Abstract:
A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.
Abstract:
A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
Abstract:
A method and system for automating customer slamming and cramming complaints includes an automated reporting system having one or more receiving devices and a complaint module. Customers who want to report a slam or cram access the automated reporting system and report the complaint without having to speak with a customer service representative. The complaint module obtains the customer telephone number and retrieves customer account information using the customer telephone number. Using the customer account information, the complaint module extrapolates a type of complaint for the customer complaint and prompts the customer for information regarding the customer complaint and the type of the complaint. The customer provides customer responses to the prompts and the complaint module provides an indication to the customer regarding each customer response. Once the customer complaint has been resolved, the complaint module stores information regarding the slam or cram for reporting requirements and tracking purposes.
Abstract:
An osteoarthritis brace having relatively large semi-rigid cuffs for abutting the wearer's thigh and calf. In one embodiment, the semi-rigid cuffs are secured to rigid cuffs of the brace only on one side and in substantially a center of the rigid cuffs. The semi-rigid cuffs bear reaction forces created by a medial/lateral force applied to the wearer's knee by a hinge of the brace. The semi-rigid cuffs provide flesh containment, distribute loads over a large portion of the wearer's flesh, eliminate pinch points and provide enhanced fitting capabilities.
Abstract:
A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. The probe measurement system preferably includes a probe having a conductive path extending between the first and second surfaces of a membrane and a probe contact electrically connected to the conductive path.
Abstract:
This invention discloses a process for forming durable anti-stiction surfaces on micromachined structures while they are still in wafer form (i.e., before they are separated into discrete devices for assembly into packages). This process involves the vapor deposition of a material to create a low stiction surface. It also discloses chemicals which are effective in imparting an anti-stiction property to the chip. These include polyphenylsiloxanes, silanol terminated phenylsiloxanes and similar materials.
Abstract:
An apparatus has a leadframe based package base having a leadframe, and a lid coupled with the package base. The lid and package base form a chamber for at least partially containing a microphone. The lid is electrically coupled with a given portion of the leadframe in the package base.