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公开(公告)号:US11776629B2
公开(公告)日:2023-10-03
申请号:US16995517
申请日:2020-08-17
Applicant: Micron Technology, Inc.
Inventor: Niccolo' Righetti , Kishore K. Muchherla , Jeffrey S. McNeil, Jr. , Akira Goda , Todd A. Marquart , Mark A. Helm , Gil Golov , Jeremy Binfet , Carmine Miccoli , Giuseppina Puzzilli
Abstract: A method includes during a first portion of a service life of a memory device, programming at least one memory cell of the memory device to a first threshold voltage corresponding to a desired data state. The method can include during a second portion of the service life of the memory device subsequent to the first portion of the service life of the memory device, programming at least one memory cell of the memory device to a second threshold voltage corresponding to the desired data state. The second threshold voltage can be different than the first threshold voltage.
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公开(公告)号:US11705205B2
公开(公告)日:2023-07-18
申请号:US17726059
申请日:2022-04-21
Applicant: Micron Technology, Inc.
Inventor: Akira Goda
CPC classification number: G11C16/14 , G11C16/0483 , G11C16/10 , H10B41/27 , H10B41/35
Abstract: Memory devices, memory cell strings and methods of operating memory devices are shown. Configurations described include directly coupling an elongated body region to a source line. Configurations and methods shown should provide a reliable bias to a body region for memory operations such as erasing.
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公开(公告)号:US20230214133A1
公开(公告)日:2023-07-06
申请号:US18090449
申请日:2022-12-28
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Kishore Kumar Muchherla , Akira Goda , Jeffrey S. McNeil , Niccolo' Righetti , Silvia Beltrami , Violante Moschiano , Ugo Russo
IPC: G06F3/06
CPC classification number: G06F3/0619 , G06F3/0679 , G06F3/0659
Abstract: A memory device comprises an array of memory cells organized into a plurality of wordlines, and a processing device to perform processing operations that receive a program command specifying a memory unit and data comprising first received data, where the plurality of wordlines includes one or more first active data wordlines and a group of consecutive retired wordlines. The processing operations also program the specified data to the memory unit by programming the first received data to the one or more first active data wordlines, identifying a first retired boundary wordline that is in the group of consecutive retired wordlines and is adjacent to one of the first active data wordlines, generating a first data pattern comprising a first plurality of threshold voltage levels, and programming the first data pattern to the first retired boundary wordline.
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公开(公告)号:US20230197163A1
公开(公告)日:2023-06-22
申请号:US18076488
申请日:2022-12-07
Applicant: Micron Technology, Inc.
Inventor: Jeffrey S. McNeil , Kishore Kumar Muchherla , Sead Zildzic , Akira Goda , Jonathan S. Parry , Violante Moschiano
CPC classification number: G11C16/102 , G11C16/08 , G11C16/28
Abstract: A system includes a memory device including a memory array and control logic, operatively coupled with the memory array, to perform operations including receiving a set of commands to concurrently program a set of cells of the memory array with dummy data, the set of cells corresponding to a group of retired wordlines of the plurality of wordlines, in response to receiving the set of commands, obtaining the dummy data, and concurrently programming the set of cells with the dummy data by causing a ganged programming pulse to be applied to the set of cells.
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公开(公告)号:US20230092320A1
公开(公告)日:2023-03-23
申请号:US18059165
申请日:2022-11-28
Applicant: Micron Technology, Inc.
Inventor: Akira Goda , Kunal R. Parekh , Aaron S. Yip
IPC: H01L23/00 , H01L25/18 , H01L27/11565 , H01L27/11573 , H01L27/11519 , H01L27/11556 , H01L27/11526 , H01L27/11582
Abstract: A microelectronic device comprises a first die and a second die attached to the first die. The first die comprises a memory array region comprising a stack structure comprising vertically alternating conductive structures and insulative structures, vertically extending strings of memory cells within the stack structure, and first bond pad structures vertically neighboring the vertically extending strings of memory cells. The second die comprises a control logic region comprising control logic devices configured to effectuate at least a portion of control operations for the vertically extending string of memory cells, second bond pad structures in electrical communication with the first bond pad structures, and signal routing structures located at an interface between the first die and the second die. Related microelectronic devices, electronic systems, and methods are also described.
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公开(公告)号:US20230060440A1
公开(公告)日:2023-03-02
申请号:US17877411
申请日:2022-07-29
Applicant: Micron Technology, Inc.
Inventor: Kishore Kumar Muchherla , Violante Moschiano , Akira Goda , Jeffrey S. McNeil , Eric N. Lee
IPC: G11C11/4096 , G11C11/408 , G11C11/406 , G11C11/4072
Abstract: Control logic in a memory device determines to initiate a string read operation on a first memory string of a plurality of memory strings in a block of a memory array of the memory device, the block comprising a plurality of wordlines, wherein each of the plurality of memory strings comprises a plurality of memory cells associated with the plurality of wordlines, and wherein the first memory string is designated as a sacrificial string. The control logic further causes a read voltage to be applied to each of the plurality of wordlines of the memory array concurrently and senses a level of current flowing through the first memory string designated as the sacrificial string while the read voltage is applied to each of the plurality of wordline. In addition, the control logic identifies, based on the level of current flowing through the first memory string designated as the sacrificial string, whether a threshold level of read disturb has occurred on the block.
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公开(公告)号:US20220336391A1
公开(公告)日:2022-10-20
申请号:US17854428
申请日:2022-06-30
Applicant: Micron Technology, Inc.
Inventor: Eric N. Lee , Akira Goda
IPC: H01L23/00 , H01L25/18 , H01L23/48 , H01L21/48 , H01L27/11519 , H01L27/11529 , H01L27/1157 , H01L27/11565 , H01L27/11573 , H01L27/11524
Abstract: An apparatus is provided, comprising a substrate with a frontside and a backside opposite the frontside; control circuitry disposed over the frontside of the substrate; a memory array disposed over and electrically coupled to the control circuitry; a through-silicon via (TSV) disposed under the memory array, the TSV extending through the substrate from the control circuitry to the backside of the substrate; and a bond pad disposed on the backside of the substrate and electrically coupled to the control circuitry via the TSV.
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公开(公告)号:US11410949B2
公开(公告)日:2022-08-09
申请号:US16940040
申请日:2020-07-27
Applicant: Micron Technology, Inc.
Inventor: Eric N. Lee , Akira Goda
IPC: H01L23/00 , H01L25/18 , H01L23/48 , H01L21/48 , H01L27/11519 , H01L27/11529 , H01L27/1157 , H01L27/11565 , H01L27/11573 , H01L27/11524
Abstract: An apparatus is provided, comprising a substrate with a frontside and a backside opposite the frontside; control circuitry disposed over the frontside of the substrate; a memory array disposed over and electrically coupled to the control circuitry; a through-silicon via (TSV) disposed under the memory array, the TSV extending through the substrate from the control circuitry to the backside of the substrate; and a bond pad disposed on the backside of the substrate and electrically coupled to the control circuitry via the TSV.
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公开(公告)号:US20220208261A1
公开(公告)日:2022-06-30
申请号:US17688983
申请日:2022-03-08
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Changhyun Lee , Akira Goda , William C. Filipiak
Abstract: One embodiment of a memory device includes an array of multiple-level memory cells and a controller. The controller is configured to program the multiple-level memory cells via a multiple-pass programming operation, the multiple-pass programming operation to program lower page data in a first pass and program higher page data in a second pass such that memory cells to be programmed to a higher level are programmed in parallel with memory cells to be programmed to a lower level.
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公开(公告)号:US20220189552A1
公开(公告)日:2022-06-16
申请号:US17561656
申请日:2021-12-23
Applicant: Micron Technology, Inc.
Inventor: Akira Goda , Shafqat Ahmed , Khaled Hasnat , Krishna K. Parat
IPC: G11C16/04 , H01L27/11519 , H01L27/11556 , H01L27/11565 , H01L27/11582 , G11C16/26 , G11C16/34 , G11C16/12 , G11C16/14 , G11C16/06
Abstract: Apparatus and methods are disclosed, such as an apparatus that includes a string of charge storage devices associated with a pillar (e.g., of semiconductor material), a source gate device, and a source select device coupled between the source gate device and the string. Additional apparatus and methods are described.
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