公开(公告)号：US09910018B2

公开(公告)日：2018-03-06

申请号：US15177977

申请日：2016-06-09

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston

IPC: H01L29/84 ,  H01L21/30 ,  G01N29/24 ,  B81C1/00 ,  B06B1/02 ,  A61B8/00 ,  B81B7/00

CPC classification number: G01N29/2406 ,  A61B8/4483 ,  B06B1/0292 ,  B81B7/007 ,  B81B2201/0271 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/0792 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/146 ,  H01L2924/1461

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US09910017B2

公开(公告)日：2018-03-06

申请号：US15177899

申请日：2016-06-09

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston

IPC: H01L21/00 ,  H01L21/30 ,  G01N29/24 ,  B81C1/00 ,  B06B1/02 ,  A61B8/00 ,  B81B7/00

CPC classification number: G01N29/2406 ,  A61B8/4483 ,  B06B1/0292 ,  B81B7/007 ,  B81B2201/0271 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/0792 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/146 ,  H01L2924/1461

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US20180028159A1

公开(公告)日：2018-02-01

申请号：US15223550

申请日：2016-07-29

Applicant: Butterfly Network, Inc.

Inventor： Matthew R. Hageman ,  Christopher Thomas McNulty

IPC: A61B8/00 ,  H04R23/00 ,  A61N7/02

CPC classification number: A61B8/546 ,  A61B8/4227 ,  A61B8/4236 ,  A61B8/4483 ,  A61N7/02 ,  H04R23/00 ,  H04R2217/03

Abstract: A heat sink device has a non-planar mounting surface and an ultrasonic transducer substrate attached to the non-planar mounting surface. The non-planar mounting surface of the heat sink device is configured to diffuse acoustic waves that are incident thereupon.

公开(公告)号：US20180003678A1

公开(公告)日：2018-01-04

申请号：US15689863

申请日：2017-08-29

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston

IPC: G01N29/24 ,  B81C1/00 ,  A61B8/00 ,  B06B1/02 ,  B81B7/00

CPC classification number: G01N29/2406 ,  A61B8/4483 ,  B06B1/0292 ,  B81B7/007 ,  B81B2201/0271 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/0792 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/146 ,  H01L2924/1461

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US20170264307A1

公开(公告)日：2017-09-14

申请号：US15605469

申请日：2017-05-25

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston

IPC: H03M1/00 ,  H03M1/12 ,  H03M1/46 ,  A61B8/00

CPC classification number: H03M1/002 ,  A61B8/4483 ,  A61B8/4494 ,  A61B8/54 ,  H03M1/125 ,  H03M1/462

Abstract: An ultrasound device including an asynchronous successive approximation analog-to-digital converter and method are provided. The device includes at least one ultrasonic transducer, a plurality of asynchronous successive-approximation-register (SAR) analog-to-digital converters (ADC) coupled to the at least one ultrasonic transducer, at least one asynchronous SAR in the plurality having a sample and hold stage, a digital-to-analog converter (DAC), a comparator, and control circuitry, wherein a DAC update event following at least one bit conversion is synchronized to a corresponding DAC update event of at least one other ADC in the plurality of ADCs.

公开(公告)号：US20170228862A1

公开(公告)日：2017-08-10

申请号：US15581429

申请日：2017-04-28

Applicant: Butterfly Network, Inc.

Inventor： Noah Zachary Rothberg

IPC: G06T7/00 ,  G06T7/60 ,  G01S15/89 ,  G06T19/00 ,  A61B8/00 ,  A61B8/08 ,  G06T7/40 ,  G06T7/90

CPC classification number: G06T7/0012 ,  A61B8/4411 ,  A61B8/4427 ,  A61B8/4455 ,  A61B8/4477 ,  A61B8/4494 ,  A61B8/483 ,  G01S15/899 ,  G06T7/40 ,  G06T7/60 ,  G06T7/90 ,  G06T19/006 ,  G06T2207/10136 ,  G06T2207/30008 ,  G06T2207/30101 ,  G06T2219/016 ,  H04N5/30

Abstract: A portable electronic device (e.g., smart phone or tablet computer) is provided for generating and displaying images (e.g., 2-dimensional or 3-dimensional images) of an imaging target such as a human body. The portable electronic device may include imaging elements configured to receive radiation signals transmitted through and/or reflected by the imaging target, an imaging interface, and one or more processors. The portable electronic device may display what appears to be a window into the imaging target (e.g., a human body), and/or an exploded view (e.g., 3-dimensional, upwardly projected image) of the target. The generated image may be a real-time continuous image of the internal features of the target (e.g., a human body) that is updated to track movements of the target (e.g., breathing patterns) and the relative position of the portable electronic device as the portable electronic device moves relative to a surface of the target.

公开(公告)号：US20170225196A1

公开(公告)日：2017-08-10

申请号：US15581511

申请日：2017-04-28

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B06B1/02 ,  G10K9/12 ,  B81B7/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: B06B1/02 ,  B06B1/0292 ,  B81B3/0021 ,  B81B7/0077 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/015 ,  B81C1/00158 ,  B81C2201/013 ,  B81C2203/0118 ,  B81C2203/0735 ,  B81C2203/0771 ,  G10K9/12 ,  G10K11/18

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

公开(公告)号：US20170163225A1

公开(公告)日：2017-06-08

申请号：US14957395

申请日：2015-12-02

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Keith G. Fife ,  Nevada J. Sanchez ,  Andrew J. Casper ,  Tyler S. Ralston

IPC: H03F3/16 ,  A61B8/00 ,  A61B5/00

CPC classification number: H03F3/16 ,  A61B5/6801 ,  A61B8/4444 ,  A61B8/5207 ,  G01S7/52025 ,  H03F1/086 ,  H03F3/45183 ,  H03F2200/408 ,  H03F2200/555 ,  H03F2203/45471 ,  H03F2203/45504 ,  H03F2203/45631 ,  H03F2203/45634 ,  H03F2203/45646 ,  H03F2203/45648 ,  H03F2203/45674 ,  H03F2203/45686 ,  H03F2203/45692 ,  H03F2203/45726

Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.

公开(公告)号：US20170157646A1

公开(公告)日：2017-06-08

申请号：US14957098

申请日：2015-12-02

Applicant: Butterfly Network, Inc.

Inventor： Susan A. Alie ,  Jaime Scott Zahorian ,  Kailiang Chen

IPC: B06B1/02

CPC classification number: B06B1/02 ,  B06B1/0292

Abstract: Electrical biasing of ultrasonic transducers of an ultrasound device is described. The ultrasonic transducers may be capacitive micromachined ultrasonic transducers (CMUTs). The ultrasonic transducers may be grouped together, with the different groups receiving different bias voltages. The bias voltages for the various groups of ultrasonic transducers may be selected to account for differences between the groups.

公开(公告)号：US09667889B2

公开(公告)日：2017-05-30

申请号：US13856252

申请日：2013-04-03

Applicant: Butterfly Network, Inc.

Inventor： Noah Zachary Rothberg

IPC: H04N5/30 ,  A61B8/00 ,  A61B8/08 ,  G01S15/89

CPC classification number: G06T7/0012 ,  A61B8/4411 ,  A61B8/4427 ,  A61B8/4455 ,  A61B8/4477 ,  A61B8/4494 ,  A61B8/483 ,  G01S15/899 ,  G06T7/40 ,  G06T7/60 ,  G06T7/90 ,  G06T19/006 ,  G06T2207/10136 ,  G06T2207/30008 ,  G06T2207/30101 ,  G06T2219/016 ,  H04N5/30

Abstract: A portable electronic device (e.g., smart phone or tablet computer) is provided for generating and displaying images (e.g., 2-dimensional or 3-dimensional images) of an imaging target such as a human body. The portable electronic device may include imaging elements configured to receive radiation signals transmitted through and/or reflected by the imaging target, an imaging interface, and one or more processors. The portable electronic device may display what appears to be a window into the imaging target (e.g., a human body), and/or an exploded view (e.g., 3-dimensional, upwardly projected image) of the target. The generated image may be a real-time continuous image of the internal features of the target (e.g., a human body) that is updated to track movements of the target (e.g., breathing patterns) and the relative position of the portable electronic device as the portable electronic device moves relative to a surface of the target.