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    Clad alloy substrates and method for making same
    3.
    发明授权
    Clad alloy substrates and method for making same 失效
    包覆合金基材及其制备方法

    公开(公告)号：US08387228B2

    公开(公告)日：2013-03-05

    申请号：US10865060

    申请日：2004-06-10

    Applicant: David S. Bergstrom ,  Kris J. Schott ,  Mark A. Tarhay

    Inventor： David S. Bergstrom ,  Kris J. Schott ,  Mark A. Tarhay

    IPC: B23P11/00 ,  B32B15/01 ,  B32B15/00

    CPC classification number: B23P11/00 ,  B23K20/04 ,  B23K20/227 ,  B23K33/00 ,  B23K2103/16 ,  B23K2103/172 ,  Y10S29/904 ,  Y10T29/49366 ,  Y10T29/49908 ,  Y10T29/49924 ,  Y10T29/49936 ,  Y10T428/12264 ,  Y10T428/12486 ,  Y10T428/12493 ,  Y10T428/12507 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12951

    Abstract: A method for producing a single-clad or multiple-clad product includes providing a welded assembly comprising a cladding material disposed on a substrate material. Both the substrate material and the cladding material are individually selected alloys. At least a first edge of the cladding material of the welded assembly does not extend to a first edge of the substrate material and thereby provides a margin between the first edges. A material that is an alloy having hot strength greater than the cladding material is within the margin and adjacent the first edge of the cladding material. The welded assembly is hot rolled to provide a hot rolled band, and the material within the margin inhibits the cladding material from spreading beyond the edge of the substrate material during the hot rolling. In certain embodiments of the methods, the substrate material is stainless steel and the cladding material is nickel or a nickel alloy.

    Abstract translation: 一种制造单包层或多层包覆产品的方法包括提供一种焊接组件，其包括设置在基底材料上的覆层材料。 基板材料和包层材料都是单独选择的合金。 焊接组件的包覆材料的至少第一边缘不延伸到衬底材料的第一边缘，从而在第一边缘之间提供边缘。 作为具有比包覆材料大的热强度的合金的材料在包层材料的第一边缘内的边缘内。 焊接组件被热轧以提供热轧带材，并且边缘内的材料在热轧期间抑制包层材料扩散到基材材料的边缘之外。 在该方法的某些实施方案中，基底材料是不锈钢，包层材料是镍或镍合金。

    Plated article having metal thin film formed by electroless plating, and manufacturing method thereof
    5.
    发明授权
    Plated article having metal thin film formed by electroless plating, and manufacturing method thereof 有权
    具有通过无电镀形成的金属薄膜的电镀制品及其制造方法

    公开(公告)号：US08163400B2

    公开(公告)日：2012-04-24

    申请号：US12311207

    申请日：2008-07-18

    Applicant: Atsushi Yabe ,  Junichi Ito ,  Yoshiyuki Hisumi ,  Junnosuke Sekiguchi ,  Toru Imori

    Inventor： Atsushi Yabe ,  Junichi Ito ,  Yoshiyuki Hisumi ,  Junnosuke Sekiguchi ,  Toru Imori

    IPC: H01L29/00 ,  H05K3/00

    CPC classification number: H01L21/76843 ,  C23C14/165 ,  C23C14/584 ,  C23C18/1879 ,  C23C18/31 ,  C23C18/54 ,  H01L21/288 ,  H01L21/76873 ,  H01L21/76874 ,  H01L23/53238 ,  H01L2221/1089 ,  H01L2924/0002 ,  Y10T428/12493 ,  Y10T428/12507 ,  Y10T428/12514 ,  Y10T428/24917 ,  H01L2924/00

    Abstract: The present invention provides a plated article that has a thin seed layer having a uniform thickness, formed by electroless plating and allowing formation of ultrafine wiring, and that avoids the complicated formation of a bilayer of a barrier layer and a catalytic metal layer prior to forming the seed layer. The present invention also provides a method for manufacturing the plated article. The plated article has an alloy thin film formed on a substrate and containing a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5at% to 40at% of the metal (A). The metal thin film formed by electroless displacement and reduction plating is a metal thin film having a thickness no greater than 10 nm and a resistivity no greater than 10 μΩ·cm. Preferably, the metal (B) has a barrier function with respect to a metal of the metal thin film.

    Abstract translation: 本发明提供一种电镀制品，其具有通过无电镀形成的具有均匀厚度的薄种子层，并且允许形成超细布线，并且避免在形成之前形成阻挡层和催化金属层的双层 种子层。 本发明还提供一种制造电镀制品的方法。 电镀制品具有在基板上形成的含有用于无电镀的催化活性金属（A）和能够用化学镀溶液中含有的金属离子进行置换镀覆的金属（B）的合金薄膜，以及金属薄膜 通过无电位移和还原电镀在合金薄膜上形成薄膜。 催化活性金属（A）的合金薄膜和能够移位镀的金属（B）具有包含金属（A）的5原子％至40原子％的组成。 通过无电解位移和还原电镀形成的金属薄膜是厚度不大于10nm，电阻率不大于10μΩ·cm·cm的金属薄膜。 优选地，金属（B）相对于金属薄膜的金属具有阻挡功能。

    Selective application of conductive material to substrates by pick and place of compliant contact arrays
    10.
    发明申请
    Selective application of conductive material to substrates by pick and place of compliant contact arrays 失效
    通过拾取和放置柔性接触阵列，将导电材料选择性地应用于基板

    公开(公告)号：US20060128176A1

    公开(公告)日：2006-06-15

    申请号：US11349285

    申请日：2006-02-06

    Applicant: Morgan Johnson

    Inventor： Morgan Johnson

    IPC: H01R12/00

    CPC classification number: H05K3/4015 ,  H05K3/027 ,  H05K3/341 ,  H05K2203/0191 ,  H05K2203/0769 ,  H05K2203/0786 ,  Y10T428/12493 ,  Y10T428/12507 ,  Y10T428/12514

    Abstract: Application of a conductive material with a compliant underlayer onto selected pads of a substrate, includes forming at least one padstack, by patterning a sheet including a stack of material layers. Padstacks may include a first conductive top layer, one or more underlying layers, and a bottom attachment layer, such as a solder layer. At least one flexible, or compliant, layer is disposed in the sheet between the top and attachment layers. The compliant layer may be a conductive elastomer. The top layer of the padstacks are adhered to a soluble tape, and this composite structure is moved into place over the circuit board by means of a pick and place operation. The placement of the padstacks is followed by a solder reflow to adhere the padstacks to the contact pads of the substrate, and by a wash cycle with a solvent to remove the soluble tape.

    Abstract translation: 将具有柔顺底层的导电材料施加到衬底的选定焊盘上，包括通过图案化包括一叠材料层的片材来形成至少一个衬垫堆叠。 垫片可以包括第一导电顶层，一个或多个下层和底部附着层，例如焊料层。 在顶部和附着层之间的片材中设置至少一个柔性或柔顺层。 柔性层可以是导电弹性体。 衬垫的顶层粘附到可溶性胶带上，并且通过拾取和放置操作将该复合结构移动到电路板上的适当位置。 焊盘的放置之后是焊料回流，以将焊盘粘附到衬底的接触焊盘，并且通过用溶剂洗涤循环以除去可溶性带。

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