公开(公告)号：US6162590A

公开(公告)日：2000-12-19

申请号：US59778

申请日：1998-04-13

Applicant: Barry Block ,  Arnold Thornton ,  Walter Daschner

Inventor： Barry Block ,  Arnold Thornton ,  Walter Daschner

IPC: G02B3/08 ,  G02B5/18 ,  G03F1/00 ,  G03F7/00 ,  G03F7/004 ,  G11B7/12 ,  G11B7/135 ,  G11B7/1353 ,  G11B7/1372 ,  G11B7/22 ,  G11B11/105

CPC classification number: G11B7/1353 ,  G02B5/1857 ,  G03F7/0007 ,  G03F7/001 ,  G03F7/0043 ,  G11B7/122 ,  G11B7/1372 ,  G11B7/22 ,  G11B11/10532 ,  G11B11/10554 ,  G11B11/1058

Abstract: A method for forming a novel head used in magneto-optic or optical disks comprises the steps of forming a diffractive lens on one side of a glass substrate and forming air bearing surface rails on a second side of said glass substrate. The glass substrate is then cut into separate heads. In this way, many magneto-optic or optical heads can be formed simultaneously without incurring the expense of bonding lenses onto a slider. In one embodiment, coils are deposited on the substrate to generate a magnetic field during magneto-optic write operations. In another embodiment, a glass wafer having diffractive lenses formed thereon is bonded to a silicon spacer structure. The glass lenses are used to define a waveguide structure on a transparent layer on the bottom of the silicon spacer

Abstract translation: 用于形成用于磁光或光盘的新型头的方法包括以下步骤：在玻璃基板的一侧上形成衍射透镜，并在所述玻璃基板的第二面上形成空气轴承表面轨。 然后将玻璃基板切成单独的头。 以这种方式，可以同时形成许多磁光或光学头，而不会导致将透镜粘合到滑块上的费用。 在一个实施例中，线圈被沉积在衬底上以在磁光写入操作期间产生磁场。 在另一个实施例中，其上形成有衍射透镜的玻璃晶片被结合到硅间隔物结构。 玻璃透镜用于在硅间隔物的底部上的透明层上限定波导结构

公开(公告)号：US5619177A

公开(公告)日：1997-04-08

申请号：US381681

申请日：1995-01-27

Applicant: A. David Johnson ,  Barry Block ,  Philip Mauger

Inventor： A. David Johnson ,  Barry Block ,  Philip Mauger

IPC: H01H1/00 ,  H01H59/00 ,  H01H61/01 ,  H01H61/06

CPC classification number: H01H59/0009 ,  H01H61/0107 ,  G11C23/00 ,  H01H1/0036 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2059/0081 ,  H01H2061/006

Abstract: A microactuator and method of operation is disclosed for use in actuating valves, electrical contacts, light beams, sensors and other elements between different actuation modes. An actuator member comprised of a shape memory alloy layer is mounted on an elastic substrate, and the proximal end of the actuator member is carried by a base. The shape memory alloy material is heated through its phase change transition temperature so that it deforms by changing volume to bend the distal end of the actuator member in a first direction relative to the base. Stress forces in the substrate oppose the bending movement, and when the shape change layer is cooled below the transition temperature the stress forces move the distal in a second direction which returns the shape change layer to its low temperature shape. Electrostatic forces are selectively applied between the actuator member and base for clamping the actuator member in one of its positions. In another embodiment a bistable actuator is provided in which the actuator member can be operated between two stable positions.

Abstract translation: 公开了一种微致动器和操作方法，用于在不同致动模式之间致动阀，电触点，光束，传感器和其他元件。 由形状记忆合金层构成的致动器构件安装在弹性基板上，致动器构件的基端由基座承载。 形状记忆合金材料通过其相变转变温度加热，使得其通过改变体积而变形，以使致动器构件的远端相对于基部沿第一方向弯曲。 衬底中的应力作用与弯曲运动相反，当形状变化层被冷却到转变温度以下时，应力将第二个方向移动到远端，使第二个方向返回到其低温形状。 静电力被选择性地施加在致动器构件和底座之间，以将致动器构件夹紧在其位置之一中。 在另一个实施例中，提供双稳态致动器，其中致动器构件可以在两个稳定位置之间操作。

公开(公告)号：US4996627A

公开(公告)日：1991-02-26

申请号：US304344

申请日：1989-01-30

Applicant: Arthur R. Zias ,  Barry Block ,  Kenneth W. Mapes ,  Norman L. Nystrom ,  Robert M. Cadwell

Inventor： Arthur R. Zias ,  Barry Block ,  Kenneth W. Mapes ,  Norman L. Nystrom ,  Robert M. Cadwell

IPC: G01L9/04 ,  B81B3/00 ,  B81C1/00 ,  G01L9/00 ,  H01L29/84

CPC classification number: G01L9/0073 ,  G01L9/0042

Abstract: A miniature transducer having an ultrathin tensioned silicon diaphragm so as to be responsive to extremely small changes in pressure. A silicon wafer is masked to define diaphragm areas, and etched to form a setback or capacitor gap a predefined depth. The mask is removed, and the entire silicon wafer is etched a second time to achieve the desired diaphragm thickness. The first and second etches are carried out independently, and thus the capacitor gap and diaphragm thickness can be independently formed. Mask and metallizing steps are carried out on glass wafers, and sandwiched around the processed semiconductor wafer, whereupon a large number of the miniature transducers are fabricated simultaneously. Unique patterning, etching and metallizing steps carried out on the sandwich structure allow a number of quadrature unit cells to be formed, thereby maximizing the area of the semiconductor and glass structures. By proper selection of materials, the diaphragm is tensioned during the fabrication of the transducer structures.

公开(公告)号：US4633578A

公开(公告)日：1987-01-06

申请号：US556800

申请日：1983-12-01

Applicant: Harry E. Aine ,  Barry Block

Inventor： Harry E. Aine ,  Barry Block

IPC: G01F1/684 ,  G01F1/696 ,  G01F7/00 ,  H01C17/06 ,  G01F1/68

CPC classification number: G01F1/684 ,  G01F1/6845 ,  G01F1/6847 ,  G01F1/696 ,  G01F7/00 ,  Y10T29/49085 ,  Y10T29/49099

Abstract: Miniature thermal fluid flow sensors of the airfoil type are made in batch form by forming the thermal fluid flow sensors on a thin sheet of material and bonding the sheet over an array of duct structures and dicing the individual sensors and duct structures apart. In another embodiment, thin carrier sheet portions of a wafer bearing the thermal fluid flow sensors of the airfoil or grid type are supported by surrounding frame portions of the wafer. The wafer is diced to separate the individual sensing chips. The respective chips are mounted across respective fluid flow ducts. For the airfoil type sensor, portions of the frame are broken away for undisturbed flow over the thin carrier and sensor. In one thermal flow sensor configuration, a flow heater is disposed in between first and second thermal flow sensors in heat exchanging relation therewith. A third thermal flow sensor is disposed upstream of the others out of heat exchanging relation with the heater for operation of the heater at a certain temperature above that sensed by the third sensor. In the low flow regime, flow is measured by the difference between the outputs of the first and second sensors, whereas in the high flow regime, the power required to maintain the temperature of the heater serves as a measure of the flow.

Abstract translation: 通过在薄片材料上形成热流体流量传感器并将片材粘合在管道结构阵列上并将各个传感器和管道结构分开切割，从而以分批形式制造翼型的微型热流体流量传感器。 在另一个实施例中，承载翼型或格栅型热流体流量传感器的晶片的薄载体片部分由晶片的周围框架部分支撑。 切割晶片以分离各个感测芯片。 相应的芯片安装在相应的流体流动管道上。 对于翼型传感器，框架的部分被分离，以便在薄的载体和传感器上不受干扰地流动。 在一个热流传感器构造中，流动加热器设置在与其热交换关系的第一和第二热流传感器之间。 第三热流传感器设置在与加热器的热交换关系之外的其他热流传感器的上游，以在高于由第三传感器感测的温度的一定温度下操作加热器。 在低流量状态下，通过第一和第二传感器的输出之间的差异测量流量，而在高流量状态下，维持加热器温度所需的功率用作流量的度量。

公开(公告)号：US4071838A

公开(公告)日：1978-01-31

申请号：US656632

申请日：1976-02-09

Applicant: Barry Block

Inventor： Barry Block

IPC: H01L29/84 ,  G01P15/08 ,  G01P15/12 ,  H01L41/02 ,  H04R23/00

CPC classification number: H04R23/006 ,  G01P15/0802 ,  G01P15/123 ,  H01L29/84 ,  Y10T29/49002 ,  Y10T29/49103

Abstract: Solid state folded leaf spring force transducers are fabricated by batch photolithographic and etching techniques from a monocrystalline material, such as silicon. The folded leaf spring structure includes elongated gaps separating adjacent leaf spring leg portions, such elongated gaps being oriented parallel to a crystallographic axis of the monocrystalline material. In a preferred embodiment the monocrystalline material is of diamond cubic type and the leaf spring gaps extend in mutually orthogonal directions parallel to the and crystallographic axes, respectively. In a preferred method of fabricating the spring structure, the structure is etched from a monocrystalline wafer by means of an anisotropic etchant so as to more precisely define angles and dimensions of the resultant spring structure. In one embodiment, the gaps between adjacent leg portions of the spring structure are sealed in a fluid tight manner by means of oxide membranes left intact upon etching of the spring structure. In an accelerometer embodiment, sensing masses of equal weight are affixed to opposite sides of the spring structure for dynamically balancing same.

Abstract translation: 固体折叠板弹簧力传感器通过从诸如硅的单晶材料的分批光刻和蚀刻技术制造。 折叠的板簧结构包括分隔相邻的板簧部分的细长间隙，这些细长的间隙平行于单晶材料的结晶轴取向。 在优选实施例中，单晶材料是金刚石立方体，并且片簧间隙分别在平行于<011>和<011>晶轴的相互正交的方向上延伸。 在制造弹簧结构的优选方法中，通过各向异性蚀刻剂从单晶晶片蚀刻该结构，从而更准确地限定所得到的弹簧结构的角度和尺寸。 在一个实施例中，弹簧结构的相邻腿部之间的间隙通过在蚀刻弹簧结构时保持完整的氧化物膜以流体密封的方式密封。 在加速度计实施例中，相同重量的感测质量被固定在弹簧结构的相对侧上，用于动态平衡它们。