摘要:
Coated abrasive articles comprise a backing and an abrasive layer, and optionally at least one of a backsize layer, tie layer, supersize layer, presize layer, or saturant. The coated abrasive article comprises a reaction product of components comprising: polyfunctional acrylate; polyfunctional cationically polymerizable material; free radical photoinitiator; triarylsulfonium salt having the formula 1 wherein R1, R2 and R3 independently represent an, optionally substituted, aromatic group having from about 4 to about 20 carbon atoms, and Ynull represents a non-interfering anion; and quaternary ammonium salt having the formula 2 wherein Xnull is a non-interfering anion.
摘要:
Abrasive articles abrasive articles (e.g., abrasive wheels) comprised of abrasive agglomerate particles dispersed within cellular polymeric material, and methods of making and using the abrasive articles.
摘要:
A material with a mesh of fibers and a binder material holding the fibers in the mesh can be used on a carrier head or a polishing pad. A polishing apparatus can include a pad cleaner with nozzles to direct jets of cleaning fluid onto the polishing pad and a brush to agitate a surface of the polishing pad.
摘要:
An abrasive film for polishing a workpiece, including: (a) a substrate; (b) a binder; (c) a multiplicity of abrasive grains which are fixed to a surface of the substrate by the binder; and (d) a water-soluble inorganic compound or a water-soluble organic acid alkali metal salt which is added to the binder. The water-soluble inorganic compound preferably consists of a weak-alkali metal salt or a weak-acid metal salt. The water-soluble organic acid alkali metal salt preferably consists of an anionic surface-active agent or a carboxylic acid alkali metal salt.
摘要:
The present invention relates to a polishing pad for the chemical mechanical polishing (CMP). According to the present invention, there is provided a chemical mechanical polishing pad for polishing a semiconductor wafer with chemicals containing predetermined components supplied between the semiconductor wafer and the polishing pad, comprising a base layer; and an abrasive layer which contains polishing abrasives capsulated with a material soluble in the chemicals and is formed to have a constant thickness on the top surface of the base layer. The capsulated polishing abrasives become free abrasives in the chemicals supplied upon polishing, and take part in the polishing. Capsulating the polishing abrasives can be performed by granulization or spraying. According to the polishing pad of the present invention, planarization polishing can be performed as whole. In addition, since a small amount of chemicals are used, it is advantageous in the economic and environmental aspects.
摘要:
A bonded-abrasive tool includes a matrix of an organic bond, abrasive grains dispersed in the organic bond and a grinding aid in the form of either an inorganic nonhalogenated filler or a hydrated filler. The inorganic nonhalogenated filler can react with free radicals released from the organic bond during grinding. The hydrated filler endothermically releases water. A coated-abrasive tool includes a flexible substrate, abrasive grains bonded to the flexible substrate, and an organic bond containing a grinding aid including an inorganic nonhalogenated filler or a hydrated filler coated on the substrate.
摘要:
A coated abrasive article having a backing and an abrasive layer coated on the first major surface of the backing, wherein a cross-section of the abrasive layer normal to the thickness and at a center point of the thickness has a total cross-sectional area of abrasive agglomerates which is substantially the same as that at a point along the thickness which is 75% of a distance between the center point and the contact side; a coated abrasive article having a bond system with a Knoop hardness number of at least 70; a coated abrasive article comprising abrasive agglomerates in the shape of a truncated four-sided pyramid; a method of making the coated abrasive article; and a method of abrading a hard workpiece using a coated abrasive article.
摘要:
Disclosed is a polishing method including the step of: polishing a surface of a member to be polished by rotating and sliding an abrasive wheel holding fixed abrasive grains on the surface of the wheel while supplying free abrasive grains to the surface of the member to be polished; wherein the abrasive wheel is formed by binding the fixed abrasive grains with a soft binder and a pore forming agent. This polishing method is effective to obtain a high flatness of a polished surface and improve surface characteristics of the polished surface, and also to obtain a high continuous-workability by stably keeping a polishing ability for a long period of time.
摘要:
An abrasive article, for example, a coated, bonded, or nonwoven abrasive article comprising a binder, a plurality of abrasive particles, and an antiloading component.
摘要:
A resin bonded abrasive tool consists of abrasive grain and an organic bond comprising a thermosetting resin, such as epoxy resin, phenolic resin or rubber or blends thereof and a precursor filler system capable of forming in situ an active filler system by reacting under the heat generated during grinding. The organic bond optionally further comprises a filler system. A method of making the resin bonded abrasive tool consists of mixing the abrasive grain and the organic bond with the precursor filler system, pressing the resulting mixture into shape, and curing the abrasive tool at about 150 to 200.degree. C.