公开(公告)号：US09077978B2

公开(公告)日：2015-07-07

申请号：US13697175

申请日：2011-05-19

申请人： Shuzo Sato ,  Eiji Otani ,  Ken Ozawa ,  Seiji Kobayashi

发明人： Shuzo Sato ,  Eiji Otani ,  Ken Ozawa ,  Seiji Kobayashi

IPC分类号： H04N13/02 ,  G03B35/08 ,  H01L27/146 ,  H04N9/04

CPC分类号： H04N13/218 ,  G02B5/3058 ,  G02B5/3083 ,  G02B23/2415 ,  G02B27/26 ,  G03B35/08 ,  H01L27/14603 ,  H01L27/14625 ,  H04N9/045 ,  H04N13/257

摘要： This invention relates to capturing an image of a subject as a three-dimensional image using a single image-capturing apparatus. The image-capturing apparatus includes a first polarization means, a lens system, and an image-capturing device array having a second polarization means. The first polarization means includes first and second regions arranged along a first direction, and the second polarization means includes multiple third and fourth regions arranged alternately along a second direction. First region transmission light having passed the first region passes the third region and reaches the image-capturing device, and second region transmission light having passed the second region passes the fourth region and reaches the image-capturing device. Thus, an image is captured to obtain a three-dimensional image in which a distance between a barycenter BC1 of the first region and a barycenter BC2 of the second region is a base line length of parallax between two eyes.

摘要翻译： 本发明涉及使用单个图像捕获装置将被摄体的图像作为三维图像进行拍摄。 图像捕获装置包括第一偏振装置，透镜系统和具有第二偏振装置的图像捕获装置阵列。 第一偏振装置包括沿着第一方向布置的第一和第二区域，并且第二偏振装置包括沿着第二方向交替布置的多个第三和第四区域。 经过第一区域的第一区域透射光通过第三区域并到达图像捕获装置，并且经过第二区域的第二区域透射光通过第四区域并到达图像捕获装置。 因此，拍摄图像以获得三维图像，其中第一区域的重心BC1和第二区域的重心BC2之间的距离是双眼之间视差的基线长度。

公开(公告)号：US20130063569A1

公开(公告)日：2013-03-14

申请号：US13697175

申请日：2011-05-19

申请人： Shuzo Sato ,  Eiji Otani ,  Ken Ozawa ,  Seiji Kobayashi

发明人： Shuzo Sato ,  Eiji Otani ,  Ken Ozawa ,  Seiji Kobayashi

IPC分类号： H04N13/02

CPC分类号： H04N13/218 ,  G02B5/3058 ,  G02B5/3083 ,  G02B23/2415 ,  G02B27/26 ,  G03B35/08 ,  H01L27/14603 ,  H01L27/14625 ,  H04N9/045 ,  H04N13/257

摘要： This invention relates to capturing an image of a subject as a three-dimensional image using a single image-capturing apparatus. The image-capturing apparatus includes a first polarization means, a lens system, and an image-capturing device array having a second polarization means. The first polarization means includes first and second regions arranged along a first direction, and the second polarization means includes multiple third and fourth regions arranged alternately along a second direction. First region transmission light having passed the first region passes the third region and reaches the image-capturing device, and second region transmission light having passed the second region passes the fourth region and reaches the image-capturing device. Thus, an image is captured to obtain a three-dimensional image in which a distance between a barycenter BC1 of the first region and a barycenter BC2 of the second region is a base line length of parallax between two eyes.

摘要翻译： 本发明涉及使用单个图像捕获装置将被摄体的图像作为三维图像进行拍摄。 图像捕获装置包括第一偏振装置，透镜系统和具有第二偏振装置的图像捕获装置阵列。 第一偏振装置包括沿着第一方向布置的第一和第二区域，并且第二偏振装置包括沿着第二方向交替布置的多个第三和第四区域。 经过第一区域的第一区域透射光通过第三区域并到达图像捕获装置，并且经过第二区域的第二区域透射光通过第四区域并到达图像捕获装置。 因此，拍摄图像以获得三维图像，其中第一区域的重心BC1和第二区域的重心BC2之间的距离是双眼之间视差的基线长度。

公开(公告)号：US20070051632A1

公开(公告)日：2007-03-08

申请号：US11590723

申请日：2006-10-31

申请人： Shuzo Sato ,  Yuji Segawa ,  Akira Yoshio ,  Takeshi Nogami

发明人： Shuzo Sato ,  Yuji Segawa ,  Akira Yoshio ,  Takeshi Nogami

IPC分类号： C25D5/02

CPC分类号： C25D5/02 ,  B24B37/042 ,  C25D5/04 ,  C25D7/123 ,  C25D17/001 ,  C25D21/12 ,  C25F3/16 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/32115 ,  H01L21/3212 ,  H01L21/7684 ,  H01L21/76888

摘要： A polishing method and polishing apparatus able to easily flatten an initial unevenness with an excellent efficiency of removal of excess copper film and suppress damage to a lower interlayer insulation film, and a plating method and plating apparatus able to deposit a flat copper film. The polishing method comprises the steps of measuring thickness equivalent data of a film on a wafer, making a cathode member smaller than the surface face a region thereof, interposing an electrolytic solution between the surface and the cathode member, applying a voltage using the cathode member as a cathode and the film an anode, performing electrolytic polishing by electrolytic elution or anodic oxidation and chelation and removal of a chelate film in the same region preferentially from projecting portions of the film until removing the target amount of film obtained from the thickness equivalent data, and repeating steps of moving the cathode member to another region to flattening the regions over the entire surface. Further, plating is performed by a reverse reaction of the above.

摘要翻译： 一种抛光方法和抛光装置，其能够以极好的去除多余的铜膜的效率并且抑制对下层间绝缘膜的损坏而容易地平坦化初始凹凸，以及能够沉积扁平铜膜的电镀方法和电镀装置。 抛光方法包括以下步骤：测量晶片上的膜的厚度当量数据，使阴极部件小于表面面积的阴极部件，在电极表面和阴极部件之间插入电解液，使用阴极部件施加电压 作为阴极，膜是阳极，通过电解洗脱或阳极氧化进行电解抛光，并优先从膜的突出部分螯合并除去相同区域中的螯合膜，直到从厚度等效数据中除去目标量的膜 并且重复将阴极部件移动到另一区域以使整个表面上的区域变平的步骤。 此外，通过上述的反作用进行电镀。

公开(公告)号：US06846227B2

公开(公告)日：2005-01-25

申请号：US10085747

申请日：2002-02-28

申请人： Shuzo Sato ,  Zenya Yasuda ,  Masao Ishihara ,  Hiizu Ootorii ,  Takeshi Nogami ,  Naoki Komai

发明人： Shuzo Sato ,  Zenya Yasuda ,  Masao Ishihara ,  Hiizu Ootorii ,  Takeshi Nogami ,  Naoki Komai

IPC分类号： B23H3/00 ,  B24B7/22 ,  B24B21/04 ,  B24B37/04 ,  B24B57/02 ,  C25F7/00 ,  H01L21/3205 ,  H01L21/321 ,  H01L21/768 ,  B24B29/00

CPC分类号： B24B37/04 ,  B24B7/228 ,  B24B21/04 ,  B24B57/02 ,  Y10S451/908

摘要： The electro-chemical machining apparatus of this invention is designed to smoothing a metal film by efficiently reducing initial rough surface and removing excessive metal film with reduced damages to the metal film. For this end, the electro-chemical machining apparatus performs electro-chemical machining of an object to be machined having a metal film on the surface to be machined. Such apparatus has a means for holding the object to be machined, a wiper for wiping the surface of the object to be machined, a means for supplying electrolytic solution onto the surface of the object to be machined, a first electrode disposed at a position opposed to the surface of the object to be machined, a second electrode disposed at a peripheral portion on the surface of the object to be machined, and a power supply for causing electrical current to flow between the second electrode on the surface of the object to be machined and the first electrode.

摘要翻译： 本发明的电化学加工装置被设计成通过有效地降低初始粗糙表面并且减少对金属膜的损伤去除过量的金属膜来平滑金属膜。 为此，电化学加工装置对待加工表面上具有金属膜的被加工物进行电化学加工。 这种装置具有用于保持待加工物体的装置，用于擦拭待加工物体的表面的擦拭器，用于将电解液供给到待加工物体的表面上的装置，设置在相对的位置的第一电极 到被加工物的表面，设置在被加工物的表面的周边部分的第二电极，以及用于使电流在物体表面上的第二电极之间流动的电源为 加工和第一个电极。

公开(公告)号：US5727111A

公开(公告)日：1998-03-10

申请号：US661460

申请日：1996-06-11

申请人： Hidehiro Kume ,  Kimihiro Saito ,  Shuzo Sato ,  Takeshi Kubo

发明人： Hidehiro Kume ,  Kimihiro Saito ,  Shuzo Sato ,  Takeshi Kubo

IPC分类号： G02B6/42 ,  G11B7/09 ,  G11B7/12 ,  G11B7/13 ,  G11B7/135 ,  G02B6/00 ,  G11B7/00

CPC分类号： G11B7/1359 ,  G02B6/4214 ,  G11B7/123 ,  G11B7/131 ,  G11B7/1362 ,  G11B2007/13727 ,  G11B7/0912

摘要： A light-deflecting cover for an optical pick-up apparatus has a reflecting portion disposed within a light path of a light beam projected from a light source or light returning from outside the apparatus for deflecting an optical beam for bending the light path. The light deflecting part of the cover is provided with a light absorbing portion for removing unnecessary light which does not contribute to the operating characteristics of optical equipment within which the light deflecting part is provided. The optical pick-up comprises a light-emitting and detecting device, an optical system for focusing and projecting a laser light outputted from the light-emitting and detecting device onto a signal recording surface of an optical disc, and guiding light returning from the signal recording surface of the optical disc to the light-emitting and detecting device and a light deflecting part having a reflecting portion disposed in the light path of the light system for deflecting the light beam for bending the light path, the light deflecting part comprising a light absorbing portion for removing unnecessary light which does not contribute to the operating characteristics of the optical pick-up in which the light deflecting part is provided.

摘要翻译： 用于光学拾取装置的光偏转盖具有设置在从光源投射的光束的光路中的反射部分或从设备外部返回的光，用于偏转用于弯曲光路的光束。 盖的光偏转部分设置有光吸收部分，用于去除不对其中提供光偏转部分的光学设备的操作特性有贡献的不必要的光。 光拾取器包括发光和检测装置，用于将从发光和检测装置输出的激光聚焦并投射到光盘的信号记录表面上的光学系统，以及引导从信号返回的光 将光盘的记录表面传送到发光和检测装置，以及光偏转部分，其具有设置在光系统的光路中的反射部分，用于偏转光束以弯曲光路，光偏转部分包括光 吸收部分，用于去除不影响设置有光偏转部分的光学拾取器的操作特性的不必要的光。

公开(公告)号：US5681212A

公开(公告)日：1997-10-28

申请号：US628325

申请日：1996-04-05

申请人： Hideaki Hayakawa ,  Takatoshi Saito ,  Yoshiaki Komuro ,  Shuzo Sato

发明人： Hideaki Hayakawa ,  Takatoshi Saito ,  Yoshiaki Komuro ,  Shuzo Sato

IPC分类号： B24B37/005 ,  B24B37/30 ,  B24B37/34 ,  B24B41/06 ,  B24B49/16 ,  B24B49/18 ,  B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/304 ,  B24B7/22

CPC分类号： B24B37/345 ,  B24B37/30 ,  B24B41/061 ,  B24B49/16 ,  B24B49/18 ,  B24B53/00 ,  B24B53/017

摘要： Disclosed herein is a polishing including a polishing plate having an upper surface on which a polishing pad is attached, a polishing head having a lower surface opposed to an upper surface of the polishing pad on the polishing plate, for holding a substrate to be polished on the lower surface, and a pressure source for applying a polishing pressure to the polishing head, whereby the substrate held by the polishing head is pressed against the upper surface of the polishing pad under the polishing pressure applied from the pressure source to perform polishing of the substrate. The polishing head is provided with a contact pressure adjusting mechanism capable of adjusting an in-plane contact pressure of the substrate against the upper surface of the polishing pad on the polishing plate at every area of the substrate. Accordingly, the uniformity and the planarity in the plane of the substrate surface to be polished can be improved with a high throughput.

摘要翻译： 本发明公开了一种抛光装置，该抛光装置具有：抛光板，其具有安装有抛光垫的上表面;抛光头，其具有与抛光板上的抛光垫的上表面相对的下表面，用于将待抛光的基板保持在 下表面和用于向研磨头施加抛光压力的压力源，由此由抛光头保持的基板在从压力源施加的抛光压力下被压靠在抛光垫的上表面上，以对抛光头进行抛光 基质。 抛光头设置有接触压力调节机构，该接触压力调节机构能够在衬底的每个区域处调整衬底的面内接触压力与抛光板上的抛光垫的上表面。 因此，能够以高产量提高待研磨的基板表面的平面的均匀性和平坦度。

公开(公告)号：US20120206576A1

公开(公告)日：2012-08-16

申请号：US13502907

申请日：2011-08-24

申请人： Shuzo Sato ,  Eiji Otani ,  Ken Ozawa ,  Seiji Kobayashi

发明人： Shuzo Sato ,  Eiji Otani ,  Ken Ozawa ,  Seiji Kobayashi

IPC分类号： H04N13/02

CPC分类号： G02B5/3058 ,  G03B35/08 ,  G03B35/26 ,  H04N13/218 ,  H04N13/257

摘要： A stereoscopic imaging method where a pixel matrix is divided into groups such that parallax information is received by one pixel group and original information is received by another pixel group. The parallax information may, specifically, be based on polarized information received by subgroups of the one pixel, group and by processing all of the information received multiple images are rendered by the method.

摘要翻译： 一种立体成像方法，其中像素矩阵被划分成组，使得由一个像素组接收视差信息，并且由另一个像素组接收原始信息。 具体而言，视差信息可以基于由一个像素，组的子组接收的偏振信息，并且通过处理通过该方法呈现的所有接收到的多个图像的信息。

公开(公告)号：US07255784B2

公开(公告)日：2007-08-14

申请号：US10694263

申请日：2003-10-27

申请人： Shuzo Sato ,  Takeshi Nogami ,  Zenya Yasuda ,  Masao Ishihara

发明人： Shuzo Sato ,  Takeshi Nogami ,  Zenya Yasuda ,  Masao Ishihara

IPC分类号： C25F3/22 ,  B23H5/06 ,  B23H3/00 ,  B23H3/02

CPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/10

摘要： A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform resulting from electropolishing the metal film. An electropolishing apparatus comprising a current detector for detecting a current waveform resulting from electropolishing a metal film and an end point determination part for determining an electropolishing end point of the metal film on the basis of the change of a current detected with the current detector is used to realize the polishing method.

公开(公告)号：US07141501B2

公开(公告)日：2006-11-28

申请号：US10512745

申请日：2003-04-14

申请人： Hiroshi Horikoshi ,  Takeshi Nogami ,  Shuzo Sato ,  Shingo Takahashi ,  Naoki Komai ,  Kaori Tai ,  Hiizu Ohtorii

发明人： Hiroshi Horikoshi ,  Takeshi Nogami ,  Shuzo Sato ,  Shingo Takahashi ,  Naoki Komai ,  Kaori Tai ,  Hiizu Ohtorii

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： B24B53/017 ,  B24B53/001 ,  C25F3/16

摘要： A polishing method and a polishing apparatus by which excess portions of a metallic film 18 can be removed easily and efficiently in planarizing the metallic film 18 by polishing and which is high in accuracy of polishing, are provided. Also, a method of manufacturing a semiconductor device by use of the polishing method and the polishing apparatus is provided. A substrate 17 provided with the metallic film 18 and a counter electrode 15 are disposed oppositely to each other in an electrolytic solution E, an electric current is passed to the metallic film 18 through the electrolytic solution E, and the surface of the metallic film 18 is polished with a hard pad 14.

摘要翻译： 提供了抛光方法和抛光装置，其通过抛光对金属膜18进行平面化并且抛光精度高而容易且有效地除去金属膜18的多余部分。 此外，提供了通过使用抛光方法和抛光装置制造半导体器件的方法。 设置有金属膜18的基板17和对置电极15在电解液E中相对配置，电流通过电解液E通过金属膜18，金属膜18的表面 用硬垫抛光14。

公开(公告)号：US20050070110A1

公开(公告)日：2005-03-31

申请号：US10919580

申请日：2004-08-17

申请人： Hiizu Ohtorii ,  Kaori Tai ,  Hiroshi Horikoshi ,  Naoki Komai ,  Shuzo Sato

发明人： Hiizu Ohtorii ,  Kaori Tai ,  Hiroshi Horikoshi ,  Naoki Komai ,  Shuzo Sato

IPC分类号： H01L21/3205 ,  C09K13/06 ,  C09K13/08 ,  C23F1/26 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/768 ,  H01L21/4763 ,  H01L21/311

CPC分类号： H01L21/31053 ,  C09K13/06 ,  C09K13/08 ,  C23F1/26 ,  H01L21/3212 ,  H01L21/7684

摘要： An etching solution includes an anticorrosive for copper or a benzotriazole based anticorrosive in a hydrofluoric acid aqueous solution. An etching method makes use of the etching solution set out above. Moreover, a method for manufacturing a semiconductor device which should include the step of removing copper by the etching method. The method includes the steps of forming copper through a barrier layer made of a metal or metal compound, which is greater in ionization tendency than copper, so as to bury a wiring groove formed in an insulating film with the copper, followed by polishing additional copper and barrier layer formed on the insulating film, and etching a surface layer of the insulating film by use of the etching solution to remove an insulating defective layer made mainly of the barrier layer on the insulating film along with the surface layer of the insulating film.

摘要翻译： 蚀刻溶液包括在氢氟酸水溶液中对铜或苯并三唑类防腐蚀剂的防锈剂。 蚀刻方法利用上述蚀刻溶液。 此外，一种制造半导体器件的方法，其应包括通过蚀刻方法去除铜的步骤。 该方法包括通过由金属或金属化合物制成的阻挡层形成铜的步骤，其电离度比铜更大，以便用铜掩埋形成在绝缘膜中的布线槽，然后抛光附加的铜 以及形成在绝缘膜上的阻挡层，并且通过使用蚀刻溶液来蚀刻绝缘膜的表面层，以除去绝缘膜上的主要由绝缘膜上的阻挡层形成的绝缘缺陷层以及绝缘膜的表面层。