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公开(公告)号:US20240192442A1
公开(公告)日:2024-06-13
申请号:US18079523
申请日:2022-12-12
Applicant: GlobalFoundries U.S. Inc.
Inventor: Ravi Prakash Srivastava , Yusheng Bian , Shesh Mani Pandey , Vibhor Jain
CPC classification number: G02B6/1228 , G02B6/136
Abstract: Structures for an edge coupler and methods of forming a structure for an edge coupler. The structure comprises a substrate, a dielectric layer over the substrate, and a waveguide core over the substrate. The structure further comprises an airgap that extends at least partially through the dielectric layer and that surrounds a plurality of sides of a portion of the waveguide core.
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272.
公开(公告)号:US11994714B2
公开(公告)日:2024-05-28
申请号:US17490059
申请日:2021-09-30
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Brett T. Cucci , Yusheng Bian , Abdelsalam Aboketaf , Edward W. Kiewra
CPC classification number: G02B6/1228 , G02B6/1223 , G02B6/125 , G02B6/132 , G02B2006/12061 , G02B2006/12147 , G02B6/1225
Abstract: Disclosed are embodiments of a photonic integrated circuit (PIC) structure with a waveguide core having tapered sidewall liner(s) (e.g., symmetric tapered sidewall liners on opposing sides of a waveguide core, asymmetric tapered sidewall liners on opposing sides of a waveguide core, or a tapered sidewall liner on one side of a waveguide core). In some embodiments, the tapered sidewall liner(s) and waveguide core have different refractive indices. In an exemplary embodiment, the waveguide core is a first material (e.g., silicon) and the tapered sidewall liner(s) is/are a second material (e.g., silicon nitride) with a smaller refractive index than the first material. In another exemplary embodiment, the waveguide core is a first compound and the tapered sidewall liner(s) is/are a second compound with the same elements (e.g., silicon and nitrogen) as the first compound but with a smaller refractive index. Also disclosed are method embodiments for forming such a PIC structure.
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273.
公开(公告)号:US20240103221A1
公开(公告)日:2024-03-28
申请号:US17952969
申请日:2022-09-26
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian , Won Suk Lee
CPC classification number: G02B6/1228 , G02B6/13 , G02B2006/12061
Abstract: Structures for an optical coupler and methods of forming a structure for an optical coupler. The structure comprises a stacked waveguide core including a first waveguide core and a second waveguide core. The first waveguide core includes a first tapered section, and the second waveguide core includes a second tapered section positioned to overlap with the first tapered section. The structure further comprises a third waveguide core including a third tapered section positioned adjacent to the first tapered section of the first waveguide core and the second tapered section of the second waveguide core.
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公开(公告)号:US11934008B2
公开(公告)日:2024-03-19
申请号:US18083716
申请日:2022-12-19
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian , Roderick A. Augur , Kenneth J. Giewont , Karen Nummy
CPC classification number: G02B6/1228 , G02B6/0046 , G02B6/1225 , G02B6/14 , G02B2006/12035 , G02B2006/1215 , G02B2006/12152
Abstract: Structures for an edge coupler and methods of forming a structure for an edge coupler. The structure includes a waveguide core over a dielectric layer, and a back-end-of-line stack over the waveguide core and the dielectric layer. The back-end-of-line stack includes an interlayer dielectric layer, a side edge, a first feature, a second feature, and a third feature laterally arranged between the first feature and the second feature. The first feature, the second feature, and the third feature are positioned on the interlayer dielectric layer adjacent to the side edge, and the third feature has an overlapping relationship with a tapered section of the waveguide core.
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公开(公告)号:US20240085624A1
公开(公告)日:2024-03-14
申请号:US17944252
申请日:2022-09-14
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian , Steven M. Shank , Judson Holt , Michal Rakowski , Bartlomiej Jan Pawlak
CPC classification number: G02B6/1228 , G02B6/13
Abstract: Structures including an electro-absorption modulator and methods of forming such structures. The structure comprises a waveguide core including a first tapered section, a second tapered section, and a longitudinal axis. The first tapered section and the second tapered section are aligned along the longitudinal axis. The structure further comprises a first waveguide taper overlapping the first tapered section of the waveguide core, a second waveguide taper overlapping the second tapered section of the waveguide core, and a multiple-layer structure on the waveguide core between the first waveguide taper and the second waveguide taper.
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276.
公开(公告)号:US20240019651A1
公开(公告)日:2024-01-18
申请号:US17812023
申请日:2022-07-12
Applicant: GlobalFoundries U.S. Inc.
Inventor: Zhuojie Wu , Yusheng Bian
IPC: G02B6/42 , G02B6/122 , H04B10/079 , G02B6/12
CPC classification number: G02B6/4286 , G02B6/1228 , H04B10/07955 , G02B2006/12147 , G02B2006/12061
Abstract: Disclosed is a photonic integrated circuit (PIC) structure including a scattering light-based monitor with photodetectors (e.g., PIN and/or avalanche photodiodes) placed adjacent to one or both sides of an end portion (i.e., a coupler) of a waveguide core at an optical interface with another optical device. The photodetectors are placed in such a way as to enable sensing of scattering light emitted from the end portion as light signals are received (e.g., either from the optical device for propagation to the main body of the waveguide core or from the main body for transmission to the optical device). Also disclosed are a monitoring system and method including the PIC chip structure with the above-described scattering light-based monitor. The system and method assess the optical interface using electric signals generated by the photodetectors.
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公开(公告)号:US11852867B2
公开(公告)日:2023-12-26
申请号:US17454063
申请日:2021-11-09
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Yusheng Bian , Bo Peng , Michal Rakowski
CPC classification number: G02B6/1225 , G02B2006/1213 , G02B2006/12104
Abstract: The present disclosure generally relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to semiconductor devices having a reflector and a photonic component and a method of forming the same. The present disclosure provides a semiconductor device having a substrate, a photonic component arranged above the substrate, a bottom reflector arranged above the substrate and positioned below the photonic component, in which the bottom reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component, and a top reflector arranged above the photonic component, in which the top reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component.
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公开(公告)号:US20230408763A1
公开(公告)日:2023-12-21
申请号:US17807257
申请日:2022-06-16
Applicant: GlobalFoundries U.S. Inc.
Inventor: Zhuojie Wu , Yusheng Bian , Andreas D. Stricker
CPC classification number: G02B6/122 , G02B2006/12126 , G02B6/13
Abstract: The disclosure relates to a PIC structure including a photonic component on a semiconductor substrate. A passive optical guard is composed of a light absorbing material and is in proximity to the photonic component. The passive optical guard includes at least a portion in an active semiconductor layer of the semiconductor substrate and may be entirely below a first metal layer. The passive optical guard may include at least one of: a germanium body positioned at least partially in a silicon element in the active semiconductor layer, a silicon body having a high dopant concentration in the active semiconductor layer, and a polysilicon body having a high dopant concentration over the silicon body.
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公开(公告)号:US11841534B1
公开(公告)日:2023-12-12
申请号:US17831065
申请日:2022-06-02
Applicant: GlobalFoundries U.S. Inc.
Inventor: Adam Rosenfeld , Yusheng Bian , Francis Afzal , Bob Mulfinger
CPC classification number: G02B6/124 , G02B6/1223 , G02B6/13 , G02B2006/12061 , G02B2006/12107
Abstract: Structures including a waveguide core and methods of fabricating a structure including a waveguide core. The structure comprises a substrate, a waveguide core, and a grating disposed in a vertical direction between the waveguide core and the substrate. The grating includes a first plurality of layers and a second plurality of layers that alternate in the vertical direction with the first plurality of layers. The first plurality of layers comprise a first material having a first refractive index, and the second plurality of layers comprise a second material having a second refractive index that is greater than the first refractive index.
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公开(公告)号:US11841533B2
公开(公告)日:2023-12-12
申请号:US17709841
申请日:2022-03-31
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian
CPC classification number: G02B6/12016 , G02B6/125 , G02B2006/12147
Abstract: Disclosed is a structure including a first waveguide core with a first end portion and a second waveguide core with a second end portion, which overlays and is physically separated from the first end portion. The structure includes a coupler configured for interlayer waveguide coupling. Specifically, the coupler includes an additional waveguide core stacked vertically between and physically separated from the first end portion and the second end portion. Optionally, the coupler includes multiple additional waveguide cores. The shapes of the various waveguide cores are configured in order to achieve mode matching so that optical signals pass between the first end portion of the first waveguide core and the second end portion of the second waveguide core through each additional waveguide core in sequence. Also disclosed is a structure including a crossing array implemented using couplers.
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