公开(公告)号：US12276831B2

公开(公告)日：2025-04-15

申请号：US18058967

申请日：2022-11-28

Applicant: GlobalFoundries U.S. Inc.

Inventor： Shesh Mani Pandey ,  Yusheng Bian ,  Ravi Prakash Srivastava

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/136

Abstract: Structures and methods implement an enlarged multilayer nitride waveguide. The structure may include an inter-level dielectric (ILD) layer over a substrate. A first enlarged multilayer nitride waveguide is positioned in the ILD layer in a region of the substrate. A second multilayer nitride waveguide may also be provided in the ILD layer. A lower cladding layer defines a lower surface of the nitride waveguide(s). The lower cladding layer has a lower refractive index than the nitride waveguide(s). Additional lower refractive index cladding layers can be provided on the upper surface and/or sidewalls of the nitride waveguide(s). The enlarged nitride waveguide may be implemented with other conventional silicon and nitride waveguides.

公开(公告)号：US20250102877A1

公开(公告)日：2025-03-27

申请号：US18372953

申请日：2023-09-26

Applicant: GlobalFoundries U.S. Inc. ,  Khalifa University of Science and Technology

Inventor： Michal Rakowski ,  Yusheng Bian ,  Roderick A. Augur ,  Ayat M. Taha ,  Marios Papadovasilakis ,  Yonas Hadush Gebregiorgis ,  Jaime Viegas

IPC: G02F1/21 ,  G02F1/01 ,  G02F1/225

Abstract: Structures for a power splitter that include a multimode interference coupler and methods of forming such structures. The structure comprises a multimode interference coupler including a grating having a plurality of grating lines, an input waveguide core, and an output waveguide core. The grating lines are disposed between the input waveguide core and the output waveguide core. The structure further comprises a resistive heating element adjacent to the grating lines.

公开(公告)号：US20240385373A1

公开(公告)日：2024-11-21

申请号：US18320967

申请日：2023-05-20

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian

IPC: G02B6/122 ,  G02B6/13

Abstract: A photonic integrated circuit (PIC) includes a waveguide in or over a semiconductor substrate. The waveguide has a terminal end. The PIC also includes an optical absorber having a curved shape adjacent to opposing sides and an endwall of the terminal end of the waveguide, i.e., it surrounds the terminal end of the waveguide. The optical absorber is multi-layered and includes a light absorbing layer. The light absorbing layer may include germanium or a vanadate. The optical absorber terminates or attenuates any stray optical signals from the waveguide while maintaining low back reflection.

公开(公告)号：US12147075B2

公开(公告)日：2024-11-19

申请号：US17741684

申请日：2022-05-11

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian ,  Rod Augur

IPC: G02B6/30 ,  G02B6/12 ,  G02B6/122 ,  G02B6/124 ,  G02B6/13 ,  G02B6/34 ,  G02B6/42

Abstract: Structures for an edge coupler and methods of fabricating such structures. The structure comprises a substrate and a back-end-of-line edge coupler including a waveguide core and a grating positioned in a vertical direction between the substrate and the waveguide core. The first waveguide core includes a first longitudinal axis, the grating includes a second longitudinal axis and a plurality of segments positioned with a spaced-apart arrangement along the second longitudinal axis, and the second longitudinal axis is aligned substantially parallel to the first longitudinal axis.

公开(公告)号：US20240377582A1

公开(公告)日：2024-11-14

申请号：US18196727

申请日：2023-05-12

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian ,  Takako Hirokawa

IPC: G02B6/122 ,  G02B6/13

Abstract: Structures including an edge coupler and methods of forming such structures. The structure comprises an edge coupler including a first portion and a second portion between the first portion and a semiconductor substrate, a first coupling-assistance feature adjacent to the first portion of the edge coupler, and a second coupling-assistance feature adjacent to the first portion of the edge coupler. The first portion of the edge coupler is positioned in a lateral direction between the first coupling-assistance feature and the second coupling-assistance feature.

公开(公告)号：US12135456B2

公开(公告)日：2024-11-05

申请号：US17850128

申请日：2022-06-27

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian ,  Koushik Ramachandran ,  Karen Nummy

IPC: G02B6/122 ,  G02B6/136 ,  G02B6/14 ,  G02B6/30 ,  G02B6/12

Abstract: Structures for a waveguide core and methods of fabricating such structures. The structure comprises a waveguide core including a section having a first trapezoidal portion and a second trapezoidal portion stacked with the first trapezoidal portion. The first trapezoidal portion has a first trapezoidal shape, and the second trapezoidal portion has a second trapezoidal shape different from the first trapezoidal shape.

公开(公告)号：US12135455B2

公开(公告)日：2024-11-05

申请号：US17723608

申请日：2022-04-19

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian ,  Kenneth J. Giewont

IPC: G02B6/122

Abstract: Disclosed is a photonic integrated circuit (PIC) structure including a first waveguide core with a first end portion, a second waveguide core with a second end portion overlaying and physically separated from the first end portion, and a coupler configured to facilitate low-loss optical signal transmission between the waveguide cores. The coupler can include at least one array of photonic material elements (e.g., photonic crystal elements or photonic metamaterial elements) embedded in cladding material between the end portions. Alternatively, the coupler can include at least one photonic material layer (e.g., a photonic crystal layer or a photonic metamaterial layer) between and physically separated from the end portions and an array of cladding material elements extending through the photonic material layer. Also disclosed is a PIC structure including an on-chip system (e.g., a photonic computing system) including a crossing array implemented using any of the above-described couplers.

公开(公告)号：US12130470B2

公开(公告)日：2024-10-29

申请号：US17452129

申请日：2021-10-25

Applicant: GlobalFoundries U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Thomas Houghton ,  Yusheng Bian

IPC: G02B6/30 ,  G02B6/12 ,  G02B6/42 ,  G02B6/43

CPC classification number: G02B6/12004 ,  G02B6/30 ,  G02B6/423 ,  G02B6/4249 ,  G02B6/43 ,  G02B2006/12061

Abstract: A photonic integrated circuit (PIC) die are provided. The PIC die includes a set of optical connect grooves including a first groove aligning a core of a first optical fiber positioned with a first optical component in a first layer at a first vertical depth in a plurality of layers of a body of the die, and a second groove aligning a core of a second optical fiber positioned therein with a second optical component in a second, different layer at a second different vertical depth in the plurality of layers. The grooves may also have end faces at different lateral depths from an edge of the body of the PIC die. Any number of the first and second grooves can be used to communicate an optical signal to any number of layers at different vertical and/or lateral depths within the body of the PIC die.

公开(公告)号：US12092868B2

公开(公告)日：2024-09-17

申请号：US17835513

申请日：2022-06-08

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/13

CPC classification number: G02B6/1228 ,  G02B6/13 ,  G02B2006/12061

Abstract: Structures including a waveguide core and methods of fabricating a structure including a waveguide core. The structure comprises a photonics chip including a first chip region, a first waveguide core in the first chip region, a second chip region, and a second waveguide core in the second chip region. The first chip region adjoins the second chip region along a boundary, the first waveguide core includes a first tapered section and the second waveguide core includes a second tapered section adjacent to the first tapered section. The first tapered section has a first longitudinal axis aligned substantially parallel to the boundary, and the second tapered section has a second longitudinal axis aligned substantially parallel to the boundary.

公开(公告)号：US20240231173A1

公开(公告)日：2024-07-11

申请号：US18094716

申请日：2023-01-09

Applicant: GlobalFoundries U.S. Inc.

Inventor： Vibhor Jain ,  Yusheng Bian ,  Shesh Mani Pandey ,  Abdelsalam Aboketaf ,  Ravi Prakash Srivastava

IPC: G02F1/21 ,  F25B21/04 ,  G02F1/225 ,  H10N10/17 ,  H10N10/851 ,  H10N10/852

CPC classification number: G02F1/212 ,  F25B21/04 ,  G02F1/2257 ,  H10N10/17 ,  H10N10/852 ,  H10N10/8556 ,  G02F2202/10 ,  G02F2203/50

Abstract: Structures including an optical phase shifter and methods of forming a structure including an optical phase shifter. The structure comprises an optical phase shifter including a waveguide core having a first branch and a second branch laterally spaced from the first branch. The structure further comprises a thermoelectric device including a first plurality of pillars and a second plurality of pillars that alternate with the first plurality of pillars in a series circuit. The first plurality of pillars and the second plurality of pillars disposed adjacent to the first branch of the waveguide core, the first plurality of pillars comprises an n-type semiconductor material, and the second plurality of pillars comprises a p-type semiconductor material.