Abstract:
A method of analyzing a patterned feature formed on a semiconductor layer is disclosed. The patterned feature is scanned to generate an amplitude modulated waveform signal of the line width. This waveform signal is processed for calculating the scale and shape of the patterned feature based on the profile of the amplitude modulated waveform signal. The calculated scale and shape of the patterned feature are compared to a template of a normal patterned feature having the desired shape and scale. The template is derived from scanning a normal patterned feature on a known sample.
Abstract:
A system capable of detecting the presence and location of foreign matter on a sample includes a beam light applying system for projecting a beam of light onto a sample surface, an optical microscope for receiving light reflected from the sample surface in response to application of the beam light and for confirming the existence and location of foreign matter on the sample surface by observing scattering of the applied beam light by the foreign matter, and a polarizing element for polarizing light in such a manner that light scattered by a regular pattern on the sample is reduced by the polarization and light scattered by foreign matter on the sample is not reduced by the polarization. The system may be combined with a probe microscope for detecting a characteristic of the sample by monitoring an affect on a probe caused by the sample surface.
Abstract:
An ion implanter for sequentially processing single semiconductor wafers includes a scanning arm extending along a first axis. A wafer holder is mounted on a free end of the arm so as to be rotatable about a second axis centered on and perpendicular to the plane of the wafer. The wafer can be scanned through an ion beam by reciprocating the arm transversely of the first axis. A rotary motor is mounted in the scanning arm near the free end with its axis of rotation parallel to the first axis and perpendicular to the second axis. A right angle rotary drive connects the motor to the wafer holder. A hard stop is provided on the motor to prevent the wafer from being rotated by more than 360°. Connections to the wafer on the holder are provided by a flexible circuit coiled about the second axis. The scanning mechanism can itself be rotated about an axis parallel to the arm so as to tilt the scanning direction, the wafer holder is itself further rotatable about the arm axis relative to the scanning mechanism. This enables the wafer to be rotated to the horizontal when the mechanical scanning mechanism holds the arm with the wafer above the beam.
Abstract:
A method is provided for uniformly implanting a wafer with an ion beam. The wafer is generally of the type with a surface area in the form of a disk with a diameter and center. The ion beam is first formed as an elongated shape incident on the wafer, the shape having a length along a first axis smaller than the diameter, and a width shorter than the length along a second axis. Next, the wafer is translated at a variable translational velocity in a direction substantially parallel with the second axis. The wafer is also rotated substantially about the center at a rotational velocity. These movements are made such that the ion beam implants the wafer with substantially uniform dose across the surface area of the wafer. The wafer is preferably translated such that the ion beam implants the wafer from one side of the wafer, across the surface area of the wafer, and through another side of the wafer, in a selected velocity versus position profile. The wafer is also tilted while rotating such that the ion beam implants the surface area at a substantially constant angle relative to a crystal axis of the wafer. The wafer can also be translated in a direction substantially parallel to the ion beam such that the ion beam implants the surface area with a substantially constant spot size. The methods of the invention also include determining beam current density of the ion beam, and adjusting the variable translational velocity, and rotational velocity, as a function of the current density.
Abstract:
An inspection method using an electron beam. Emitted charged particles from an electron gun located inside a primary column are accelerated to form a primary beam. A cross section of the primary beam is shaped a desired shape by a primary optical system located inside the primary column. A trajectory of the primary beam is deflected using a primary deflector located inside the primary column. A sample is illuminated using the primary beam, the sample being on a stage to which a retarding voltage is applied. At least one of secondary electrons, reflected electrons or backwardly scattered electrons that are emerging from the sample on the stage are accelerated toward a second column to form a secondary beam. A trajectory of the secondary beam is deflected using a secondary deflector located inside the secondary column. The secondary beam is guided to a detector located inside the secondary column.
Abstract:
Methods and apparatus are provided for ion implantation of a workpiece. The apparatus includes an ion beam generator for generating an ion beam, a deflection device for deflecting the ion beam to produce a deflected ion beam, and a drive device for rotating the deflection device about an axis of rotation to thereby cause the deflected ion beam to rotate about the axis of rotation and to produce a rotating ion beam. The apparatus may include a controller for controlling the deflection and/or the rotation of the ion beam to produce a desired distribution of the ion beam over the surface of the workpiece. The apparatus may further include an angle compensation device for causing the rotating ion beam to have a substantially constant angle of incidence on the workpiece.
Abstract:
Information is collected from a region of interest using a scanning probe microscope having a tip by moving the tip along at least one predefined path extending from a center location to a peripheral location in the region of interest and collecting information using the tip at a plurality of sample points along the at least one predefined path. The predefined path may be based on a radial line defined between the center location and the peripheral location, and may follow a zig-zag, sinusoidal, constant-curve, rectangular trajectory generally tracking the radial line.
Abstract:
A probe scanning device has a first tubular member extending in a z direction. A second tubular member has a rear end portion extending into the first tubular member to define a space between an inner peripheral surface portion of the first tubular member and an outer peripheral surface portion of the second tubular member. A probe tip is mounted on a front end portion of the second tubular member. A viscous material is disposed in the space between the first tubular member and the second tubular member. A moving mechanism reciprocally moves the first tubular member in an xy direction, and a voice coil motor drives the second tubular member towards the first tubular member in the z direction. A drive mechanism has a coarse adjustment mode for coarsely moving the probe tip toward a surface of a sample and a measurement mode for fine movement of the probe tip in the z direction to maintain a given relationship between relative positions of the probe tip and the sample surface after coarse movement. A connecting mechanism selectively integrally connects the first tubular member and the second tubular member to one another.
Abstract:
Methods and apparatus are provided for adjusting the profile of a scanned ion beam. The spatial distribution of the unscanned ion beam is measured. The ion beam is scanned at an initial scan speed, and the beam profile of the scanned ion beam is measured. If the measured beam profile is not within specification, a scan speed correction that produces a desired profile correction is determined using a calculation which is based on the spatial distribution of the unscanned ion beam. The scan speed correction may be determined by convolving a candidate scan speed correction with the spatial distribution of the unscanned ion beam to produce a result and determining if the result is sufficiently close to the desired profile correction. A multi-dimensional search algorithm may be used to select the candidate scan speed correction. The ion beam is scanned at a corrected scan speed, which is based on the initial scan speed and the scan speed correction, to produce corrected beam profile.
Abstract:
The present invention develops a new type of SPM, a scanning tunneling charge transfer microscope (STCTM). The STCTM is capable of first, detecting the transfer of an ultrasmall amount of charge (single electrons) or current (attoampere) into or out from a surface with atomic resolution and second, simultaneously measuring the electronic response of that surface to the transferred charge. This dual capability can be achieved by appropriately combining the virtues of the STM and a modified EFM. The STM provides the atomic resolution for the charge transfer, while the modified EFM provides the sub-electronic charge sensitivity for the current and charge detection. The STCTM, with sensitivity many orders of magnitude better than with SPM technology currently available, can be used to characterize the properties of molecules, ultrathin oxides, insulator surfaces, and clusters on insulators with atomic resolution.