Abstract:
An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers, at least one of the two optical elements being a spherical lens. The resulting optical system presents a high numerical aperture. One of the optical elements may be a refractive element formed in a material having a high index of refraction.
Abstract:
A sub-wavelength anti-reflective diffractive structure is incorporated with a base diffractive structure having a small period to form a high efficiency diffractive structure. In the high efficiency diffractive structure, the anti-reflective structure and/or the base diffractive structure are altered from their ideal solo structure to provide both the desired performance and minimize reflections.
Abstract:
A diffractive optical element (DOE) corrector for use with three different wavelengths includes a first diffractive element on a first surface of a first material, the first diffractive element diffracting a first wavelength of the three wavelengths, while directing a majority of light of second and third wavelengths of the three wavelengths into a zero-th order, and a second diffractive element on a second surface of a second material, the second material being different from the first material, the second surface being different from and in an optical path of the first surface, the second diffractive element diffracting the second wavelength, while directing a majority of light of the first and third wavelengths into a zero-th order.
Abstract:
A waveguide to waveguide monitor includes an optics block between the two waveguides. The optics block couples light between the two waveguides and includes at least two parallel surfaces. The monitor also has an optical tap which creates a monitor beam. The optics block may be flush with the endfaces of the waveguides, even if the endfaces are angled. At least two optical elements needed to couple the light between the two optical waveguides and direct the monitor beam on a detector are on the at least two parallel surfaces of the optics block and any surfaces secured thereto.
Abstract:
A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face such that the first and second light sensing elements receive light of substantially the same intensity. A dielectric region is provided at least substantially filling a space of the semiconductor region adjacent at least one of the light sensing elements. The dielectric region may include at least one light guide.
Abstract:
A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has an opening overlying at least one of first and second light sensing elements, the semiconductor region having a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face. A light-absorbing material overlies the semiconductor region within the opening above at least one of the light sensing elements such that the first and second light sensing elements receive light of substantially the same intensity.
Abstract:
A passive optical element is transferred into a substrate already having features with a vertical dimension thereon. The features may be another passive optical element, an active optical element, a dichroic layer, a dielectric layer, alignment features, metal portions. A protective layer is provided over the feature during the transfer of the optical element. One or more of these processes may be performed on a wafer level.
Abstract:
A diffractive coupler coupling light between an opto-electronic element and a waveguide minimizes variation in coupling over an offset range, while providing good coupling efficiency. The offset range may be along the optical axis and/or radial. The diffractive coupler has a long depth of field and no best focus.
Abstract:
A thin camera having sub-pixel resolution includes an array of micro-cameras. Each micro-camera includes a lens, a plurality of sensors of size p, and a plurality of macro-pixels of size d having a feature of size q. The feature size q smaller than p and provides a resolution for the micro-camera greater than p. The smallest feature in the micro-cameras determines the resolution of the thin camera. Each macro-pixel may have any array of m features of size q, where q=d/m. Additional micro-cameras may be included to increase power.
Abstract:
An optical element may include a first diffractive structure having a radially symmetric amplitude function and a second diffractive structure having a phase function. The second diffractive structure may serve as a vortex lens. A system employing the optical element may include a light source and/or a detector.