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公开(公告)号:US20240076586A1
公开(公告)日:2024-03-07
申请号:US18459859
申请日:2023-09-01
Applicant: Hangzhou Joinleader New Materials Co., Ltd.
Inventor: Cheng FU , Shengyu GE , Huijun GUO , Liang ZHAO
CPC classification number: C11D7/5009 , C11D7/24 , C11D7/263 , C11D7/34 , C11D7/5027 , C11D11/0029 , C11D11/0035
Abstract: The present disclosure provides a formula of a remover reagent for a cured silicone sealant and a method using the same. The remover reagent is prepared from an acid catalyst and a solvent each having a high boiling point and a high flash point. The acid catalyst is benzenesulfonic acid or alkylbenzenesulfonic acid. The solvent is mineral oil and/or silicone oil. The cured silicone sealant is first soaked with the remover reagent for 30 to 120 min, and then baked at a high temperature of 80 to 120° C. for 10 min or above into debris or powder, whereby the cured silicone sealant with a thickness of 10 mm or above can be removed. Moreover, the remover reagent has the advantages of readily available raw materials, high safety, environmentally friendliness, convenient preparation and good sealant removal effect, and thus, has good application prospects.
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公开(公告)号:US11905490B2
公开(公告)日:2024-02-20
申请号:US17275629
申请日:2019-09-19
Applicant: Kanto Kagaku Kabushiki Kaisha
Inventor: Areji Takanaka
CPC classification number: C11D11/0047 , C11D1/16 , C11D7/08 , C11D7/261 , C11D7/266 , C11D7/267 , C11D7/3209 , C11D7/50 , H01L21/02068
Abstract: An object of the present invention is to provide a cleaning liquid that effectively removes in a short time organic residues and abrasive grains derived from a slurry in a semiconductor substrate in which a Co contact plug and/or Co wiring are present.
The present invention relates to a cleaning liquid composition for cleaning a substrate having a Co contact plug and/or Co wiring, which contains one or more reducing agents and water. Furthermore, the present invention relates to a cleaning liquid composition for cleaning a substrate having Co and not having Cu, which contains one or more reducing agents and water and has a pH of 3 or more and less than 12.-
公开(公告)号:US20240050792A1
公开(公告)日:2024-02-15
申请号:US18383173
申请日:2023-10-24
Applicant: DAIKIN INDUSTRIES, LTD.
Inventor: Kazuhiro TAKAHASHI
IPC: A62D1/00 , B01D3/14 , B01D3/36 , C07C17/383 , C08J9/12 , C08J9/14 , C09K3/14 , C09K3/30 , C09K5/04 , C11D7/50 , H01B3/56
CPC classification number: A62D1/0057 , B01D3/143 , B01D3/36 , C07C17/383 , C08J9/127 , C08J9/146 , C09K3/1472 , C09K3/30 , C09K5/045 , C11D7/5018 , C11D7/5036 , H01B3/56 , C08J2203/142 , C08J2203/182 , C09K2205/122 , C09K2205/22 , C09K2205/32
Abstract: The present disclosure provides a novel azeotropic or azeotrope-like composition comprising hydrogen fluoride and 1,1,2-trifluoroethane (HFC-143), 1-chloro-2, 2-difluoroethane (HCFC-142), or 1,2-dichloro-1-fluoroethane (HCFC-141); and a separation method using the composition.
An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HFC-143. An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HCFC-142. An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HCFC-141. A separation method of a composition comprising hydrogen fluoride and at least one member selected from the group consisting of HFC-143, HCFC-142, and HCFC-141.-
公开(公告)号:US11872603B2
公开(公告)日:2024-01-16
申请号:US16304836
申请日:2017-05-24
Applicant: BROOKS AUTOMATION (GERMANY) GMBH
Inventor: Lutz Rebstock , Matthias Fryda , Thorsten Matthée
CPC classification number: B08B3/08 , C02F1/4618 , C11D7/10 , C11D7/50 , C11D11/0035 , H01L21/67389 , C02F2001/46195 , C02F2201/46115
Abstract: The invention relates to a method for cleaning a synthetic surface, in particular to remove metal dirt and/or particles therefrom, said method being characterized by the following steps: a) the synthetic surface is rinsed with deionized water; b) the synthetic surface is rinsed with electrolyzed water; and c) the synthetic surface is rinsed with deionized water.
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公开(公告)号:US20240010952A1
公开(公告)日:2024-01-11
申请号:US18139380
申请日:2023-04-26
Applicant: Fujifilm Electronic Materials U.S.A., Inc.
Inventor: Jieying Jiao , Thomas Dory
CPC classification number: C11D3/34 , C11D7/5004 , C11D11/007 , C11D11/0047 , C11D3/30
Abstract: This disclosure relates to compositions for cleaning post etching residues on a semiconductor substrate, as well as related cleaning methods.
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公开(公告)号:US20230416582A1
公开(公告)日:2023-12-28
申请号:US18456665
申请日:2023-08-28
Applicant: Mexichem Amanco Holding S.A. de C.V.
Inventor: Robert Low
CPC classification number: C09K5/045 , C08J9/149 , C09K3/30 , C11D7/5018 , F03C99/00 , B01D11/0288 , B01D11/0492 , C08J9/146 , G06Q30/018 , Y10T29/49716 , C08J2203/14 , C08J2203/142 , C08J2203/16 , C08J2203/162 , C08J2203/202 , C09K2205/12 , C09K2205/126 , C09K2205/22 , Y02A40/963 , C08J2325/06 , C08J2363/00 , C08J2375/04 , C09K2205/122
Abstract: A heat transfer composition includes:
(i) trans-1,3,3,3-tetrafluoropropene (R-1234ze(E));
(ii) a second component selected from difluoromethane (R-32), propene (R-1270), propane (R290) and mixtures thereof;
(iii) a third component selected from pentafluoroethane (R-125), 1,1,1,2-tetraflueroethane (R-34a), and mixtures thereof; and optionally
(iv) a fourth component selected from fluoroethane (R-161), 1,1-difluoroethane (R-152a) and mixtures thereof.-
公开(公告)号:US20230348823A1
公开(公告)日:2023-11-02
申请号:US18186612
申请日:2023-03-20
Applicant: THREEBOND CO., LTD.
Inventor: Shogo HASHIMOTO , Manabu KIRINO
CPC classification number: C11D7/5018 , C11D7/30 , C11D11/0035 , C11D17/0043
Abstract: A cleaning composition has reduced erodibility to members having plastic base materials, suitable dryability, and nonflammability. The cleaning composition contains components (A) and (B) below in a mass ratio between component (A) and component (B) of 85 : 15 to 55 : 45, and being hydrocarbon-based solvent-free: (A): cis-1-chloro-3,3,3-trifluoropropene; and (B): a fluorine-based solvent having a boiling point of 65° C. to 80° C. and a specific gravity of 1.55 to 1.65, excluding component (A).
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公开(公告)号:US20230348822A1
公开(公告)日:2023-11-02
申请号:US17926499
申请日:2021-05-20
Applicant: Politecnico di Milano
Inventor: Andrea MELE , Monica FERRO , Greta COLOMBO DUGONI
CPC classification number: C11D7/5013 , C11D7/245 , C11D7/3254 , C11D11/0023 , C02F5/12
Abstract: Use as a decalcifying and descaling remover of a composition comprising:
a) a first solvent selected from:
a1) a eutectic solvent consisting of a hydrogen bond acceptor and of a hydrogen bond donor,
a2) an ionic liquid or
a3) a mixture of said eutectic solvent and said ionic liquid;
optionally associated with a second solvent b) selected from at least a lower alcohol, water or mixtures thereof, wherein
in the first eutectic solvent a1) the hydrogen bond acceptor and the hydrogen bond donor are halogen-free.-
公开(公告)号:US20230340381A1
公开(公告)日:2023-10-26
申请号:US18338811
申请日:2023-06-21
Applicant: Saban Ventures Pty Limited
Inventor: Gavin Spargo , Ingeborg Kristina Palmer , Stefan Gebhardt , Brian Hingley
IPC: B08B9/032 , A61B1/12 , C11D7/26 , C11D7/20 , C11D7/50 , C11D11/00 , B08B3/08 , C11D17/00 , C11D7/12 , B08B9/023
CPC classification number: C11D17/003 , A61B1/125 , B08B3/08 , B08B9/023 , B08B9/0326 , C11D7/12 , C11D7/20 , C11D7/265 , C11D7/5022 , C11D11/0023 , B08B2209/032
Abstract: A method of cleaning a contaminated surface, such as cleaning the elongate interior lumen of an endoscope contaminated with flesh, bone, blood, mucous, faeces or biofilm, said method comprising the steps of: providing a suspension of solid particles in a liquid to said contaminated surface, and flowing said suspension along said surface thereby to remove contaminant from the surface. The suspension is preferably a paste, where the solid material may be e.g. crystals of a salt, silicon oxide or organic material. The paste preferably has a solid fraction between 5 and 55%. A rheology modifier may be present.
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公开(公告)号:US20230313081A1
公开(公告)日:2023-10-05
申请号:US15839204
申请日:2017-12-12
Applicant: Mainstream Engineering Corporation
Inventor: Ted J. Amunden
CPC classification number: C11D7/5018 , C11D7/30 , C11D7/5022
Abstract: An aerosolized HVAC/R system solvent for decontaminating HVAC/R components and line sets The solvent contains 25-90 wt % propellant, and 10-75 wt % solvent mixture which is about 60-95 wt % trans-1,2,dichloroethylene, about 5-20 wt % n-propanol, and an inerting constituent providing a weight percent ratio of the inerting constituent to n-propanol of less than 1.5. The solvent is packaged in a container that is connected to the HVAC/R components or line sets to be decontaminated for supplying the solvent mixture under pressure to the HVAC/R components or line sets.
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