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公开(公告)号：US20100123552A1
公开(公告)日：2010-05-20
申请号：US12313403
申请日：2008-11-20
IPC分类号： H04Q5/22
CPC分类号： B60R25/00 , H04Q2213/13095
摘要： A system for and method by which persons associated with a vehicle are notified of the towing of that vehicle.
摘要翻译： 通知车辆相关人员的系统和方法，以便该车辆的牵引。
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公开(公告)号：US20080051493A1
公开(公告)日：2008-02-28
申请号：US11895330
申请日：2007-08-24
IPC分类号： C08L101/00 , B05D1/00
CPC分类号： B05D3/00 , A01N59/16 , A01N59/20 , B05D2401/32 , C09D5/033 , C09D5/14 , Y10T428/2998 , Y10T428/31678 , A01N25/10 , A01N25/24 , A01N2300/00
摘要： An improved method for fixedly coating powder coating prepolymer and/or polymer particles with microparticles of solid, heat absorbing polymer additive materials, especially antimicrobial additive materials.
摘要翻译： 一种改进的固体涂覆预聚物和/或聚合物颗粒与固体，吸热聚合物添加剂材料，特别是抗微生物添加剂材料的微粒的方法。
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公开(公告)号：US07357949B2
公开(公告)日：2008-04-15
申请号：US10032372
申请日：2001-12-21
摘要： The invention relates to a microcapsule comprising an inorganic antimicrobial agent coated with a hydrophilic polymer. The hydrophilic polymer is able to absorb sufficient water as to enable the action of the encapsulated antimicrobial agent. These microcapsules are useful to impart antimicrobial activity and can be used in polymer compositions, sprays and coatings. A method of preparing the microcapsule by treatment of the antimicrobial agent with a solution of the hydrophilic polymer is provided. Another embodiment of the invention is a method of preparing the microcapsule by coating of the antimicrobial agent with a polymer precursor followed by treatment with a reactive ingredient. Another embodiment of the invention is a method of preparing the microcapsule by melt compounding the antimicrobial agent with the hydrophilic polymer followed by grinding to the desired particle size. Polymer compositions comprising the microcapsules and a matrix polymer are also provided. Another embodiment of the invention is an article prepared from the polymer compositions comprising the microcapsules and a matrix polymer.
摘要翻译： 本发明涉及包含用亲水性聚合物涂覆的无机抗微生物剂的微胶囊。 亲水性聚合物能够吸收足够的水以使得能够包封的抗微生物剂的作用。 这些微胶囊可用于赋予抗微生物活性，并可用于聚合物组合物，喷雾剂和涂料。 提供了通过用亲水性聚合物溶液处理抗微生物剂来制备微胶囊的方法。 本发明的另一个实施方案是通过用聚合物前体涂覆抗微生物剂然后用活性成分处理来制备微胶囊的方法。 本发明的另一个实施方案是通过将抗微生物剂与亲水性聚合物熔融混合，然后研磨成所需的粒度来制备微胶囊的方法。 还提供了包含微胶囊和基质聚合物的聚合物组合物。 本发明的另一个实施方案是由包含微胶囊和基质聚合物的聚合物组合物制备的制品。
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24.发明授权公开(公告)号：US06402876B1
公开(公告)日：2002-06-11
申请号：US09515687
申请日：2000-02-29
IPC分类号： B32B3100
CPC分类号： H01R4/04 , G03F7/34 , H01L2224/293 , H01L2924/01019 , H01L2924/01079 , H01L2924/10253 , H05K3/323 , H05K2201/083 , H05K2201/09945 , H05K2203/0769 , H05K2203/104 , H01L2924/00
摘要： The present invention provides a number of interrelated methods for the production of random and ordered arrays of particles and recesses, as well as films containing such arrays and recesses. The present invention also relates to the random and ordered arrays of particles and films prepared therefrom. The ordered arrays are obtained by the use of ferrofluid compositions which may be curable, solidifiable or non-curing/non-solidifiable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between leads or pads.
摘要翻译： 本发明提供了用于生产随机和有序阵列的颗粒和凹部的许多相互关联的方法，以及包含这种阵列和凹陷的膜。 本发明还涉及由其制备的颗粒和膜的随机和有序阵列。 有序阵列通过使用可固化，可固化或不固化/不可固化的铁磁流体组合物获得。 阵列和膜可以包含用于电子应用中用于实现引线或焊盘之间的接触的导电颗粒。
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公开(公告)号：US5916641A
公开(公告)日：1999-06-29
申请号：US693833
申请日：1996-08-01
IPC分类号： G03F7/038 , B32B27/04 , C09J7/00 , C09J9/02 , C09J11/04 , C09J201/00 , G03F7/34 , G03F7/40 , H01R4/04 , H01R11/01 , H01R43/00 , H05K3/32 , H01F1/00 , H01B1/06 , H01F1/28 , H01F10/10
CPC分类号： H05K3/323 , G03F7/34 , H01R4/04 , H01L2224/293 , H01L2924/01019 , H01L2924/01079 , H01L2924/07811 , H01L2924/10253 , H05K2201/083 , H05K2201/09945 , H05K2203/0769 , H05K2203/104
摘要： The present invention provides for a number of interrelated methods for the production of random and ordered arrays of particles as well as films containing the same. In another aspect, the present invention relates to the random and ordered arrays of particles and films prepared therefrom. The ordered arrays are obtained by the use of ferrofluid compositions which may be curable, solidifiable or non-curing/non-solidifiable. Especially preferred arrays and films contain electrically conductive particles for use in electronic applications for effecting contact between leads or pads.
摘要翻译： 本发明提供了用于生产随机和有序排列的颗粒的多种相互关联的方法以及含有它们的膜。 另一方面，本发明涉及由其制备的颗粒和膜的随机和有序阵列。 有序阵列通过使用可固化，可固化或不固化/不可固化的铁磁流体组合物获得。 特别优选的阵列和膜包含用于电子应用中的导电颗粒，用于实现引线或焊盘之间的接触。
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公开(公告)号：US5141970A
公开(公告)日：1992-08-25
申请号：US625574
申请日：1990-12-10
IPC分类号： C08F10/14 , C08F2/46 , C08F2/48 , C08F12/00 , C08F12/24 , C08F12/34 , C08F16/12 , C08F16/22 , C08F16/32 , C08F212/00 , C08F290/00 , C08F290/06 , C08F299/02 , C08J3/24 , C08L31/02 , C08L57/00
摘要： A method of forming high-temperature resistant polymers by a 2 step curing process comprising(a) curing a polymerizable composition at least one aromatic compound having alpha and/or beta instruction which is not substantially reactive under the curing condition of step a, particularly allyl or properyl, and(b) heating the cured composition of step a in the presence of acid to form a crosslinked resin.
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