Circuit arrangement, switching module comprising said circuit arrangement and use of switching module
    27.
    发明申请
    Circuit arrangement, switching module comprising said circuit arrangement and use of switching module 审中-公开
    电路布置,开关模块,包括所述电路装置和开关模块的使用

    公开(公告)号:US20050059371A1

    公开(公告)日:2005-03-17

    申请号:US10490753

    申请日:2002-09-30

    CPC classification number: H01Q1/50 H04B1/18 H04B1/48

    Abstract: The invention relates to a circuit array with an antenna input (1), a signal input (2) and a signal output (3), a switch unit (4), in which the antenna input (1) is connected to a first protective device (6) against electrostatic discharges, wherein the first protective device (6) has an antenna input (111) and a switch output (112), which are connected to one another by a line (113), and in which a voltage-limiting element (114) is connected to a ground (8) in parallel to the line (113). The advantage of the circuit array of the invention is that the protective device (6) has a low insertion loss. The invention also relates to a circuit module as well as the use of the circuit module as a front-end module.

    Abstract translation: 本发明涉及一种具有天线输入(1),信号输入(2)和信号输出(3),开关单元(4)的电路阵列,其中天线输入(1)连接到第一保护 装置(6),其中所述第一保护装置(6)具有通过线(113)彼此连接的天线输入(111)和开关输出(112),并且其中, 限制元件(114)连接到与线路(113)平行的接地(8)。 本发明的电路阵列的优点在于保护装置(6)具有低插入损耗。 本发明还涉及电路模块以及电路模块作为前端模块的使用。

    Circuit, switching module comprising the same, and use of said switching module
    28.
    发明申请
    Circuit, switching module comprising the same, and use of said switching module 有权
    电路,包括该电路的开关模块,以及所述开关模块的使用

    公开(公告)号:US20050059358A1

    公开(公告)日:2005-03-17

    申请号:US10490930

    申请日:2002-09-27

    CPC classification number: H04B1/18 H01Q1/50 H04B1/48

    Abstract: The invention relates to a circuit array with an antenna input (1), a signal input (2) and a signal output (3), a switch unit (4), in which the antenna input (1) is connected to a first protective device (6) against electrostatic discharges, wherein the first5 protective device (6) is a band-pass filter in a π configuration. An advantage of the first protective device (6) is that when it is used in a mobile telephone, a band-pass filter in the front-end module can be omitted. In addition, the band-pass filter has very favorable filtering characteristics, so that ESD-related interference can be effectively suppressed. The invention also relates to a circuit module and the use of the circuit module.

    Abstract translation: 本发明涉及一种具有天线输入(1),信号输入(2)和信号输出(3),开关单元(4)的电路阵列,其中天线输入(1)连接到第一保护 装置(6),其防止静电放电,其中所述第一保护装置(6)是pi配置的带通滤波器。 第一保护装置(6)的优点在于,当在移动电话中使用时,可以省略前端模块中的带通滤波器。 此外,带通滤波器具有非常好的滤波特性,从而可以有效地抑制ESD相关干扰。 本发明还涉及电路模块和电路模块的用途。

    Method for producing a multilayer ceramic component
    30.
    发明授权
    Method for producing a multilayer ceramic component 有权
    多层陶瓷部件的制造方法

    公开(公告)号:US08776364B2

    公开(公告)日:2014-07-15

    申请号:US12415371

    申请日:2009-03-31

    Abstract: A multilayer ceramic component includes a stack containing ceramic layers and electrode layers interspersed among the ceramic layers. The electrode layers contain copper and define first and second internal electrodes. First and second external contacts are on different sides of the stack. The first and second external contacts contain copper and are substantially perpendicular to the ceramic layers and electrode layers. The first internal electrode is connected to the first external contact and the second internal electrode is connected to the second external contact. The first and second internal electrodes overlap each other at a plane intersecting the stack. In areas adjacent to boundaries between the first and second external contacts and the ceramic layers, the first and second external contacts are not oxidized and material making-up the ceramic layers is not diminished. A bonding strength of the external contacts to the stack exceeds 50 N.

    Abstract translation: 多层陶瓷部件包括层叠陶瓷层和散布在陶瓷层之间的电极层。 电极层含有铜并限定第一和第二内部电极。 第一和第二外部触点位于堆叠的不同侧面。 第一和第二外部触点包含铜并且基本上垂直于陶瓷层和电极层。 第一内部电极连接到第一外部触点,第二内部电极连接到第二外部触点。 第一和第二内部电极在与堆叠相交的平面处彼此重叠。 在与第一和第二外部触点和陶瓷层之间的边界相邻的区域中,第一和第二外部触点不被氧化,并且陶瓷层的材料补充不会减弱。 外部触点与叠层的接合强度超过50N。

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