Abstract:
An image processing method includes: generating a stochastic screening dither matrix (S101); performing a centered positive-negative conversion operation on the stochastic screening dither matrix (S102); generating a screen dot dither contrast matrix for each color surface according to the stochastic screening dither matrix after being subjected to the positive-negative conversion operation and a stochastic screening dither threshold set for each color surface of an image; performing a logical “and” operation between each data item in a one-bit amplitude modulation screen dot matrix of each color surface of the image and a data item at a corresponding position in the screen dot dither contrast matrix of the color surface, and using a result as a processed value of a corresponding data item in the one-bit amplitude modulation screen dot matrix of the color surface. An apparatus corresponding to the image processing method is also provided. According to the above-described image processing method and apparatus, the problem in the prior art of an excess of pure-color pixels existing in an original one-bit dot matrix can be resolved.
Abstract:
A semiconductor is formed on an ETSOI layer, the thin Si layer of an ETSOI substrate, with enhanced channel stress. Embodiments include semiconductor devices having dual stress liners on the back surface of the ETSOI layer. An embodiment includes forming an ETSOI substrate comprising an extra thin layer of Si on a backside substrate with an insulating layer, e.g., a BOX, there between, forming a semiconductor device on the Si surface, removing the backside substrate, as by CMP and the insulting layer, as by wet etching, and forming a stress liner on the backside of the remaining Si layer opposite the semiconductor device. The use of stress liners on the backside of the ETSOI layer enhances channel stress without modifying ETSOI semiconductor process flow.
Abstract:
A hardware status detecting circuit for detecting a hardware status of a target apparatus includes a plurality of hardware status detectors operating in response to the hardware status of the target apparatus, and a signal processing unit coupled to the hardware status detectors for generating a hardware status detecting signal having information of operational statuses of the hardware status detectors embedded therein.
Abstract:
The present invention relates to a method for producing halftone dots in the field of image hard copying, more particularly to a method for frequency-modulation screening using error diffusion based on dual-feedback. In the known frequency-modulation and amplitude-modulation screening technology, it is hard to output a halftone image with high quality using an output equipment with a low resolution (600 dpi) and the satisfactory effect of representing the gradations of the original image in detail and holding the smoothness of the original image can not be achieved. By using the dual-feedback technology based on a basic algorithm of the error distribution, the method in the present invention realizes the organic combination of the conventional frequency-modulation and amplitude-modulation screens and achieves the effect of mixed screening. The method in the present invention can effectively solve the problem of losing gradations of dots in an output equipment with low resolution and can reduce the moire caused by the random distribution characteristic so as to output halftone images with high quality and full gradations.
Abstract:
An apparatus includes a case and a bezel. The case includes a wall. A wall flange is located on the wall. A plurality of pairs of cutouts is defined in an edge of the wall flange, and an extending tab is located between each pair of cutouts. A plurality of locking members is located on the bezel, the locking members engaged in the receiving openings.
Abstract:
A method of fabricating a semiconductor device with back side conductive plugs is provided here. The method begins by forming a gate structure overlying a semiconductor-on-insulator (SOI) substrate. The SOI substrate has a support layer, an insulating layer overlying the support layer, an active semiconductor region overlying the insulating layer, and an isolation region outboard of the active semiconductor region. A first section of the gate structure is formed overlying the isolation region and a second section of the gate structure is formed overlying the active semiconductor region. The method continues by forming source/drain regions in the active semiconductor region, and thereafter removing the support layer from the SOI substrate. Next, the method forms conductive plugs for the gate structure and the source/drain regions, where each of the conductive plugs passes through the insulating layer.
Abstract:
A method includes forming a silicon germanium layer, forming a layer comprising carbon and silicon on a top surface of the silicon germanium layer, forming a metal layer above the layer comprising carbon and silicon, and performing a thermal treatment to convert at least the layer comprising carbon and silicon to form a metal silicide layer.
Abstract:
An LED lamp includes an envelope, two covers, a mounting board and a plurality of LEDs. The covers engages with opposite ends of the envelope. Each of the covers has an electrically conductive part. The mounting board is received in the envelope. Two ends of the mounting board electrically connect with the electrically conductive parts of the two covers, respectively. The LEDs are disposed on the mounting board and received in the envelope.
Abstract:
A metal oxide semiconductor transistor device having a reduced gate height is provided. One embodiment of the device includes a substrate having a layer of semiconductor material, a gate structure overlying the layer of semiconductor material, and source/drain recesses formed in the semiconductor material adjacent to the gate structure, such that remaining semiconductor material is located below the source/drain recesses. The device also includes shallow source/drain implant regions formed in the remaining semiconductor material, and epitaxially grown, in situ doped, semiconductor material in the source/drain recesses.
Abstract:
Described are techniques for storing data. A plurality of data portions and a corresponding token for each of the data portions are received. Each of said plurality of data portions is to be stored by one of a plurality of processes and each token has a corresponding token value. Each of the data portions is stored at a storage location on a device allocated for use by one of said plurality of processes. An entry is written in a log file in accordance with said storing of the data portion. The log file is a private log file of one of the plurality processes. An access structure used to access stored data portions is updated. The access structure is indexed by token values of the stored data portions. The updating of the access structure is performed in accordance with log entries from private log files of the plurality of processes.