-
公开(公告)号:US11475238B2
公开(公告)日:2022-10-18
申请号:US16752347
申请日:2020-01-24
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Arcangelo Ranieri Bruna , Danilo Pietro Pau
IPC: G06V30/18 , G06T3/00 , G06K9/62 , H04N19/57 , G06T7/33 , G06T7/73 , G06V10/24 , G06V10/40 , G06V10/46
Abstract: An image processing system has one or more memories and image processing circuitry coupled to the one or more memories. The image processing circuitry, in operation, compares a first image to feature data in a comparison image space using a matching model. The comparing includes: unwarping keypoints in keypoint data of the first image; and comparing the unwarped keypoints and descriptor data associated with the first image to the feature data of the comparison image. The image processing circuitry determines whether the first image matches the comparison image based on the comparing.
-
公开(公告)号:US11474788B2
公开(公告)日:2022-10-18
申请号:US16890870
申请日:2020-06-02
Inventor: Nitin Chawla , Tanmoy Roy , Anuj Grover , Giuseppe Desoli
Abstract: A memory array arranged in multiple columns and rows. Computation circuits that each calculate a computation value from cell values in a corresponding column. A column multiplexer cycles through multiple data lines that each corresponds to a computation circuit. Cluster cycle management circuitry determines a number of multiplexer cycles based on a number of columns storing data of a compute cluster. A sensing circuit obtains the computation values from the computation circuits via the column multiplexer as the column multiplexer cycles through the data lines. The sensing circuit combines the obtained computation values over the determined number of multiplexer cycles. A first clock may initiate the multiplexer to cycle through its data lines for the determined number of multiplexer cycles, and a second clock may initiate each individual cycle. The multiplexer or additional circuitry may be utilized to modify the order in which data is written to the columns.
-
283.
公开(公告)号:US11474621B2
公开(公告)日:2022-10-18
申请号:US16932467
申请日:2020-07-17
Applicant: STMicroelectronics S.r.l.
Inventor: Stefano Paolo Rivolta , Federico Rizzardini , Lorenzo Bracco
IPC: G06F3/0346 , G06F3/01 , G06F3/038 , G06F3/0354
Abstract: An embodiment pointing method to generate screen-frame displacement data based on 3D-space movements of a pointing electronic device, comprises receiving a gravity vector (g), having components (gx, gy, gz) corresponding to respective projections of gravity acceleration ({right arrow over (g)}) on three axes (X, Y, Z) of a 3D reference system associated with the pointing electronic device, generated by a sensor-fusion algorithm from joint processing of an acceleration signal, indicative of acceleration acting on the pointing electronic device along the three axes, and of a gyroscope signal (Gyro), indicative of angular rate of rotation of the pointing electronic device around the three axes. The method further comprises implementing a roll-compensation of the gyroscope signal (Gyro) as a function of the gravity vector (g) to determine a roll-compensated gyroscope signal (Gyro′); and generating the screen-frame displacement data based on the roll-compensated gyroscope signal (Gyro′).
-
公开(公告)号:US11471084B2
公开(公告)日:2022-10-18
申请号:US16729879
申请日:2019-12-30
Applicant: STMicroelectronics S.r.l.
Inventor: Francesco Rundo , Francesca Trenta , Sabrina Conoci , Sebastiano Battiato
IPC: G01C22/00 , A61B5/18 , B60W60/00 , A61B5/024 , A61B5/0255 , A61B5/00 , B60W40/08 , B60W50/14 , G06N3/04 , G06N3/08 , G06V20/59 , G06V40/16 , G06K9/62
Abstract: A method includes receiving a video signal that comprises a time series of images of a face of a human, wherein the images in the time series of images comprise a set of landmark points in the face, applying tracking processing to the video signal to reveal variations over time of at least one image parameter at the set of landmark points in the human face, generating a set of variation signals indicative of variations revealed at respective landmark points in the set of landmark points, applying processing to the set of variation signals, the processing comprising artificial neural network processing to produce a reconstructed PhotoPletysmoGraphy (PPG) signal, and estimating a heart rate variability of a variable heart rate of the human as a function of the reconstructed PPG signal.
-
285.
公开(公告)号:US20220319598A1
公开(公告)日:2022-10-06
申请号:US17697846
申请日:2022-03-17
Inventor: Roberto Bregoli , Vikas Rana
IPC: G11C16/04 , H01L27/11524 , H01L27/1156 , G11C16/10 , G11C16/14 , G11C16/26
Abstract: In an embodiment a non-volatile memory cell includes a substrate, a first body in the substrate, a second body in the substrate, a first storage transistor having a first conduction region and a second conduction region in the first body, the first and second conduction regions delimiting a first channel region in the first body, a first control gate region in the second body, an insulating region overlying the substrate, a single floating gate region extending on the substrate and embedded in the insulating region, the single floating gate region having a first portion on the first body and a second portion on the second body, the first portion and second portion being connected and electrically coupled, a first selection via extending through the insulating region and electrically coupling the first conduction region with a first conduction node, a second selection via extending through the insulating region and electrically coupling the second conduction region with a second conduction node and a first control via extending though the insulating region and electrically coupling the first control gate region with a first control node.
-
286.
公开(公告)号:US11463864B2
公开(公告)日:2022-10-04
申请号:US16366870
申请日:2019-03-27
Applicant: STMicroelectronics S.r.l.
Inventor: Amedeo Veneroso , Pasquale Vastano
Abstract: A method for the personalization of an integrated circuit card, includes: simulating a downloading of a single image corresponding to a fixed part of personalization data of the integrated circuit card; simulating an execution of a sequence of personalization commands for the integrated circuit card to generate a set of personalization data; combining the set of personalization data with the single image to obtain a card image comprising the fixed part of personalization data and the set of personalization data; encrypting the card image to obtain an encrypted single image; and downloading the encrypted single image in a memory of the integrated circuit card.
-
公开(公告)号:US11462086B2
公开(公告)日:2022-10-04
申请号:US17207073
申请日:2021-03-19
Applicant: STMicroelectronics S.r.l.
Inventor: Enrico Rosario Alessi , Fabio Passaniti
Abstract: In accordance with an embodiment, a detection device includes: an infrared temperature sensor configured to provide a temperature signal associated with an heat emission of at least one individual within a monitored area; an electrostatic-charge-variation sensor configured to provide a charge-variation signal indicative of a variation of electrostatic charge associated with the at least one individual; and a processing unit, coupled to the infrared temperature sensor and to the electrostatic-charge-variation sensor, the processing unit configured to detect a presence of the at least one individual within the monitored area by receiving the temperature signal and the charge-variation signal, and jointly processing the temperature signal and charge.
-
公开(公告)号:US11461257B2
公开(公告)日:2022-10-04
申请号:US17339083
申请日:2021-06-04
Applicant: STMicroelectronics S.r.l.
Inventor: Lorenzo Re Fiorentin , Giampiero Borgonovo
IPC: G06F13/28 , G06F9/46 , G06F13/37 , G06F13/372 , G06F17/14
Abstract: An embodiment circuit comprises a plurality of processing units, a plurality of data memory banks configured to store data, and a plurality of coefficient memory banks configured to store twiddle factors for fast Fourier transform processing. The processing units are configured to fetch, at each of the FFT computation stages, input data from the data memory banks with a burst read memory transaction, fetch, at each of the FFT computation cycles, different twiddle factors in a respective set of the twiddle factors from different coefficient memory banks of the coefficient memory banks, process the input data and the set of twiddle factors to generate output data, and store, at each of the FFT computation stages, the output data into the data memory banks with a burst write memory transaction.
-
公开(公告)号:US20220308615A1
公开(公告)日:2022-09-29
申请号:US17702362
申请日:2022-03-23
Applicant: STMicroelectronics S.r.l.
Inventor: Barbaro MARANO , Mario CHIRICOSTA
Abstract: A cell includes a first pair and a second pair of MOS transistors. Each of the first pair and second pair of MOS transistors have drain electrodes coupled to a respective common input node. Each of the first pair and second pair of MOS transistors includes a diode-connected MOS transistor and a latched MOS transistor. The latched MOS transistors of the first pair and second pair of MOS transistors have cross-coupled gate and drain electrodes. Source electrodes of the diode connected MOS transistors from the first pair and second pair of MOS transistors are coupled to a first current output common node to output a current to a first current collecting circuit. Source source electrodes of the latched MOS transistors of the first pair and second pair of MOS transistors are coupled to a second current output common node to output a current to a second current collecting circuit.
-
公开(公告)号:US20220293498A1
公开(公告)日:2022-09-15
申请号:US17688013
申请日:2022-03-07
Applicant: STMicroelectronics S.r.l. , STMicroelectronics, Inc.
IPC: H01L23/495 , H01L23/16 , H01L23/31 , H01L21/56
Abstract: A semiconductor device, such as a Quad-Flat No-lead (QFN) package, includes a semiconductor chip arranged on a die pad of a leadframe. The leadframe has an array of electrically-conductive leads around the die pad. The leads in the array have distal ends facing away from the die pad as well as recessed portions at an upper surface of the leads. Resilient material, such as low elasticity modulus material, is present at the upper surface of the leads and filling the recessed portions. An insulating encapsulation is molded onto the semiconductor chip. The resilient material is sandwiched between the insulating encapsulation and the distal ends of the leads. This resilient material facilitates flexibility of the leads, making them suited for reliable soldering to an insulated metal substrate.
-
-
-
-
-
-
-
-
-