ELECTRO-ABSORPTION MODULATORS WITH STACKED WAVEGUIDE TAPERS

    公开(公告)号:US20240085624A1

    公开(公告)日:2024-03-14

    申请号:US17944252

    申请日:2022-09-14

    CPC classification number: G02B6/1228 G02B6/13

    Abstract: Structures including an electro-absorption modulator and methods of forming such structures. The structure comprises a waveguide core including a first tapered section, a second tapered section, and a longitudinal axis. The first tapered section and the second tapered section are aligned along the longitudinal axis. The structure further comprises a first waveguide taper overlapping the first tapered section of the waveguide core, a second waveguide taper overlapping the second tapered section of the waveguide core, and a multiple-layer structure on the waveguide core between the first waveguide taper and the second waveguide taper.

    SCATTERING LIGHT-BASED MONITOR FOR PHOTONIC INTEGRATED CIRCUIT, MONITORING SYSTEM AND MONITORING METHOD

    公开(公告)号:US20240019651A1

    公开(公告)日:2024-01-18

    申请号:US17812023

    申请日:2022-07-12

    Abstract: Disclosed is a photonic integrated circuit (PIC) structure including a scattering light-based monitor with photodetectors (e.g., PIN and/or avalanche photodiodes) placed adjacent to one or both sides of an end portion (i.e., a coupler) of a waveguide core at an optical interface with another optical device. The photodetectors are placed in such a way as to enable sensing of scattering light emitted from the end portion as light signals are received (e.g., either from the optical device for propagation to the main body of the waveguide core or from the main body for transmission to the optical device). Also disclosed are a monitoring system and method including the PIC chip structure with the above-described scattering light-based monitor. The system and method assess the optical interface using electric signals generated by the photodetectors.

    Photonic devices integrated with reflectors

    公开(公告)号:US11852867B2

    公开(公告)日:2023-12-26

    申请号:US17454063

    申请日:2021-11-09

    CPC classification number: G02B6/1225 G02B2006/1213 G02B2006/12104

    Abstract: The present disclosure generally relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to semiconductor devices having a reflector and a photonic component and a method of forming the same. The present disclosure provides a semiconductor device having a substrate, a photonic component arranged above the substrate, a bottom reflector arranged above the substrate and positioned below the photonic component, in which the bottom reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component, and a top reflector arranged above the photonic component, in which the top reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component.

    PHOTONIC INTEGRATED CIRCUIT INCLUDING PASSIVE OPTICAL GUARD

    公开(公告)号:US20230408763A1

    公开(公告)日:2023-12-21

    申请号:US17807257

    申请日:2022-06-16

    CPC classification number: G02B6/122 G02B2006/12126 G02B6/13

    Abstract: The disclosure relates to a PIC structure including a photonic component on a semiconductor substrate. A passive optical guard is composed of a light absorbing material and is in proximity to the photonic component. The passive optical guard includes at least a portion in an active semiconductor layer of the semiconductor substrate and may be entirely below a first metal layer. The passive optical guard may include at least one of: a germanium body positioned at least partially in a silicon element in the active semiconductor layer, a silicon body having a high dopant concentration in the active semiconductor layer, and a polysilicon body having a high dopant concentration over the silicon body.

    Photonic integrated circuit structure with coupler for interlayer waveguide coupling

    公开(公告)号:US11841533B2

    公开(公告)日:2023-12-12

    申请号:US17709841

    申请日:2022-03-31

    Inventor: Yusheng Bian

    CPC classification number: G02B6/12016 G02B6/125 G02B2006/12147

    Abstract: Disclosed is a structure including a first waveguide core with a first end portion and a second waveguide core with a second end portion, which overlays and is physically separated from the first end portion. The structure includes a coupler configured for interlayer waveguide coupling. Specifically, the coupler includes an additional waveguide core stacked vertically between and physically separated from the first end portion and the second end portion. Optionally, the coupler includes multiple additional waveguide cores. The shapes of the various waveguide cores are configured in order to achieve mode matching so that optical signals pass between the first end portion of the first waveguide core and the second end portion of the second waveguide core through each additional waveguide core in sequence. Also disclosed is a structure including a crossing array implemented using couplers.

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