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公开(公告)号：US10444432B2
公开(公告)日：2019-10-15
申请号：US15799740
申请日：2017-10-31
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Daniel Lee Revier
IPC: G02B6/122 , H01P3/10 , H01L23/31 , H01L23/495 , H01L23/00 , H01L21/56 , G02B6/12 , H01P1/20 , H01P3/16 , H01P3/123
Abstract: An encapsulated package is provided that includes a pair integrated circuit (IC) die. A radio frequency (RF) circuit on one of the IC die is operable to transmit an RF signal having a selected frequency. An RF circuit on the other IC die is operable to receive the RF signal Encapsulation material encapsulates the IC die. A photonic waveguide couples between the RF transmitter and RF receiver to form galvanic path isolation between the two IC die. The photonic waveguide is formed by a photonic structure within the encapsulation material.
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公开(公告)号：US20190204505A1
公开(公告)日：2019-07-04
申请号：US15859494
申请日：2017-12-30
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Daniel Lee Revier
CPC classification number: G02B6/12004 , G02B6/138 , G02B2006/12147 , H01L31/02005 , H01L31/0203 , H01L31/12 , H01P3/16 , H05K1/024
Abstract: A microelectronic device includes a photonic die having a die input/output (I/O) port. The microelectronic device includes a photonic connection between the first photonic I/O port and the second photonic I/O port. The photonic connection has a dielectric signal pathway for a photonic signal from the first photonic I/O port to the second photonic I/O port. The second photonic I/O port may be a package photonic I/O port at an exterior of the microelectronic device, or may be another die photonic I/O port on another photonic die of the microelectronic device. The photonic connection is formed using at least one additive process, such as by selectively placing material for the photonic connection in a region for the photonic connection.
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213.发明申请公开(公告)号：US20190131682A1
公开(公告)日：2019-05-02
申请号：US15799740
申请日：2017-10-31
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Daniel Lee Revier
CPC classification number: G02B6/1225 , G02B6/10 , G02B6/12004 , G02B2006/12123 , H01L21/56 , H01L23/3121 , H01L23/49513 , H01L23/49537 , H01L23/49541 , H01L23/49548 , H01L23/49575 , H01L23/66 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48245 , H01L2224/48247 , H01L2224/4903 , H01L2224/73265 , H01L2924/00014 , H01P1/2005 , H01P3/10 , H01P3/123 , H01P3/16 , H01L2224/45099 , H01L2924/00
Abstract: An encapsulated package is provided that includes a pair integrated circuit (IC) die. A radio frequency (RF) circuit on one of the IC die is operable to transmit an RF signal having a selected frequency. An RF circuit on the other IC die is operable to receive the RF signal Encapsulation material encapsulates the IC die. A photonic waveguide couples between the RF transmitter and RF receiver to form galvanic path isolation between the two IC die. The photonic waveguide is formed by a photonic structure within the encapsulation material.
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214.发明申请公开(公告)号：US20190131196A1
公开(公告)日：2019-05-02
申请号：US15800042
申请日：2017-10-31
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Daniel Lee Revier
CPC classification number: G02B6/1225 , G02B2006/1213 , H01L23/28 , H01P1/2005 , H01P3/16 , H01P5/087 , H01P11/006 , H01Q1/2283
Abstract: An encapsulated integrated circuit package is provided that includes an integrated circuit (IC) die. A radio frequency (RF) circuit on the IC die is operable to send and/or receive an RF signal having a selected frequency. Encapsulation material encapsulates the IC die. A photonic waveguide couples to the RF circuit and extends to an external surface of the encapsulated IC. The photonic waveguide may be formed by a photonic bandgap structure within the encapsulation material. A socket may be included with the encapsulated package that is coupled to an end of the photonic waveguide opposite the RF circuit.
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公开(公告)号：US10181521B2
公开(公告)日：2019-01-15
申请号：US15437818
申请日：2017-02-21
Applicant: Texas Instruments Incorporated
Inventor： Archana Venugopal , Benjamin Stassen Cook , Luigi Colombo , Robert Reid Doering
IPC: H01L29/16 , H01L29/66 , H01L29/778 , H01L23/66 , H01L49/02
Abstract: A microelectronic device includes an electrical conductor which includes a graphene heterolayer. The graphene heterolayer includes a plurality of alternating layers of graphene and barrier material. Each layer of the graphene has one to two atomic layers of graphene. Each layer of the barrier material has one to three layers of hexagonal boron nitride, cubic boron nitride, and/or aluminum nitride. The layers of graphene and the layers of barrier material may be continuous, or may be disposed in nanoparticles of a nanoparticle film.
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Patent Agency Ranking
公开(公告)号：US20190007486A1
公开(公告)日：2019-01-03
申请号：US15638146
申请日：2017-06-29
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Nathan Brooks , Swaminathan Sankaran , Bradley Allen Kramer , Mark W. Morgan , Baher Haroun
Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a tapered near field communication (NFC) field confiner located between the substrate and the port region on the housing configured to guide electromagnetic energy produced by the RF transmitter to the port region so that it can be emanated to a port region of an adjacent module.
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公开(公告)号：US20190007103A1
公开(公告)日：2019-01-03
申请号：US15638163
申请日：2017-06-29
Applicant: Texas Instruments Incorporated
Inventor： Nathan Brooks , Benjamin Stassen Cook , Swaminathan Sankaran , Bradley Allen Kramer , Mark W. Morgan , Baher S. Haroun
CPC classification number: H04B5/0062 , H01Q5/321 , H01Q5/40 , H04B5/0012 , H04B5/0037 , H04B5/02
Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module. An artificial magnetic conductor surface is positioned adjacent the backside of each NFC coupler to reflect back side electromagnetic energy with a phase shift of approximately zero degrees.
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公开(公告)号：US20190007101A1
公开(公告)日：2019-01-03
申请号：US15638212
申请日：2017-06-29
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Nathan Brooks , Swaminathan Sankaran , Bradley Allen Kramer , Mark W. Morgan , Baher Haroun
CPC classification number: H04B5/0031 , G06K7/10237 , H01Q1/3283 , H01Q1/38 , H04B5/0075 , H04W4/80
Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module. A reflective surface is positioned adjacent the backside of each NFC coupler to reflect back side electromagnetic towards the port region.
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公开(公告)号：US20190006338A1
公开(公告)日：2019-01-03
申请号：US16126577
申请日：2018-09-10
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Barry Jon Male , Benjamin Stassen Cook , Robert Alan Neidorff , Steve Kummerl
IPC: H01L25/16 , H04B10/80 , H01L31/103 , H01L23/31 , H01L23/49 , H01L23/495 , H01L23/00 , H01L33/62 , H01L33/00 , H01L31/167 , H01L31/11 , H01F38/14 , H01L31/101 , H01L31/0203 , H01L31/02 , H01L49/02
Abstract: In described examples, an integrated circuit includes a leadframe structure, which includes electrical conductors. A first coil structure is electrically connected to a first pair of the electrical conductors of the leadframe structure. The first coil structure is partially formed on a semiconductor die structure. A second coil structure is electrically connected to a second pair of the electrical conductors of the leadframe structure. The second coil structure is partially formed on the semiconductor die structure. A molded package structure encloses portions of the leadframe structure. The molded package structure exposes portions of the first and second pairs of the electrical conductors to allow external connection to the first and second coil structures. The molded package structure includes a cavity to magnetically couple portions of the first and second coil structures.
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公开(公告)号：US10170384B2
公开(公告)日：2019-01-01
申请号：US15620361
申请日：2017-06-12
Applicant: Texas Instruments Incorporated
Inventor： Daniel Lee Revier , Benjamin Stassen Cook
Abstract: Methods and apparatus providing a graded package for a semiconductor are disclosed. An example apparatus includes a die; and a graded package encapsulating the die, the graded package including a material that is spatially varied from a first location of the graded package to a second location of the graded package.
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