摘要:
An optical-electrical transmission connector having resistance to optical axis misalignment, having small loss, easily increasing the number of buses, and capable of being formed of a commonly-used material is provided. In a male connector, one collimating lens facing the other collimating lens when connecting the male connector to a female connector is arranged, and a light guide is arranged corresponding to the focal point of the one collimating lens. A positioning section is arranged corresponding to surroundings of the one collimating lens, and the positioning section has one inclined surface coming into contact with the other inclined surface when connecting the male connector to the female connector.
摘要:
A photoelectric transducer has an optical waveguide and a photoelectric transducer element array of photoelectric transducer elements optically coupled to the optical waveguide. The photoelectric transducer element array has a common conductive layer, and the photoelectric transducer elements are mounted on the common conductive layer in alignment with entrance or exit ends of the optical waveguide. The photoelectric transducer elements having respective first poles, and the photoelectric transducer element array has a second pole disposed in opposite relation to the first poles and connected as a reference potential setting electrode through the common conductive layer to at least two of the photoelectric transducer elements.
摘要:
Disclosed herein is a display panel including a mounting substrate in which one or more light-emitting devices each including one or more light-emitting elements are mounted on a circuit substrate; and a transparent substrate disposed to face the light-emitting device side of the mounting substrate, wherein the transparent substrate has a transparent base material and a resin layer formed on the mounting substrate side of the transparent base material, and the resin layer is in contact with the light-emitting device and has, formed on an upper surface or a side surface of the light-emitting device, an inclined part which spreads from the light-emitting device side toward the transparent base material side.
摘要:
An optical-electrical transmission connector having resistance to optical axis misalignment, having small loss, easily increasing the number of buses, and capable of being formed of a commonly-used material is provided. In a male connector, one collimating lens facing the other collimating lens when connecting the male connector to a female connector is arranged, and a light guide is arranged corresponding to the focal point of the one collimating lens. A positioning section is arranged corresponding to surroundings of the one collimating lens, and the positioning section has one inclined surface coming into contact with the other inclined surface when connecting the male connector to the female connector.
摘要:
A photoelectric conversion element array having a plurality of photoelectric conversion elements (emitting optics 4, receiving optics 5) arranged in an array, and the photoelectric conversion elements 4, 5 are arranged alternately at different positions so that every second one is aligned on the same line in the direction of array. A mounted structure of photoelectric conversion element array, having the emitting optics array and the receiving optics array in the photoelectric conversion element array of this invention, arranged on an interposer substrate 9 so as to oppose therewith, and these arrays are mounted on the interposer substrate 9 through the external connection terminals 7. An optical information processing apparatus 1 having the photoelectric conversion element array of the present invention, and an optical wave guide 3 opposed to the respective optics of the photoelectric conversion element arrays. These configurations not only allow high-density integration of optical interconnects, but also reduce optical interference or crosstalk due to the photoelectric conversion element, and can thereby provide a photoelectric conversion element array allowing efficient propagation of light, an integrated apparatus thereof, a mounted structure of them, and an optical information processing apparatus.
摘要:
A polishing method and a polishing apparatus by which excess portions of a metallic film 18 can be removed easily and efficiently in planarizing the metallic film 18 by polishing and which is high in accuracy of polishing, are provided. Also, a method of manufacturing a semiconductor device by use of the polishing method and the polishing apparatus is provided. A substrate 17 provided with the metallic film 18 and a counter electrode 15 are disposed oppositely to each other in an electrolytic solution E, an electric current is passed to the metallic film 18 through the electrolytic solution E, and the surface of the metallic film 18 is polished with a hard pad 14.
摘要:
An etching solution includes an anticorrosive for copper or a benzotriazole based anticorrosive in a hydrofluoric acid aqueous solution. An etching method makes use of the etching solution set out above. Moreover, a method for manufacturing a semiconductor device which should include the step of removing copper by the etching method. The method includes the steps of forming copper through a barrier layer made of a metal or metal compound, which is greater in ionization tendency than copper, so as to bury a wiring groove formed in an insulating film with the copper, followed by polishing additional copper and barrier layer formed on the insulating film, and etching a surface layer of the insulating film by use of the etching solution to remove an insulating defective layer made mainly of the barrier layer on the insulating film along with the surface layer of the insulating film.
摘要:
A photoelectric transducer has an optical waveguide and a photoelectric transducer element array of photoelectric transducer elements optically coupled to the optical waveguide. The photoelectric transducer element array has a common conductive layer, and the photoelectric transducer elements are mounted on the common conductive layer in alignment with entrance or exit ends of the optical waveguide. The photoelectric transducer elements having respective first poles, and the photoelectric transducer element array has a second pole disposed in opposite relation to the first poles and connected as a reference potential setting electrode through the common conductive layer to at least two of the photoelectric transducer elements.
摘要:
Electric conductivity is enhanced without causing coagulation or precipitation of polishing abrasive grains. In addition, good planarization is realized without inducing defects in a metallic film or a wiring which are to be polished. In an electropolishing method for planarizing the surface of a metallic film to be polished by moving a polishing pad (15) in sliding contact with the metallic film surface while oxidizing the metallic film surface through an electrolytic action in an electropolishing liquid E, the electropolishing liquid E contains at least polishing abrasive grains and an electrolyte for maintaining an electrostatically charged state of the polishing abrasive grains. Since the electropolishing liquid having a high electric conductivity is used, it is possible to obtain a high electrolyzing current and to enlarge the distance between electrodes. Besides, in the electropolishing method, the electropolishing liquid with a good dispersion state of the polishing abrasive grains is used, so that remaining of the abrasive grains and defects such as scratches are prevented from being generated upon polishing.
摘要:
An etching solution includes an anticorrosive for copper or a benzotriazole based anticorrosive in a hydrofluoric acid aqueous solution. An etching method makes use of the etching solution set out above. Moreover, a method for manufacturing a semiconductor device which should include the step of removing copper by the etching method. The method includes the steps of forming copper through a barrier layer made of a metal or metal compound, which is greater in ionization tendency than copper, so as to bury a wiring groove formed in an insulating film with the copper, followed by polishing additional copper and barrier layer formed on the insulating film, and etching a surface layer of the insulating film by use of the etching solution to remove an insulating defective layer made mainly of the barrier layer on the insulating film along with the surface layer of the insulating film.