps are solidified by cooling using forced convection of air flowing from around the silicon chip. The tool head includes a pyrolytic graphite sheet configured to be used in direct contact with the silicon chip, and having a thickness between about 75 μm and 125 μm.

摘要翻译： 一种装置包括：工具头，其构造成用于在具有约50微米（μm）或更小的厚度的硅芯片与衬底之间建立100个或更多个电气和机械连接，其中设置在多个触点上的100个或更多个焊料凸块 在硅芯片上或多个基板上的触点通过在硅芯片的多个触点和基板之间的加热而熔化，并且其中熔融的焊料凸起通过冷却使得从硅芯片周围流动的空气的强制对流而固化 。 工具头包括被配置为直接与硅芯片接触并且具有在约75μm和125μm之间的厚度的热解石墨片。

公开(公告)号：US07860378B2

公开(公告)日：2010-12-28

申请号：US11814166

申请日：2005-01-18

申请人： Yoshitomo Teraoka

发明人： Yoshitomo Teraoka

IPC分类号： A61H33/08 ,  F01P7/02

CPC分类号： B23K1/012 ,  B23K1/0016 ,  B23K3/0471 ,  B23K3/087 ,  B23K37/0408 ,  B23K37/0443 ,  B23K2101/42

摘要： In a baffle device 20 fixedly provided in an air passage of a mechanism for blowing out hot air to a solder treatment portion, vanes inclined with a predetermined inclination angle with respect to an air flow are provided substantially radially with a predetermined interval. Also, in a nozzle to be attached to the hot air blower for solder treatment, the baffle device 20 is fixedly provided in an in-nozzle air passage. Moreover, in the hot air blower for solder treatment which blows out hot air to the solder treatment portion, the baffle device 20 is fixedly provided in an in-blower air passage.

摘要翻译： 在固定设置在用于将热空气吹出到焊接处理部分的机构的空气通道中的挡板装置20中，以预定间隔大致径向地设置相对于空气流以预定倾斜角度倾斜的叶片。 此外，在要连接到用于焊接处理的热风鼓风机的喷嘴中，挡板装置20固定地设置在喷嘴内空气通道中。 此外，在将热空气吹向焊料处理部的焊接处理用热风鼓风机中，挡板装置20固定地设置在鼓风机空气通路内。

公开(公告)号：US07377775B2

公开(公告)日：2008-05-27

申请号：US11444118

申请日：2006-05-31

申请人： Hideki Ogawa

发明人： Hideki Ogawa

IPC分类号： F27B9/02

CPC分类号： B23K1/008 ,  B23K1/012 ,  B23K3/0471 ,  H05K3/3494

摘要： According to one embodiment, a heating apparatus includes, a heating chamber, a fan provided in the heating chamber, the fan blowing atmosphere upward, a heater provided in the heating chamber and above the fan, the heater heating the atmosphere blown by the fan, a plurality of first straightening vanes arranged in a substantially horizontal direction so as to be spaced apart from one another in the heating chamber and above the heater, a plurality of second straightening vanes arranged in a substantially horizontal direction so as to be spaced apart from one another in the heating chamber and above the first straightening vanes, each of the plurality of second straightening vanes overlapping both of its adjacent first straightening vanes, and a transfer unit which transfers a board, at least part of the transfer unit being provided in the heating chamber and located above the second straightening vanes.

摘要翻译： 根据一个实施例，加热装置包括：加热室，设置在加热室中的风扇，向上风扇吹风;加热器设置在加热室中，风扇上方，加热器加热由风扇吹送的空气; 多个第一矫直叶片，其布置在大致水平的方向上，以在所述加热室中和所述加热器之间彼此间隔开;多个第二矫直叶片，其布置在基本上水平的方向上，以与其间隔开 另一个在加热室中并且在第一矫直叶片上方，多个第二矫直叶片中的每一个与其相邻的第一矫正叶片重叠，以及传送单元，其传送板，至少部分传送单元设置在加热 并且位于第二矫直叶片上方。

公开(公告)号：US20040195292A1

公开(公告)日：2004-10-07

申请号：US10405772

申请日：2003-04-01

发明人： Yokoyama Tetuo ,  Ishihara Toshinobu

IPC分类号： B23K001/002

CPC分类号： B23K3/08 ,  B23K3/033 ,  B23K3/0471 ,  B23K3/0478

摘要： A soldering station with indicator lights to display system status is provided. The soldering station comprising a power supply and a control board coupled to the power supply. The control board is operable to adjust output of the power supply. The soldering station further comprises a card reader coupled to the control board. The card reader receives a control card from a user. The control card allows the user to change the settings of the soldering station. The soldering station also includes a plurality of indicator lights. The plurality if indicator lights illuminate in patterns that are indicative of the status of the soldering station.

摘要翻译： 提供一个显示系统状态的带指示灯的焊台。 焊接站包括电源和耦合到电源的控制板。 控制板可操作以调节电源的输出。 焊接站还包括耦合到控制板的读卡器。 读卡器从用户接收控制卡。 控制卡允许用户更改焊台的设置。 焊台还包括多个指示灯。 多个指示灯以指示焊接站的状态的图案照亮。

公开(公告)号：US06633021B2

公开(公告)日：2003-10-14

申请号：US10000797

申请日：2001-12-04

申请人： Kensei Matubara

发明人： Kensei Matubara

IPC分类号： B23K300

CPC分类号： B23K3/02 ,  B23K1/012 ,  B23K3/0376 ,  B23K3/0471

摘要： It is an object to provide a solder iron such that in the solder iron for blowing out a heating gas flow to a periphery of a forward end tip, the heating gas flow having stable temperature is generated. A nozzle section is provided to a forward end tip heated by heating means of a solder iron main body, an orifice section is formed between a heating gas flow generating chamber and the nozzle section, and a back pressure of thermally expanded heating gas and a pressure of gas successively supplied are balanced in the heating gas flow generating chamber.

摘要翻译： 本发明的目的是提供一种焊铁，使得在用于吹出向前端尖端的周边的加热气流的焊铁中，产生具有稳定温度的加热气流。 喷嘴部分设置在由焊铁主体的加热装置加热的前端尖端上，在加热气体流产生室和喷嘴部之间形成有孔部分，并且热膨胀加热气体的背压和压力 连续供应的气体在加热气体发生室中平衡

公开(公告)号：US20020003137A1

公开(公告)日：2002-01-10

申请号：US09863685

申请日：2001-05-22

申请人： KYOCERA CORPORATION

发明人： Kiyoshi Yokoyama ,  Takafumi Turumaru ,  Hiroyuki Arima ,  Hideaki Shimozuru

IPC分类号： H05B003/00

CPC分类号： H05B1/00 ,  B23K3/0471 ,  H01L21/67103 ,  H01L24/81 ,  H01L2924/12042 ,  H01L2924/00

摘要： There is provided a bonding heater used to package a semiconductor chip on a multilayer substrate, which has adaptability to various chip sizes, with an excellent maintenance characteristics, with undesirable displacement of the chip at the time of mounting a semiconductor chip being made as small as possible and also with a temperature rise time to a desired temperature being shortened. This bonding heater is constituted by a ceramic tool for pressing an object to be heated, a ceramic heater for heating the tool, a heat insulating member for transferring heat generated by the ceramic heater mainly to the tool side and a holder for integrating these members and connecting these members to another member, and the tool, ceramic heater, heat insulating member and holder are detachably bonded.

公开(公告)号：US20010004982A1

公开(公告)日：2001-06-28

申请号：US09739963

申请日：2000-12-20

发明人： Kyoji Moro

IPC分类号： H05B001/02

CPC分类号： B23K3/033 ,  B23K3/047 ,  B23K3/0471 ,  B23K3/0478

摘要： This reflow soldering apparatus comprises a heater tip 10 for soldering sites to be soldered of a workpiece W by reflow method, a power supply unit for supplying an electric power for heat generation or heating to the heater tip, a control unit for providing a control of the supplied current in the power supply unit, and a pressing unit 16 for pressing the heater tip against the sites to be soldered of the workpiece W. An inverter of the power supply unit has four transistor switching elements. By the control unit by way of a driving circuit, the first set of switching elements and are simultaneously switching (ON/OFF) controlled at a predetermined inverter frequency (e.g., 10 kHz) in response to in-phase inverter control signals G1 and G3, whereas the second set of switching elements are simultaneously switching controlled at the inverter frequency in response to in-phase inverter control signals G2 and G4.

摘要翻译： 这种回流焊接装置包括用于通过回流焊接焊接工件W的位置的加热器末端10，用于向加热器端提供用于发热或加热的电力的电源单元，用于提供对 电源单元中的供电电流，以及用于将加热器尖端压靠在待焊接工件W的位置的按压单元16.电源单元的逆变器具有四个晶体管开关元件。 通过驱动电路的控制单元，响应于同相逆变器控制信号G1和G3，第一组开关元件同时开关（ON / OFF）以预定的反相器频率（例如10kHz）控制 而第二组开关元件响应于同相逆变器控制信号G2和G4而以逆变器频率同时开关控制。

公开(公告)号：US4942282A

公开(公告)日：1990-07-17

申请号：US367164

申请日：1989-06-16

申请人： Wayne P. Jensen

发明人： Wayne P. Jensen

IPC分类号： B23K3/047 ,  H05B3/10 ,  H05K3/34

CPC分类号： B23K3/0471 ,  H05B3/10 ,  H05K3/3421 ,  H05K3/3494

摘要： The transverse member (29) of a reflow soldering heater bar (23) is slotted at intervals to reduce thermal expansion. The slots (63), which typically extend orthogonally through the transverse member (29) and the connecting legs (61) of the heater bar (23), may extend diagonally therethrough to prevent missed welds.

摘要翻译： 回流焊接加热棒（23）的横向构件（29）间隔开以减小热膨胀。 典型地通过横向构件（29）和加热棒（23）的连接腿（61）正交地延伸的槽63可以对角地延伸穿过其中，以防止漏失焊缝。