摘要:
A PROCESS FOR METALLIZING HIGH PURITY CERAMIC PARTS AND/ OR BRAZING A HIGH PURITY CERAMIC PART TO A REFRACTORY METAL PART OR ANOTHER CERAMIC PART USING A TERNARY TITANIUM, VANADIUM, AND ZIRCONIUM ALLOY IS DESCRIBED. A PARTICULARLY EFFICACIOUS ALLOY COMPRISING 21-42% TITANIUM, 15-33% VANADIUM AND 36-54% ZIRCONIUM YIELDS HERMETIC SEALS WHEN PARTS ARE BONDED IN ACCORDANCE WITH THE PROCESS DESCRIBED HEREIN.
摘要:
A solder for contacting a semiconductor body with a contact piece, whereby silicon constitutes an alloying component of the semiconductor body. The solder composition is: Pdx ((MeIyMeII1 y)z Si1 z)1 x WITH 0.25 X 0.60 0.20 Y 0.90 0.05 Z 0.35 WHEREIN MeI is molybdenum or tungsten and MeII is iron, nickel, or cobalt.
摘要:
A method for joining refractory and reactive surfaces to themselves or to other surfaces by depositing a layer of a titanium-indium alloy between the joinable surface, and heating under vacuum to evaporate the indium to leave a layer of titanium joining the surfaces. Also, a method for joining the surfaces with the alloy by resistance bonding of said surfaces.